Global Advanced Packaging Market 2021-2031 by Product Type (Active Packaging, Smart and Intelligent Packaging), Packaging Platform (Flip-Chip Ball Grid Array, Flip Chip CSP, Wafer Level CSP, 2.5D/3D IC, Fo-WLP, Embedded Die, Fi-WLP), End User (Consumer Electronics, IT and Telecom, Automotive and Transportation, Industrial Sector), and Region: Trend Forecast and Growth Opportunity
- GRA4806322
- 152 Pages
- January 2022
- Materials and Chemicals
Highlighted with 79 tables and 74 figures, this 152-page report “Global Advanced Packaging Market 2021-2031 by Product Type (Active Packaging, Smart and Intelligent Packaging), Packaging Platform (Flip-Chip Ball Grid Array, Flip Chip CSP, Wafer Level CSP, 2.5D/3D IC, Fo-WLP, Embedded Die, Fi-WLP), End User (Consumer Electronics, IT and Telecom, Automotive and Transportation, Industrial Sector), and Region: Trend Forecast and Growth Opportunity” is based on a comprehensive research of the entire global advanced packaging market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2018-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
In-depth qualitative analyses include identification and investigation of the following aspects:
• Market Structure
• Growth Drivers
• Restraints and Challenges
• Emerging Product Trends & Market Opportunities
• Porter’s Fiver Forces
The trend and outlook of global market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19. The balanced (most likely) projection is used to quantify global advanced packaging market in every aspect of the classification from perspectives of Product Type, Packaging Platform, End User, and Region.
Based on Product Type, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Active Packaging
• Smart and Intelligent Packaging
Based on Packaging Platform, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Flip-Chip Ball Grid Array
• Flip Chip CSP
• Wafer Level CSP
• 2.5D/3D Integrated Circuit
• Fan Out Wafer Level Package (Fo-WLP)
• Embedded Die
• Fan In Wafer Level Package (Fi-WLP)
• Other Packaging Platforms
By End User, the global market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Consumer Electronics
• IT and Telecom
• Automotive and Transportation
• Industrial Sector
• Healthcare and Life Science
• Aerospace and Defense
• Other End Users
Geographically, the following regions together with the listed national/local markets are fully investigated:
• North America (U.S., Canada, and Mexico)
• Europe (Germany, UK, France, Spain, Italy, Russia, Rest of Europe; Rest of Europe is further segmented into Netherlands, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland)
• APAC (Japan, China, South Korea, Australia, India, and Rest of APAC; Rest of APAC is further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, Taiwan, and Philippines)
• South America (Brazil, Chile, Argentina, Rest of South America)
• MEA (Turkey, Iran, South Africa, Other Nations)
For each aforementioned region and country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of all regional markets by country and split of key national markets by Product Type, Packaging Platform, and End User over the forecast years are also included.
The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.
Selected Key Players:
Advanced Semiconductor Engineering Inc.
Amkor Technology, Inc.
Brewer Science, Inc.
Chipbond Technology Corporation
Intel Corporation
International Business Machines Corporation (IBM)
Microchip Technology, Inc.
Qualcomm Technologies, Inc.
Renesas Electronics Corporation
Samsung Electronics Co., Ltd.
STATS ChipPAC Pte. Ltd
SÜSS Microtec Se
Taiwan Semiconductor Manufacturing Company, Limited
Texas Instruments, Inc.
