Semiconductor Packaging Market by Type (Flip-Chip, Embedded Die, Fan-In WLP, and Fan-Out WLP), Packaging Material (Organic Substrate, Bonding Wire, Leadframe, Ceramic Package, Die Attach Material, and Others), Wafer Material (Simple Semiconductor (Silicon (Si) and Germanium (Ge)) and Compound Semiconductor (III-V (Gallium Arsenide (GaAs), Indium Phosphide (InP), Gallium Nitride (GaN), Gallium Phosphide (GaP), and Others), II-VI (Zinc Sulfide (ZnS) and Zinc Selenide (ZnSe)), and IV-IV (Silicon Carbide (SiC) and Silicon-Germanium (SiGe)), and Technology (Grid Array, Small Outline Package, Flat No-Leads Packages (Dual-flat no-leads (DFN) and Quad-flat no-leads (QFN)), Dual In-Line Package (Plastic Dual Inline Package (PDIP) and Ceramic Dual Inline Package (CDIP)), and Others), and Industry Vertical (Consumer Electronics, Automotive, Healthcare, IT & Telecommunication, Aerospace & Defense, and Others): Global Opportunity Analysis and Industry Forecast, 2021–2030

1.1.Report description

1.2.Key benefits for stakeholders

1.3.Key market segments

1.4.Research methodology

1.4.1.Primary research

1.4.2.Secondary research

1.4.3.Analyst tools and models

CHAPTER 2:EXECUTIVE SUMMARY

2.1.Key findings

2.1.1.Top impacting factors

2.1.2.Top investment pockets

2.2.CXO perspective

CHAPTER 3:MARKET OVERVIEW

3.1.Market definition and scope

3.2.Key forces shaping the semiconductor packaging

3.3.Patent analysis

3.3.1.By region, 2012–2020

3.3.2.By applicant, 2012–2020

3.4.Covid-19 impact analysis

3.4.1.COVID-19 outbreak

3.4.2.Impact on market size

3.4.3.End user trends, preferences, and budget impact

3.4.4.Parent industry impact

3.4.5.Opportunity window

3.5.Market dynamics

3.5.1.Drivers

3.5.1.1.Surging Internet of Things (IoT) technology

3.5.1.2.High adoption of consumer electronics devices

3.5.1.3.Evolving trends toward semiconductor wafers in the automotive industry

3.5.2.Restraint

3.5.2.1.High-cost associated with semiconductor materials

3.5.3.Opportunity

3.5.3.1.Evolving trends towards the fan-out wafer level packaging

CHAPTER 4:SEMICONDUCTOR PACKAGING MARKET , BY PACKAGING PLATFORM

4.1.Overview

4.2.Flip Chip

4.2.1.Key market trends, growth factors, and opportunities

4.2.2.Market size and forecast, by region

4.2.3.Market analysis, by country

4.3.Embedded die

4.3.1.Key market trends, growth factors, and opportunities

4.3.2.Market size and forecast, by region

4.3.3.Market analysis, by country

4.4.Fan-in WLP

4.4.1.Key market trends, growth factors, and opportunities

4.4.2.Market size and forecast, by region

4.4.3.Market analysis, by country

4.5.Fan-out WLP

4.5.1.Key market trends, growth factors, and opportunities

4.5.2.Market size and forecast, by region

4.5.3.Market analysis, by country

CHAPTER 5:SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL

5.1.Overview

5.2.Organic Substrate

5.2.1.Key market trends, growth factors, and opportunities

5.2.2.Market size and forecast, by region

5.2.3.Market analysis, by country

5.3.Bonding-Wire

5.3.1.Key market trends, growth factors, and opportunities

5.3.2.Market size and forecast, by region

5.3.3.Market analysis, by country

5.4.Leadframe

5.4.1.Key market trends, growth factors, and opportunities

5.4.2.Market size and forecast, by region

5.4.3.Market analysis, by country

5.5.Ceramic Package

5.5.1.Key market trends, growth factors, and opportunities

5.5.2.Market size and forecast, by region

5.5.3.Market analysis, by country

5.6.Die-Attach Material

5.6.1.Key market trends, growth factors, and opportunities

5.6.2.Market size and forecast, by region

5.6.3.Market analysis, by country

5.7.Others

5.7.1.Key market trends, growth factors, and opportunities

5.7.2.Market size and forecast, by region

5.7.3.Market analysis, by country

CHAPTER 6:SEMICONDUCTOR PACKAGING MARKET , BY WAFER MATERIAL

6.1.Overview

6.2.Simple Semiconductor

6.2.1.Key market trends, growth factors, and opportunities

6.2.2.Market size and forecast, by region

6.2.2.1.Silicon (Si)

