Asia Pacific Advanced Packaging Market 2021-2031 by Product Type (Active Packaging, Smart and Intelligent Packaging), Packaging Platform (Flip-Chip Ball Grid Array, Flip Chip CSP, Wafer Level CSP, 2.5D/3D IC, Fo-WLP, Embedded Die, Fi-WLP), End User (Consumer Electronics, IT and Telecom, Automotive and Transportation, Industrial Sector), and Country: Trend Forecast and Growth Opportunity
- GRA4806325
- 97 Pages
- January 2022
- Materials and Chemicals
Highlighted with 27 tables and 41 figures, this 97-page report “Asia Pacific Advanced Packaging Market 2021-2031 by Product Type (Active Packaging, Smart and Intelligent Packaging), Packaging Platform (Flip-Chip Ball Grid Array, Flip Chip CSP, Wafer Level CSP, 2.5D/3D IC, Fo-WLP, Embedded Die, Fi-WLP), End User (Consumer Electronics, IT and Telecom, Automotive and Transportation, Industrial Sector), and Country: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire Asia Pacific advanced packaging market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2018-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
In-depth qualitative analyses include identification and investigation of the following aspects:
• Market Structure
• Growth Drivers
• Restraints and Challenges
• Emerging Product Trends & Market Opportunities
• Porter’s Fiver Forces
The trend and outlook of Asia Pacific market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19. The balanced (most likely) projection is used to quantify Asia Pacific advanced packaging market in every aspect of the classification from perspectives of Product Type, Packaging Platform, End User, and Country.
Based on Product Type, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Active Packaging
• Smart and Intelligent Packaging
Based on Packaging Platform, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Flip-Chip Ball Grid Array
• Flip Chip CSP
• Wafer Level CSP
• 2.5D/3D Integrated Circuit
• Fan Out Wafer Level Package (Fo-WLP)
• Embedded Die
• Fan In Wafer Level Package (Fi-WLP)
• Other Packaging Platforms
By End User, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Consumer Electronics
• IT and Telecom
• Automotive and Transportation
• Industrial Sector
• Healthcare and Life Science
• Aerospace and Defense
• Other End Users
Geographically, the following national/local markets are fully investigated:
• Japan
• China
• South Korea
• Australia
• India
• Rest of APAC (further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, Taiwan, and Philippines)
For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of the regional market by country and split of key national markets by Product Type, Packaging Platform, and End User over the forecast years are also included.
The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.
Selected Key Players:
Advanced Semiconductor Engineering Inc.
Amkor Technology, Inc.
Brewer Science, Inc.
Chipbond Technology Corporation
Intel Corporation
International Business Machines Corporation (IBM)
Microchip Technology, Inc.
Qualcomm Technologies, Inc.
Renesas Electronics Corporation
Samsung Electronics Co., Ltd.
STATS ChipPAC Pte. Ltd
SÜSS Microtec Se
Taiwan Semiconductor Manufacturing Company, Limited
Texas Instruments, Inc.
