Semiconductor Assembly Equipment Market by Product Type (Inspection and Dicing Equipment, Die-Attach Equipment, Wire Bonding Equipment, and Plating Equipment), Supply Chain Process (IDM, OSAT, and Foundry), and End User Industry (Consumer Electronics, Healthcare, Automotive, IT & Telecommunication, and Others): Global Opportunity Analysis and Industry Forecast, 2021–2030
- ALL4676965
- 305 Pages
- September 2021
- Construction & Manufacturing
Increased demand for silicon-based sensors in IoT, China's rising chip industry, and the growing number of data centers and servers are expected to boost the global semiconductor manufacturing equipment market throughout the forecast period. High equipment costs and maintenance, as well as the complexity of design and functional flaws in the manufacturing process, are limiting the market's growth. The major barriers to the semiconductor manufacturing equipment market's growth include technical problems faced throughout the production process, as well as greater complexity related to reduce circuit structures.
To improve their position, market leaders are executing tactics such as mergers, acquisitions, agreements, collaborations, and product launches. Intel Corporation and Bharti Airtel Communication, for example, partnered in July 2021 to accelerate network development of 4G and 5G radio access network (vRAN) and open radio access network (RAN) technologies in order to change the Airtel network and extend its 5G network for its consumers.
Furthermore, the market is expected to be fueled by increased investment by major players in new production facilities. For example, Tokyo Electron opened a new development center at its Hosaka branch office in May 2021 to satisfy the current demand in the semiconductor industry and to increase production rates. As a result, throughout the projected period, these corporate expansions will create profitable growth and possibilities in the market.
The semiconductor assembly equipment market is segmented on the basis of product type, supply chain process, end user and region. By product type, the market is divided into inspection and dicing equipment, die-attach equipment, wire bonding equipment and plating equipment. By supply chain process, the market is segmented into IDM, OSAT and foundry. By end-user industry, the market is divided into consumer electronics, healthcare, automotive, IT & telecommunication and others. Region wise, the market analysis is conducted across North America (the U.S., Canada, and Mexico), Europe (the UK, France, Germany, Italy, and Rest of Europe), Asia-Pacific (China, Japan, India, South Korea and Rest of Asia-Pacific), and LAMEA (Latin America, the Middle East, and Africa).
COMPETITION ANALYSIS
Key companies profiled in the semiconductor assembly equipment market report include AlsilMaterial, Applied Materials Inc., ASML Holdings N.V., Intel Corporation, Micron Technology Inc., Qualcomm Technologies, Inc., Samsung Group, Screen Holdings Co., Ltd., Teradyne Inc., Tokyo Electron Limited.
KEY BENEFITS FOR STAKEHOLDERS
The report provides an extensive analysis of the current and emerging semiconductor production equipment market trends and dynamics.
In-depth market analysis is conducted by constructing market estimations for the key market segments between 2020 and 2030.
Extensive analysis of the semiconductor production equipment market is conducted by following key product positioning and monitoring of the top competitors within the market framework.
A comprehensive analysis of all regions is provided to determine the prevailing opportunities.
The global semiconductor production equipment market forecast analysis from 2021 to 2030 is included in the report.
The key market players within semiconductor production equipment market are profiled in this report and their strategies are analyzed thoroughly, which help understand the competitive outlook of the semiconductor production equipment industry.
KEY SEGMENTS
BY PRODUCT TYPE
• Inspection & dicing equipment
• Die-attach equipment
• Wire bonding equipment
• Plating equipment
BY SUPPLY CHAIN PROCESS
• IDM
• OSAT
• Foundry
BY END-USER INDUSTRY
• Consumer electronics
• Healthcare
• Automotive
• IT & telecommunication
• Others
BY REGION
• North America
o U.S.
o Canada
o Mexico
• Europe
o Germany
o France
o UK
o Italy
o Rest of Europe
• Asia-Pacific
o China
o India
o Japan
o South Korea
o Rest of Asia-Pacific
• LAMEA
o Latin America
o Middle East
o Africa
KEY PLAYERS
• AlsilMaterial
• Applied Materials Inc.