Universal Instruments Corporation
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)
1.1 Industry Definition and Research Scope 8
1.1.1 Industry Definition 8
1.1.2 Research Scope 9
1.2 Research Methodology 12
1.2.1 Overview of Market Research Methodology 12
1.2.2 Market Assumption 13
1.2.3 Secondary Data 13
1.2.4 Primary Data 13
1.2.5 Data Filtration and Model Design 14
1.2.6 Market Size/Share Estimation 15
1.2.7 Research Limitations 16
1.3 Executive Summary 17
2 Market Overview and Dynamics 20
2.1 Market Size and Forecast 20
2.1.1 Impact of COVID-19 on World Economy 21
2.1.2 Impact of COVID-19 on the Market 23
2.2 Major Growth Drivers 25
2.3 Market Restraints and Challenges 28
2.4 Emerging Opportunities and Market Trends 31
2.5 Porter’s Fiver Forces Analysis 35
3 Segmentation of Global Market by Product Type 39
3.1 Market Overview by Product Type 39
3.2 Active Packaging 41
3.3 Smart and Intelligent Packaging 42
4 Segmentation of Global Market by Packaging Platform 43
4.1 Market Overview by Packaging Platform 43
4.2 Flip-Chip Ball Grid Array 45
4.3 Flip Chip CSP 46
4.4 Wafer Level CSP 47
4.5 2.5D/3D Integrated Circuit 48
4.6 Fan Out Wafer Level Package (Fo-WLP) 49
4.7 Embedded Die 50
4.8 Fan In Wafer Level Package (Fi-WLP) 51
4.9 Other Packaging Platforms 52
5 Segmentation of Global Market by End User 53
5.1 Market Overview by End User 53
5.2 Consumer Electronics 55
5.3 IT and Telecom 56
5.4 Automotive and Transportation 57
5.5 Industrial Sector 58
5.6 Healthcare and Life Science 59
5.7 Aerospace and Defense 60
5.8 Other End Users 61
6 Segmentation of Global Market by Region 62
6.1 Geographic Market Overview 2021-2031 62
6.2 North America Market 2021-2031 by Country 66
6.2.1 Overview of North America Market 66
6.2.2 U.S. 70
6.2.3 Canada 73
6.2.4 Mexico 75
6.3 European Market 2021-2031 by Country 77
6.3.1 Overview of European Market 77
6.3.2 Germany 81
6.3.3 U.K. 83
6.3.4 France 85
6.3.5 Spain 87
6.3.6 Italy 89
6.3.7 Russia 91
6.3.8 Rest of European Market 93
6.4 Asia-Pacific Market 2021-2031 by Country 95
6.4.1 Overview of Asia-Pacific Market 95
6.4.2 Japan 99
6.4.3 China 102
6.4.4 Australia 104
6.4.5 India 106
6.4.6 South Korea 108
6.4.7 Rest of APAC Region 110
6.5 South America Market 2021-2031 by Country 112
6.5.1 Argentina 115
6.5.2 Brazil 117
6.5.3 Chile 119
6.5.4 Rest of South America Market 121
6.6 MEA Market 2021-2031 by Country 122
6.6.1 Turkey 125
6.6.2 Iran 127
6.6.3 South Africa 129
6.6.4 Other National Markets 131
7 Competitive Landscape 132
7.1 Overview of Key Vendors 132
7.2 New Product Launch, Partnership, Investment, and M&A 135
7.3 Company Profiles 136
Advanced Semiconductor Engineering Inc. 136
Amkor Technology, Inc. 138
Brewer Science, Inc. 139
Chipbond Technology Corporation 140
Intel Corporation 141
International Business Machines Corporation (IBM) 142
Microchip Technology, Inc. 143
Qualcomm Technologies, Inc. 144
Renesas Electronics Corporation 145
Samsung Electronics Co., Ltd. 146
STATS ChipPAC Pte. Ltd 147
SÜSS Microtec Se 148
Taiwan Semiconductor Manufacturing Company, Limited 149
Texas Instruments, Inc. 150
Universal Instruments Corporation 151
RELATED REPORTS 152
Table 1. Snapshot of Global Advanced Packaging Market in Balanced Perspective, 2021-2031 18
Table 2. World Economic Outlook, 2021-2031 22
Table 3. World Electrical and Electronics Market, 2021-2031, $ bn 27
Table 4. Main Product Trends and Market Opportunities in Global Advanced Packaging Market 31
Table 5. Global Advanced Packaging Market by Product Type, 2021-2031, $ mn 39
Table 6. Global Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 43
Table 7. Global Advanced Packaging Market by End User, 2021-2031, $ mn 53
Table 8. Global Advanced Packaging Market by Region, 2021-2031, $ mn 63
Table 9. Leading National Advanced Packaging Market, 2021 and 2031, $ mn 65
Table 10. North America Advanced Packaging Market by Country, 2021-2031, $ mn 68
Table 11. U.S. Advanced Packaging Market by Product Type, 2021-2031, $ mn 72
Table 12. U.S. Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 72
Table 13. U.S. Advanced Packaging Market by End User, 2021-2031, $ mn 72
Table 14. Canada Advanced Packaging Market by Product Type, 2021-2031, $ mn 74
Table 15. Canada Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 74
Table 16. Canada Advanced Packaging Market by End User, 2021-2031, $ mn 74
Table 17. Mexico Advanced Packaging Market by Product Type, 2021-2031, $ mn 76
Table 18. Mexico Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 76
Table 19. Mexico Advanced Packaging Market by End User, 2021-2031, $ mn 76
Table 20. Europe Advanced Packaging Market by Country, 2021-2031, $ mn 80
