North America Advanced Packaging Market 2021-2031 by Product Type (Active Packaging, Smart and Intelligent Packaging), Packaging Platform (Flip-Chip Ball Grid Array, Flip Chip CSP, Wafer Level CSP, 2.5D/3D IC, Fo-WLP, Embedded Die, Fi-WLP), End User (Consumer Electronics, IT and Telecom, Automotive and Transportation, Industrial Sector), and Country: Trend Forecast and Growth Opportunity
- GRA4806323
- 89 Pages
- January 2022
- Materials and Chemicals
Highlighted with 20 tables and 38 figures, this 89-page report “North America Advanced Packaging Market 2021-2031 by Product Type (Active Packaging, Smart and Intelligent Packaging), Packaging Platform (Flip-Chip Ball Grid Array, Flip Chip CSP, Wafer Level CSP, 2.5D/3D IC, Fo-WLP, Embedded Die, Fi-WLP), End User (Consumer Electronics, IT and Telecom, Automotive and Transportation, Industrial Sector), and Country: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire North America advanced packaging market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2018-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
In-depth qualitative analyses include identification and investigation of the following aspects:
• Market Structure
• Growth Drivers
• Restraints and Challenges
• Emerging Product Trends & Market Opportunities
• Porter’s Fiver Forces
The trend and outlook of North America market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19. The balanced (most likely) projection is used to quantify North America advanced packaging market in every aspect of the classification from perspectives of Product Type, Packaging Platform, End User, and Country.
Based on Product Type, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Active Packaging
• Smart and Intelligent Packaging
Based on Packaging Platform, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Flip-Chip Ball Grid Array
• Flip Chip CSP
• Wafer Level CSP
• 2.5D/3D Integrated Circuit
• Fan Out Wafer Level Package (Fo-WLP)
• Embedded Die
• Fan In Wafer Level Package (Fi-WLP)
• Other Packaging Platforms
By End User, the North America market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Consumer Electronics
• IT and Telecom
• Automotive and Transportation
• Industrial Sector
• Healthcare and Life Science
• Aerospace and Defense
• Other End Users
Geographically, the following national/local markets are fully investigated:
• U.S.
• Canada
• Mexico
For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of the regional market by country and split of key national markets by Product Type, Packaging Platform, and End User over the forecast years are also included.
The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.
Selected Key Players:
Advanced Semiconductor Engineering Inc.
Amkor Technology, Inc.
Brewer Science, Inc.
Chipbond Technology Corporation
Intel Corporation
International Business Machines Corporation (IBM)
Microchip Technology, Inc.
Qualcomm Technologies, Inc.
Renesas Electronics Corporation
Samsung Electronics Co., Ltd.
STATS ChipPAC Pte. Ltd
SÜSS Microtec Se
Taiwan Semiconductor Manufacturing Company, Limited
Texas Instruments, Inc.
Universal Instruments Corporation
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
1.1 Industry Definition and Research Scope 6
1.1.1 Industry Definition 6
1.1.2 Research Scope 7
1.2 Research Methodology 10
1.2.1 Overview of Market Research Methodology 10
1.2.2 Market Assumption 11
1.2.3 Secondary Data 11
1.2.4 Primary Data 11
1.2.5 Data Filtration and Model Design 12
1.2.6 Market Size/Share Estimation 13
1.2.7 Research Limitations 14
1.3 Executive Summary 15
2 Market Overview and Dynamics 17
2.1 Market Size and Forecast 17
2.1.1 Impact of COVID-19 on World Economy 18
2.1.2 Impact of COVID-19 on the Market 20
2.2 Major Growth Drivers 22
2.3 Market Restraints and Challenges 25
2.4 Emerging Opportunities and Market Trends 28
2.5 Porter’s Fiver Forces Analysis 32
3 Segmentation of North America Market by Product Type 36
3.1 Market Overview by Product Type 36
3.2 Active Packaging 38
3.3 Smart and Intelligent Packaging 39
4 Segmentation of North America Market by Packaging Platform 40
4.1 Market Overview by Packaging Platform 40
4.2 Flip-Chip Ball Grid Array 42
4.3 Flip Chip CSP 43
4.4 Wafer Level CSP 44
4.5 2.5D/3D Integrated Circuit 45
4.6 Fan Out Wafer Level Package (Fo-WLP) 46
4.7 Embedded Die 47
4.8 Fan In Wafer Level Package (Fi-WLP) 48
4.9 Other Packaging Platforms 49
5 Segmentation of North America Market by End User 50
5.1 Market Overview by End User 50
5.2 Consumer Electronics 52
5.3 IT and Telecom 53
5.4 Automotive and Transportation 54
5.5 Industrial Sector 55
5.6 Healthcare and Life Science 56
5.7 Aerospace and Defense 57
5.8 Other End Users 58
6 North America Market 2021-2031 by Country 59
6.1 Overview of North America Market 59
6.2 U.S. 62
6.3 Canada 65
6.4 Mexico 67
7 Competitive Landscape 69
7.1 Overview of Key Vendors 69
7.2 New Product Launch, Partnership, Investment, and M&A 72
7.3 Company Profiles 73
Advanced Semiconductor Engineering Inc. 73
Amkor Technology, Inc. 75
Brewer Science, Inc. 76
Chipbond Technology Corporation 77
Intel Corporation 78
International Business Machines Corporation (IBM) 79
Microchip Technology, Inc. 80
Qualcomm Technologies, Inc. 81
Renesas Electronics Corporation 82
Samsung Electronics Co., Ltd. 83
STATS ChipPAC Pte. Ltd 84
SÜSS Microtec Se 85
Taiwan Semiconductor Manufacturing Company, Limited 86
Texas Instruments, Inc. 87
Universal Instruments Corporation 88
RELATED REPORTS 89
Table 1. Snapshot of North America Advanced Packaging Market in Balanced Perspective, 2021-2031 16
Table 2. World Economic Outlook, 2021-2031 19
Table 3. World Electrical and Electronics Market, 2021-2031, $ bn 24
Table 4. Main Product Trends and Market Opportunities in North America Advanced Packaging Market 28
Table 5. North America Advanced Packaging Market by Product Type, 2021-2031, $ mn 36
Table 6. North America Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 40
Table 7. North America Advanced Packaging Market by End User, 2021-2031, $ mn 50
Table 8. North America Advanced Packaging Market by Country, 2021-2031, $ mn 60
Table 9. U.S. Advanced Packaging Market by Product Type, 2021-2031, $ mn 64
Table 10. U.S. Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 64
Table 11. U.S. Advanced Packaging Market by End User, 2021-2031, $ mn 64
Table 12. Canada Advanced Packaging Market by Product Type, 2021-2031, $ mn 66
Table 13. Canada Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 66
Table 14. Canada Advanced Packaging Market by End User, 2021-2031, $ mn 66
Table 15. Mexico Advanced Packaging Market by Product Type, 2021-2031, $ mn 68
Table 16. Mexico Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 68
Table 17. Mexico Advanced Packaging Market by End User, 2021-2031, $ mn 68
Table 18. Advanced Semiconductor Engineering Inc.: Company Snapshot 73
Table 19. Advanced Semiconductor Engineering Inc.: Business Segmentation 74
Table 20. Advanced Semiconductor Engineering Inc.: Product Portfolio 74
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