• ASML Holdings N.V.
• Intel Corporation
• Micron Technology Inc.
• Qualcomm Technologies, Inc.
• Samsung Group
• Screen Holdings Co., Ltd.
• Teradyne Inc.
• Tokyo Electron Limited.
1.1.Report description
1.2.Key benefits for stakeholders
1.3.Key market segments
1.4.Research methodology
1.4.1.Primary research
1.4.2.Secondary research
1.4.3.Analyst tools and models
CHAPTER 2:EXECUTIVE SUMMARY
2.1.Key findings of the study
2.2.CXO perspective
CHAPTER 3:MARKET OVERVIEW
3.1.Market definition and scope
3.2.Key findings
3.2.1.Top investment pockets
3.2.2.Top winning strategies
3.3.Market player positioning, 2020
3.4.Porter's five forces analysis
3.5.Market dynamics
3.5.1.Drivers
3.5.1.1.Rise in demand for electronics products
3.5.1.2.Growth in demand for hybrid circuits from medical, military, photonics, and wireless electronics applications
3.5.1.3.Growth of the semiconductor industry
3.5.2.Restraint
3.5.2.1.Fluctuation in raw material prices
3.5.3.Opportunities
3.5.3.1.Growth in usage of LED circuits
3.6.COVID-19 Impact Analysis
CHAPTER 4:SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE
4.1.Overview
4.1.1.Market size and forecast, by product type
4.2.Inspection and dicing Equipment
4.2.1.Key market trends, growth factors, and opportunities
4.2.2.Market size and forecast, by region
4.2.3.Market size and forecast, by country
4.3.Die-Attach Equipment
4.3.1.Key market trends, growth factors, and opportunities
4.3.2.Market size and forecast, by region
4.3.3.Market size and forecast, by die attach equipment type
4.3.3.1.Flip Chip Bonder
4.3.3.2.Die Bonder
4.3.4.Market size and forecast, by country
4.4.Wire Bonding Equipment
4.4.1.Key market trends, growth factors, and opportunities
4.4.2.Market size and forecast, by region
4.4.3.Market size and forecast, by country
4.5.Plating Equipment
4.5.1.Key market trends, growth factors, and opportunities
4.5.2.Market size and forecast, by region
4.5.3.Market size and forecast, by country
CHAPTER 5:SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS
5.1.Overview
5.1.1.Market size and forecast, by supply chain process
5.2.IDM
5.2.1.Key market trends, growth factors, and opportunities
5.2.2.Market size and forecast, by region
5.2.3.Market size and forecast, by country
5.3.OSAT
5.3.1.Key market trends, growth factors, and opportunities
5.3.2.Market size and forecast, by region
5.3.3.Market size and forecast, by country
5.4.Foundry
5.4.1.Key market trends, growth factors, and opportunities
5.4.2.Market size and forecast, by region
5.4.3.Market size and forecast, by country
CHAPTER 6:SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY
6.1.Overview
6.1.1.Market size and forecast, by end user industry
6.2.Consumer Electronics
6.2.1.Key market trends, growth factors, and opportunities
6.2.2.Market size and forecast, by region
6.2.3.Market size and forecast, by country
6.3.Healthcare
6.3.1.Key market trends, growth factors, and opportunities
6.3.2.Market size and forecast, by region
6.3.3.Market size and forecast, by country
6.4.Automotive
6.4.1.Key market trends, growth factors, and opportunities
6.4.2.Market size and forecast, by region
6.4.3.Market size and forecast, by country
6.5.IT and Telecommunication
6.5.1.Key market trends, growth factors, and opportunities
6.5.2.Market size and forecast, by region
6.5.3.Market size and forecast, by country
6.6.Others
6.6.1.Key market trends, growth factors, and opportunities
6.6.2.Market size and forecast, by region
6.6.3.Market size and forecast, by country
CHAPTER 7:SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY REGION
7.1.Market overview
7.1.1.Market size and forecast, by region
7.2.North America
7.2.1.Key market trends, growth factors, and opportunities
7.2.2.North America market size and forecast, by product type
7.2.2.1.Market size and forecast, by die attach equipment type
7.2.3.North America market size and forecast, by end user industry
7.2.4.North America market size and forecast, by supply chain process
7.2.5.North America market size and forecast, by country
7.2.5.1.U.S.