Table 21. Germany Advanced Packaging Market by Product Type, 2021-2031, $ mn 82
Table 22. Germany Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 82
Table 23. Germany Advanced Packaging Market by End User, 2021-2031, $ mn 82
Table 24. U.K. Advanced Packaging Market by Product Type, 2021-2031, $ mn 84
Table 25. U.K. Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 84
Table 26. U.K. Advanced Packaging Market by End User, 2021-2031, $ mn 84
Table 27. France Advanced Packaging Market by Product Type, 2021-2031, $ mn 86
Table 28. France Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 86
Table 29. France Advanced Packaging Market by End User, 2021-2031, $ mn 86
Table 30. Spain Advanced Packaging Market by Product Type, 2021-2031, $ mn 88
Table 31. Spain Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 88
Table 32. Spain Advanced Packaging Market by End User, 2021-2031, $ mn 88
Table 33. Italy Advanced Packaging Market by Product Type, 2021-2031, $ mn 90
Table 34. Italy Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 90
Table 35. Italy Advanced Packaging Market by End User, 2021-2031, $ mn 90
Table 36. Russia Advanced Packaging Market by Product Type, 2021-2031, $ mn 92
Table 37. Russia Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 92
Table 38. Russia Advanced Packaging Market by End User, 2021-2031, $ mn 92
Table 39. Advanced Packaging Market in Rest of Europe by Country, 2021-2031, $ mn 94
Table 40. APAC Advanced Packaging Market by Country, 2021-2031, $ mn 97
Table 41. Japan Advanced Packaging Market by Product Type, 2021-2031, $ mn 101
Table 42. Japan Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 101
Table 43. Japan Advanced Packaging Market by End User, 2021-2031, $ mn 101
Table 44. China Advanced Packaging Market by Product Type, 2021-2031, $ mn 103
Table 45. China Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 103
Table 46. China Advanced Packaging Market by End User, 2021-2031, $ mn 103
Table 47. Australia Advanced Packaging Market by Product Type, 2021-2031, $ mn 105
Table 48. Australia Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 105
Table 49. Australia Advanced Packaging Market by End User, 2021-2031, $ mn 105
Table 50. India Advanced Packaging Market by Product Type, 2021-2031, $ mn 107
Table 51. India Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 107
Table 52. India Advanced Packaging Market by End User, 2021-2031, $ mn 107
Table 53. South Korea Advanced Packaging Market by Product Type, 2021-2031, $ mn 109
Table 54. South Korea Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 109
Table 55. South Korea Advanced Packaging Market by End User, 2021-2031, $ mn 109
Table 56. Advanced Packaging Market in Rest of APAC by Country/Region, 2021-2031, $ mn 111
Table 57. South America Advanced Packaging Market by Country, 2021-2031, $ mn 114
Table 58. Argentina Advanced Packaging Market by Product Type, 2021-2031, $ mn 116
Table 59. Argentina Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 116
Table 60. Argentina Advanced Packaging Market by End User, 2021-2031, $ mn 116
Table 61. Brazil Advanced Packaging Market by Product Type, 2021-2031, $ mn 118
Table 62. Brazil Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 118
Table 63. Brazil Advanced Packaging Market by End User, 2021-2031, $ mn 118
Table 64. Chile Advanced Packaging Market by Product Type, 2021-2031, $ mn 120
Table 65. Chile Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 120
Table 66. Chile Advanced Packaging Market by End User, 2021-2031, $ mn 120
Table 67. MEA Advanced Packaging Market by Country, 2021-2031, $ mn 124
Table 68. Turkey Advanced Packaging Market by Product Type, 2021-2031, $ mn 126
Table 69. Turkey Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 126
Table 70. Turkey Advanced Packaging Market by End User, 2021-2031, $ mn 126
Table 71. Iran Advanced Packaging Market by Product Type, 2021-2031, $ mn 128
Table 72. Iran Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 128
Table 73. Iran Advanced Packaging Market by End User, 2021-2031, $ mn 128
Table 74. South Africa Advanced Packaging Market by Product Type, 2021-2031, $ mn 130
Table 75. South Africa Advanced Packaging Market by Packaging Platform, 2021-2031, $ mn 130
Table 76. South Africa Advanced Packaging Market by End User, 2021-2031, $ mn 130
Table 77. Advanced Semiconductor Engineering Inc.: Company Snapshot 136
Table 78. Advanced Semiconductor Engineering Inc.: Business Segmentation 137
Table 79. Advanced Semiconductor Engineering Inc.: Product Portfolio 137
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