6.2.2.2.Germanium (Ge)

6.2.3.Market analysis, by country

6.3.Compound Semiconductor

6.3.1.Key market trends, growth factors, and opportunities

6.3.2.Market size and forecast, by region

6.3.2.1.III–V Compound Semiconductor

6.3.2.1.1.Gallium Arsenide (GaAs)

6.3.2.1.2.Indium Phosphide (InP)

6.3.2.1.3.Gallium Nitride (GaN)

6.3.2.1.4.Gallium phosphide (GaP)

6.3.2.1.5.Others

6.3.2.2.II-VI Compound Semiconductor

6.3.2.2.1.Zinc Sulfide (ZnS)

6.3.2.2.2.Zinc Selenide (ZnSe)

6.3.2.3.IV-IV Compound Semiconductor

6.3.2.3.1.Silicon carbide (SiC)

6.3.2.3.2.Silicon-Germanium (SiGe)

6.3.3.Market analysis, by country

CHAPTER 7:SEMICONDUCTOR PACKAGING, BY TECHNOLOGY

7.1.Overview

7.2.Grid Array Package

7.2.1.Key market trends, growth factors, and opportunities

7.2.2.Market size and forecast, by region

7.2.3.Market analysis, by country

7.3.Small Outline Package

7.3.1.Key market trends, growth factors, and opportunities

7.3.2.Market size and forecast, by region

7.3.3.Market analysis, by country

7.4.Flat No-Leads Package

7.4.1.Key market trends, growth factors, and opportunities

7.4.2.Market size and forecast, by region

7.4.2.1.Dual Flat No-Leads (DFN) Package

7.4.2.2.Quad Flat No-Leads (QFN) Package

7.4.3.Market analysis, by country

7.5.Dual In-Line Package

7.5.1.Key market trends, growth factors, and opportunities

7.5.2.Market size and forecast, by region

7.5.2.1.Plastic Dual In-line Package (PDIP)

7.5.2.2.Ceramic Dual Inline Package (CDIP)

7.5.3.Market analysis, by country

7.6.Others

7.6.1.Key market trends, growth factors, and opportunities

7.6.2.Market size and forecast, by region

7.6.3.Market analysis, by country

CHAPTER 8:SEMICONDUCTOR PACKAGING, BY INDUSTRY VERTICAL

8.1.Overview

8.2.Consumer electronics

8.2.1.Key market trends, growth factors, and opportunities

8.2.2.Market size and forecast, by region

8.2.3.Market analysis, by country

8.3.Automotive

8.3.1.Key market trends, growth factors, and opportunities

8.3.2.Market size and forecast, by region

8.3.3.Market analysis, by country

8.4.Healthcare

8.4.1.Key market trends, growth factors, and opportunities

8.4.2.Market size and forecast, by region

8.4.3.Market analysis, by country

8.5.IT & Telecommunication

8.5.1.Key market trends, growth factors, and opportunities

8.5.2.Market size and forecast, by region

8.5.3.Market analysis, by country

8.6.Aerospace & Defense

8.6.1.Key market trends, growth factors, and opportunities

8.6.2.Market size and forecast, by region

8.6.3.Market analysis, by country

8.7.Others

8.7.1.Key market trends, growth factors, and opportunities

8.7.2.Market size and forecast, by region

8.7.3.Market analysis, by country

CHAPTER 9:SEMICONDUCTOR PACKAGING MAREKT, BY REGION

9.1.Overview

9.2.North America

9.2.1.Key market trends, growth factors, and opportunities

9.2.2.Market size and forecast, by type

9.2.3.Market size and forecast, by packaging material

9.2.4.Market size and forecast, by wafer material

9.2.5.Market size and forecast, by technology

9.2.6.Market size and forecast, by industry vertical

9.2.7.Market analysis, by country

9.2.7.1.U.S.