7.2.5.1.1.U.S. market size and forecast, by product type
7.2.5.1.2.U.S. market size and forecast, by supply chain process
7.2.5.1.3.U.S. market size and forecast, by end user industry
7.2.5.2.Canada
7.2.5.2.1.Canada market size and forecast, by product type
7.2.5.2.2.Canada market size and forecast, by supply chain process
7.2.5.2.3.Canada market size and forecast, by end user industry
7.2.5.3.Mexico
7.2.5.3.1.Mexico market size and forecast, by product type
7.2.5.3.2.Mexico market size and forecast, by supply chain process
7.2.5.3.3.Mexico market size and forecast, by end user industry
7.3.Europe
7.3.1.Key market trends, growth factors, and opportunities
7.3.2.Europe market size and forecast, by product type
7.3.2.1.Market size and forecast, by die attach equipment type
7.3.3.Europe market size and forecast, by supply chain process
7.3.4.Europe market size and forecast, by end user industry
7.3.5.Europe market size and forecast, by country
7.3.5.1.Germany
7.3.5.1.1.Germany market size and forecast, by product type
7.3.5.1.2.Germany market size and forecast, by supply chain process
7.3.5.1.3.Germany market size and forecast, by end user industry
7.3.5.2.France
7.3.5.2.1.France market size and forecast, by product type
7.3.5.2.2.France market size and forecast, by supply chain process
7.3.5.2.3.France market size and forecast, by end user industry
7.3.5.3.UK
7.3.5.3.1.UK market size and forecast, by product type
7.3.5.3.2.UK market size and forecast, by supply chain process
7.3.5.3.3.UK market size and forecast, by end user industry
7.3.5.4.Italy
7.3.5.4.1.Italy market size and forecast, by product type
7.3.5.4.2.Italy market size and forecast, by supply chain process
7.3.5.4.3.Italy market size and forecast, by end user industry
7.3.5.5.Rest of Europe
7.3.5.5.1.Rest of Europe market size and forecast, by product type
7.3.5.5.2.Rest of Europe market size and forecast, by supply chain process
7.3.5.5.3.Rest of Europe market size and forecast, by end user industry
7.4.Asia-Pacific
7.4.1.Key market trends, growth factors, and opportunities
7.4.2.Asia-Pacific market size and forecast, by product type
7.4.2.1.Market size and forecast, by die attach equipment type
7.4.3.Asia-Pacific market size and forecast, by supply chain process
7.4.4.Asia-Pacific market size and forecast, by end user industry
7.4.5.Asia-Pacific market size and forecast, by country
7.4.5.1.China
7.4.5.1.1.China market size and forecast, by product type
7.4.5.1.2.China market size and forecast, by supply chain process
7.4.5.1.3.China market size and forecast, by end user industry
7.4.5.2.India
7.4.5.2.1.India market size and forecast, by product type
7.4.5.2.2.Taiwan market size and forecast, by supply chain process
7.4.5.2.3.Taiwan market size and forecast, by end user industry
7.4.5.3.Japan
7.4.5.3.1.Japan market size and forecast, by product type
7.4.5.3.2.Japan market size and forecast, by supply chain process
7.4.5.3.3.Japan market size and forecast, by end user industry
7.4.5.4.South Korea
7.4.5.4.1.South Korea market size and forecast, by product type
7.4.5.4.2.South Korea market size and forecast, by supply chain process