Universal Instruments Corporation
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
1.1 Industry Definition and Research Scope 7
1.1.1 Industry Definition 7
1.1.2 Research Scope 8
1.2 Research Methodology 11
1.2.1 Overview of Market Research Methodology 11
1.2.2 Market Assumption 12
1.2.3 Secondary Data 12
1.2.4 Primary Data 12
1.2.5 Data Filtration and Model Design 13
1.2.6 Market Size/Share Estimation 14
1.2.7 Research Limitations 15
1.3 Executive Summary 16
2 Market Overview and Dynamics 19
2.1 Market Size and Forecast 19
2.1.1 Impact of COVID-19 on World Economy 20
2.1.2 Impact of COVID-19 on the Market 22
2.2 Major Growth Drivers 24
2.3 Market Restraints and Challenges 27
2.4 Emerging Opportunities and Market Trends 30
2.5 Porter’s Fiver Forces Analysis 34
3 Segmentation of Asia Pacific Market by Product Type 38
3.1 Market Overview by Product Type 38
3.2 Active Packaging 40
3.3 Smart and Intelligent Packaging 41
4 Segmentation of Asia Pacific Market by Packaging Platform 42
4.1 Market Overview by Packaging Platform 42
4.2 Flip-Chip Ball Grid Array 44
4.3 Flip Chip CSP 45
4.4 Wafer Level CSP 46
4.5 2.5D/3D Integrated Circuit 47
4.6 Fan Out Wafer Level Package (Fo-WLP) 48
4.7 Embedded Die 49
4.8 Fan In Wafer Level Package (Fi-WLP) 50
4.9 Other Packaging Platforms 51
5 Segmentation of Asia Pacific Market by End User 52
5.1 Market Overview by End User 52
5.2 Consumer Electronics 54
5.3 IT and Telecom 55
5.4 Automotive and Transportation 56
5.5 Industrial Sector 57
5.6 Healthcare and Life Science 58
5.7 Aerospace and Defense 59
5.8 Other End Users 60
6 Asia-Pacific Market 2021-2031 by Country 61
6.1 Overview of Asia-Pacific Market 61
6.2 Japan 64
6.3 China 67
6.4 Australia 69
6.5 India 71
6.6 South Korea 73
6.7 Rest of APAC Region 75
7 Competitive Landscape 77
7.1 Overview of Key Vendors 77
7.2 New Product Launch, Partnership, Investment, and M&A 80
7.3 Company Profiles 81
Advanced Semiconductor Engineering Inc. 81
Amkor Technology, Inc. 83
Brewer Science, Inc. 84
Chipbond Technology Corporation 85
Intel Corporation 86
International Business Machines Corporation (IBM) 87
Microchip Technology, Inc. 88
Qualcomm Technologies, Inc. 89
Renesas Electronics Corporation 90
Samsung Electronics Co., Ltd. 91
STATS ChipPAC Pte. Ltd 92
SÜSS Microtec Se 93
Taiwan Semiconductor Manufacturing Company, Limited 94
Texas Instruments, Inc. 95
Universal Instruments Corporation 96
RELATED REPORTS 97
Table 1. Snapshot of Asia Pacific Advanced Packaging Market in Balanced Perspective, 2021-2031 17
Table 2. World Economic Outlook, 2021-2031 21
Table 3. World Electrical and Electronics Market, 2021-2031, $ bn 26
Table 4. Main Product Trends and Market Opportunities in Asia Pacific Advanced Packaging Market 30
Table 5. Asia Pacific Advanced Packaging Market by Product Type, 2021-2031, $ mn 38
Table 6. Asia Pacific Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 42
Table 7. Asia Pacific Advanced Packaging Market by End User, 2021-2031, $ mn 52
Table 8. APAC Advanced Packaging Market by Country, 2021-2031, $ mn 62
Table 9. Japan Advanced Packaging Market by Product Type, 2021-2031, $ mn 66
Table 10. Japan Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 66
Table 11. Japan Advanced Packaging Market by End User, 2021-2031, $ mn 66
Table 12. China Advanced Packaging Market by Product Type, 2021-2031, $ mn 68
Table 13. China Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 68
Table 14. China Advanced Packaging Market by End User, 2021-2031, $ mn 68
Table 15. Australia Advanced Packaging Market by Product Type, 2021-2031, $ mn 70
Table 16. Australia Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 70
Table 17. Australia Advanced Packaging Market by End User, 2021-2031, $ mn 70
Table 18. India Advanced Packaging Market by Product Type, 2021-2031, $ mn 72
Table 19. India Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 72
Table 20. India Advanced Packaging Market by End User, 2021-2031, $ mn 72
Table 21. South Korea Advanced Packaging Market by Product Type, 2021-2031, $ mn 74
Table 22. South Korea Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 74
Table 23. South Korea Advanced Packaging Market by End User, 2021-2031, $ mn 74
Table 24. Advanced Packaging Market in Rest of APAC by Country/Region, 2021-2031, $ mn 76
Table 25. Advanced Semiconductor Engineering Inc.: Company Snapshot 81
Table 26. Advanced Semiconductor Engineering Inc.: Business Segmentation 82
Table 27. Advanced Semiconductor Engineering Inc.: Product Portfolio 82
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