9.2.7.1.1.Market size and forecast, by type

9.2.7.1.2.Market size and forecast, by packaging material

9.2.7.1.3.Market size and forecast, by wafer material

9.2.7.1.4.Market size and forecast, by technology

9.2.7.1.5.Market size and forecast, by industry vertical

9.2.7.2.Canada

9.2.7.2.1.Market size and forecast, by type

9.2.7.2.2.Market size and forecast, by packaging material

9.2.7.2.3.Market size and forecast, by wafer material

9.2.7.2.4.Market size and forecast, by technology

9.2.7.2.5.Market size and forecast, by industry vertical

9.2.7.3.Mexico

9.2.7.3.1.Market size and forecast, by type

9.2.7.3.2.Market size and forecast, by packaging material

9.2.7.3.3.Market size and forecast, by wafer material

9.2.7.3.4.Market size and forecast, by technology

9.2.7.3.5.Market size and forecast, by industry vertical

9.3.Europe

9.3.1.Key market trends, growth factors, and opportunities

9.3.2.Market size and forecast, by type

9.3.3.Market size and forecast, by packaging material

9.3.4.Market size and forecast, by wafer material

9.3.5.Market size and forecast, by technology

9.3.6.Market size and forecast, by industry vertical

9.3.7.Market analysis, by country

9.3.7.1.Germany

9.3.7.1.1.Market size and forecast, by type

9.3.7.1.2.Market size and forecast, by packaging material

9.3.7.1.3.Market size and forecast, by wafer material

9.3.7.1.4.Market size and forecast, by technology

9.3.7.1.5.Market size and forecast, by industry vertical

9.3.7.2.UK

9.3.7.2.1.Market size and forecast, by type

9.3.7.2.2.Market size and forecast, by packaging material

9.3.7.2.3.Market size and forecast, by wafer material

9.3.7.2.4.Market size and forecast, by technology

9.3.7.2.5.Market size and forecast, by industry vertical

9.3.7.3.France

9.3.7.3.1.Market size and forecast, by type

9.3.7.3.2.Market size and forecast, by packaging material

9.3.7.3.3.Market size and forecast, by wafer material

9.3.7.3.4.Market size and forecast, by technology

9.3.7.3.5.Market size and forecast, by industry vertical

9.3.7.4.Italy

9.3.7.4.1.Market size and forecast, by type

9.3.7.4.2.Market size and forecast, by packaging material

9.3.7.4.3.Market size and forecast, by wafer material

9.3.7.4.4.Market size and forecast, by technology

9.3.7.4.5.Market size and forecast, by industry vertical

9.3.7.5.Rest of Europe

9.3.7.5.1.Market size and forecast, by type

9.3.7.5.2.Market size and forecast, by packaging material

9.3.7.5.3.Market size and forecast, by wafer material

9.3.7.5.4.Market size and forecast, by technology

9.3.7.5.5.Market size and forecast, by industry vertical

9.4.Asia-Pacific

9.4.1.Key market trends, growth factors, and opportunities

9.4.2.Market size and forecast, by type

9.4.3.Market size and forecast, by packaging material

9.4.4.Market size and forecast, by wafer material

9.4.5.Market size and forecast, by technology

9.4.6.Market size and forecast, by industry vertical

9.4.7.Market analysis, by country

9.4.7.1.China

9.4.7.1.1.Market size and forecast, by type

9.4.7.1.2.Market size and forecast, by packaging material

9.4.7.1.3.Market size and forecast, by wafer material

9.4.7.1.4.Market size and forecast, by technology

9.4.7.1.5.Market size and forecast, by industry vertical

9.4.7.2.Japan

9.4.7.2.1.Market size and forecast, by type

9.4.7.2.2.Market size and forecast, by packaging material

9.4.7.2.3.Market size and forecast, by wafer material

9.4.7.2.4.Market size and forecast, by technology

9.4.7.2.5.Market size and forecast, by industry vertical

9.4.7.3.India

9.4.7.3.1.Market size and forecast, by type

9.4.7.3.2.Market size and forecast, by packaging material

9.4.7.3.3.Market size and forecast, by wafer material

9.4.7.3.4.Market size and forecast, by technology

9.4.7.3.5.Market size and forecast, by industry vertical

9.4.7.4.South Korea

9.4.7.4.1.Market size and forecast, by type

9.4.7.4.2.Market size and forecast, by packaging material

9.4.7.4.3.Market size and forecast, by wafer material

9.4.7.4.4.Market size and forecast, by technology