7.4.5.4.3.South Korea market size and forecast, by end user industry
7.4.5.5.Rest of Asia-Pacific
7.4.5.5.1.Rest of Asia-Pacific market size and forecast, by product type
7.4.5.5.2.Rest of Asia-Pacific market size and forecast, by supply chain process
7.4.5.5.3.Rest of Asia-Pacific market size and forecast, by end user industry
7.5.LAMEA
7.5.1.Key market trends, growth factors, and opportunities
7.5.2.LAMEA market size and forecast, by product type
7.5.2.1.Market size and forecast, by die attach equipment type
7.5.3.LAMEA market size and forecast, by supply chain process
7.5.4.LAMEA market size and forecast, by end user industry
7.5.5.LAMEA market size and forecast, by country
7.5.5.1.Latin America
7.5.5.1.1.Latin America market size and forecast, by product type
7.5.5.1.2.Latin America market size and forecast, by supply chain process
7.5.5.1.3.Latin America market size and forecast, by end user industry
7.5.5.2.Middle East
7.5.5.2.1.Middle East market size and forecast, by product type
7.5.5.2.2.Middle East market size and forecast, by supply chain process
7.5.5.2.3.Middle East market size and forecast, by end user industry
7.5.5.3.Africa
7.5.5.3.1.Africa market size and forecast, by product type
7.5.5.3.2.Africa market size and forecast, by supply chain process
7.5.5.3.3.Africa market size and forecast, by end user industry
CHAPTER 8:COMPANY PROFILES
8.1.ALSILMATERIAL
8.1.1.Company overview
8.1.2.Key executive
8.1.3.Company snapshot
8.1.4.Product portfolio
8.2.APPLIED MATERIALS, INC.
8.2.1.Company overview
8.2.2.Key executive
8.2.3.Company snapshot
8.2.4.Operating business segments
8.2.5.Product portfolio
8.2.6.R&D expenditure
8.2.7.Business performance
8.2.8.Key strategic moves and developments
8.3.ASML HOLDING N.V.
8.3.1.Company overview
8.3.2.Key executive
8.3.3.Company snapshot
8.3.4.Operating business segments
8.3.5.Product portfolio
8.3.6.R&D expenditure
8.3.7.Business performance
8.4.INTEL CORPORATION
8.4.1.Company overview
8.4.2.Key executive
8.4.3.Company snapshot
8.4.4.Operating business segments
8.4.5.Product portfolio
8.4.6.R&D expenditure
8.4.7.Business performance
8.4.8.Key strategic moves and developments
8.5.MICRON TECHNOLOGY, INC.
8.5.1.Company overview
8.5.2.Key executive
8.5.3.Company snapshot
8.5.4.Operating business segments
8.5.5.Product portfolio
8.5.6.R&D expenditure
8.5.7.Business performance
8.5.8.Key strategic moves and developments
8.6.QUALCOMM TECHNOLOGIES, INC
8.6.1.Company overview
8.6.2.Key executive
8.6.3.Company snapshot
8.6.4.Operating business segments
8.6.5.Product portfolio
8.6.6.R&D expenditure
8.6.7.Business performance
8.6.8.Key strategic moves and developments
8.7.SAMSUNG ELECTRONICS CO., LTD.
8.7.1.Company overview
8.7.2.Key executive
8.7.3.Company snapshot
8.7.4.Operating business segments
8.7.5.Product portfolio
8.7.6.R&D expenditure
8.7.7.Business performance
8.7.8.Key strategic moves and developments
8.8.SCREEN HOLDINGS CO., LTD.
8.8.1.Company overview
8.8.2.Key executive
8.8.3.Company snapshot
8.8.4.Operating business segments
8.8.5.Product portfolio
8.8.6.R&D expenditure
8.8.7.Business performance
8.8.8.Key strategic moves and developments
8.9.TERADYNE INC.
8.9.1.Company overview
8.9.2.Key executive
8.9.3.Company snapshot
8.9.4.Operating business segments
8.9.5.Product portfolio
8.9.6.Business performance
8.9.7.Key strategic moves and developments
8.10.TOKYO ELECTRON LIMITED
8.10.1.Company overview
8.10.2.Key executive
8.10.3.Company snapshot
8.10.4.Operating business segments
8.10.5.Product portfolio
8.10.6.R&D expenditure
8.10.7.Business performance
8.10.8.Key strategic moves and developments
TABLE 01.SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 02.INSPECTION AND DICING SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE, BY REGION, 2020–2030 ($MILLION)
TABLE 03.DIE-ATTACH SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE, BY REGION, 2020–2030 ($MILLION)
TABLE 04.DIE ATTACH ASSEMBLY EQUIPMENT MARKET REVENUE, BY TYPE, 2020–2030 ($MILLION)
TABLE 05.WIRE BONDING SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE, BY REGION, 2020–2030 ($MILLION)
TABLE 06.PLATING SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE, BY REGION, 2020–2030 ($MILLION)
TABLE 07.SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 08.SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE FOR IDM, BY REGION, 2020–2030 ($MILLION)
TABLE 09.SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE FOR OSAT, BY REGION, 2020–2030 ($MILLION)
TABLE 10.SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE FOR FOUNDRY, BY REGION, 2020–2030 ($MILLION)
TABLE 11.SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 12.SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE FOR CONSUMER ELECTRONICS, BY REGION, 2020–2030 ($MILLION)
TABLE 13.SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE FOR HEALTHCARE, BY REGION, 2020–2030 ($MILLION)
TABLE 14.SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE FOR AUTOMOTIVE, BY REGION, 2020–2030 ($MILLION)
TABLE 15.SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE FOR IT AND TELECOMMUNICATION, BY REGION, 2020–2030 ($MILLION)
TABLE 16.SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE FOR OTHERS, BY REGION, 2020–2030 ($MILLION)
TABLE 17.SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY REGION, 2020–2030 ($MILLION)
TABLE 18.NORTH AMERICA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 19.NORTH AMERICA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE FOR DIE ATTACH EQUIPMENT, 2020–2030 ($MILLION)
TABLE 20.NORTH AMERICA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 21.NORTH AMERICA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 22.NORTH AMERICA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET , BY COUNTRY, 2020–2030 ($MILLION)
TABLE 23.U.S. SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 24.U.S. SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 25.U.S. SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 26.CANADA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 27.CANADA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 28.CANADA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 29.MEXICO SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 30.MEXICO SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 31.MEXICO SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 32.EUROPE SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 33.EUROPE SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE FOR DIE ATTACH EQUIPMENT, 2020–2030 ($MILLION)
TABLE 34.EUROPE SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY COUNTRY, 2020–2030 ($MILLION)
TABLE 35.EUROPE SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 36.EUROPE SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY COUNTRY, 2020–2030 ($MILLION)
TABLE 37.GERMANY SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 38.GERMANY SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 39.GEMRNAY SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 40.FRANCE SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 41.FRANCE SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 42.FRANCE SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 43.UK SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 44.UK SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 45.UK SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY APPLICATION, 2020–2030 ($MILLION)
TABLE 46.ITALY SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 47.ITALY SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 48.ITALY SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 49.REST OF EUROPE SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 50.REST OF EUROPE SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 51.REST OF EUROPE SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 52.ASIA-PACIFIC SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 53.ASIA-PACIFIC SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE FOR DIE ATTACH EQUIPMENT, 2020–2030 ($MILLION)
TABLE 54.ASIA-PACIFIC SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET , BY COUNTRY, 2020–2030 ($MILLION)
TABLE 55.ASIA-PACIFIC SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 56.ASIA-PACIFIC SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET , BY COUNTRY, 2020–2030 ($MILLION)
TABLE 57.CHINA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 58.CHINA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 59.CHINA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 60.TAIWAN SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 61.TAIWAN SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 62.TAIWAN SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 63.JAPAN SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 64.JAPAN SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 65.JAPAN SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 66.SOUTH KOREA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 67.SOUTH KOREA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 68.SOUTH KOREA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 69.REST OF ASIA-PACIFIC SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 70.REST OF ASIA-PACIFIC SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 71.REST OF ASIA-PACIFIC SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 72.LAMEA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 73.LAMEA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET REVENUE FOR DIE ATTACH EQUIPMENT, 2020–2030 ($MILLION)
TABLE 74.LAMEA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET , BY COUNTRY, 2020–2030 ($MILLION)
TABLE 75.LAMEA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 76.LAMEA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY COUNTRY, 2020–2030 ($MILLION)
TABLE 77.LATIN AMERICA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 78.LATIN AMERICA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 79.LATIN AMERICA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 80.MIDDLE EAST SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 81.MIDDLE EAST SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 82.MIDDLE EAST SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 83.AFRICA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY PRODUCT TYPE, 2020–2030 ($MILLION)
TABLE 84.AFRICA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY SUPPLY CHAIN PROCESS, 2020–2030 ($MILLION)
TABLE 85.AFRICA SEMICONDUCTOR ASSEMBLY EQUIPMENT MARKET, BY END USER INDUSTRY, 2020–2030 ($MILLION)
TABLE 86.ALSILMATERIAL: KEY EXECUTIVE
TABLE 87.ALSILMATERIAL: COMPANY SNAPSHOT
TABLE 88.ALSILMATERIAL: PRODUCT PORTFOLIO
TABLE 89.APPLIED MATERIALS: KEY EXECUTIVE
TABLE 90.APPLIED MATERIALS: COMPANY SNAPSHOT
TABLE 91.APPLIED MATERIALS: OPERATING SEGMENTS
TABLE 92.APPLIED MATERIALS: PRODUCT PORTFOLIO
TABLE 93.ASML: KEY EXECUTIVE
TABLE 94.ASML: COMPANY SNAPSHOT
TABLE 95.ASML: OPERATING SEGMENT
TABLE 96.ASML: PRODUCT PORTFOLIO
TABLE 97.INTEL CORPORATION: KEY EXECUTIVE
TABLE 98.INTEL CORPORATION: COMPANY SNAPSHOT
TABLE 99.INTEL CORPORATION: OPERATING SEGMENTS
TABLE 100.INTEL CORPORATION: PRODUCT PORTFOLIO
TABLE 101.MICRON TECHNOLOGY: KEY EXECUTIVE
TABLE 102.MICRON TECHNOLOGY: COMPANY SNAPSHOT
TABLE 103.MICRON TECHNOLOGY: OPERATING SEGMENTS
TABLE 104.MICRON TECHNOLOGY: PRODUCT PORTFOLIO
TABLE 105.QUALCOMM TECHNOLOGIES: KEY EXECUTIVE
TABLE 106.QUALCOMM TECHNOLOGIES: COMPANY SNAPSHOT
TABLE 107.QUALCOMM TECHNOLOGIES: OPERATING SEGMENTS
TABLE 108.QUALCOMM TECHNOLOGIES: PRODUCT PORTFOLIO
TABLE 109.SAMSUNG: KEY EXECUTIVE
TABLE 110.SAMSUNG: COMPANY SNAPSHOT
TABLE 111.SAMSUNG: OPERATING SEGMENTS
TABLE 112.SAMSUNG: PRODUCT PORTFOLIO
TABLE 113.SCREEN HOLDINGS: KEY EXECUTIVE
TABLE 114.SCREEN HOLDINGS: COMPANY SNAPSHOT
TABLE 115.SCREEN HOLDINGS: OPERATING SEGMENTS
TABLE 116.SCREEN HOLDINGS: PRODUCT PORTFOLIO
TABLE 117.TERADYNE: KEY EXECUTIVE
TABLE 118.TERADYNE: COMPANY SNAPSHOT
TABLE 119.TERADYNE: OPERATING SEGMENTS
TABLE 120.TERADYNE: PRODUCT PORTFOLIO
TABLE 121.TOKYO ELECTRON LIMITED: KEY EXECUTIVE
TABLE 122.TOKYO ELECTRON LIMITED: COMPANY SNAPSHOT
TABLE 123.TOKYO ELECTRON LIMITED: OPERATING SEGMENTS
TABLE 124.TOKYO ELECTRON LIMITED: PRODUCT PORTFOLIO
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