9.4.7.4.5.Market size and forecast, by industry vertical

9.4.7.5.Taiwan

9.4.7.5.1.Market size and forecast, by type

9.4.7.5.2.Market size and forecast, by packaging material

9.4.7.5.3.Market size and forecast, by wafer material

9.4.7.5.4.Market size and forecast, by technology

9.4.7.5.5.Market size and forecast, by industry vertical

9.4.7.6.Rest of Asia-Pacific

9.4.7.6.1.Market size and forecast, by type

9.4.7.6.2.Market size and forecast, by packaging material

9.4.7.6.3.Market size and forecast, by wafer material

9.4.7.6.4.Market size and forecast, by technology

9.4.7.6.5.Market size and forecast, by industry vertical

9.5.LAMEA

9.5.1.Key market trends, growth factors, and opportunities

9.5.2.Market size and forecast, by type

9.5.3.Market size and forecast, by packaging material

9.5.4.Market size and forecast, by wafer material

9.5.5.Market size and forecast, by technology

9.5.6.Market size and forecast, by industry vertical

9.5.7.Market analysis, by country

9.5.7.1.Latin America

9.5.7.1.1.Market size and forecast, by type

9.5.7.1.2.Market size and forecast, by packaging material

9.5.7.1.3.Market size and forecast, by wafer material

9.5.7.1.4.Market size and forecast, by technology

9.5.7.1.5.Market size and forecast, by industry vertical

9.5.7.2.Middle East and Africa

9.5.7.2.1.Market size and forecast, by type

9.5.7.2.2.Market size and forecast, by packaging material

9.5.7.2.3.Market size and forecast, by wafer material

9.5.7.2.4.Market size and forecast, by technology

9.5.7.2.5.Market size and forecast, by industry vertical

CHAPTER 10:COMPETITIVE LANDSCAPE

10.1.Introduction

10.1.1.Market player positioning, 2020

10.2.Top winning strategies

10.3.Product mapping of top 10 player

10.4.Competitive dashboard

10.5.Competitive heatmap

CHAPTER 11:COMPANY PROFILES

11.1.AMKOR TECHNOLOGY

11.1.1.Company overview

11.1.2.Key executive

11.1.3.Company snapshot

11.1.4.Product portfolio

11.1.5.R&D expenditure

11.1.6.Business performance

11.2.ASE Group

11.2.1.Company overview

11.2.2.Key executives

11.2.3.Company snapshot

11.2.4.Operating business segments

11.2.5.Product portfolio

11.2.6.R&D expenditure

11.2.7.Business performance

11.3.FUJITSU LIMITED

11.3.1.Company overview

11.3.2.Key executive

11.3.3.Company snapshot

11.3.4.Operating business segments

11.3.5.Product portfolio

11.3.6.R&D expenditure

11.3.7.Business performance

11.4.TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED

11.4.1.Company overview

11.4.2.Key Executives

11.4.3.Company snapshot.

11.4.4.Product portfolio

11.4.5.R&D Expenditure

11.4.6.Business performance

11.4.7.Key strategic moves and developments

11.5.TEXAS INSTRUMENTS INCORPORATED

11.5.1.Company overview

11.5.2.Key Executives

11.5.3.Company snapshot

11.5.4.Operating business segments

11.5.5.Product portfolio

11.5.6.R&D Expenditure

11.5.7.Business performance

11.5.8.Key strategic moves and developments

11.6.ChipMOS Technology Inc.

11.6.1.Company overview

11.6.2.Key executives

11.6.3.Company snapshot

11.6.4.Operating business segments

11.6.5.Product portfolio

11.6.6.R&D expenditure

11.6.7.Business performance

11.7.Intel Corporation

11.7.1.Company overview

11.7.2.Key executives

11.7.3.Company snapshot

11.7.4.Operating business segments

11.7.5.Product portfolio

11.7.6.R&D expenditure

11.7.7.Business performance

11.7.8.Key strategic moves and developments

11.8.Samsung Electronics Co. Ltd.

11.8.1.Company overview

11.8.2.Key executives

11.8.3.Company snapshot.

11.8.4.Operating business segments

11.8.5.Product portfolio

11.8.6.R&D expenditure

11.8.7.Business performance

11.8.8.Key strategic moves and developments

11.9.Powertech Technology Inc. (PTI)

11.9.1.Company overview

11.9.2.Key executives

11.9.3.Company snapshot

11.9.4.Operating business segments

11.9.5.Product portfolio

11.9.6.R&D expenditure

11.9.7.Business performance

11.9.8.Key strategic moves and developments

11.10.Jiangsu Changjiang Electronics Technology Co., LTD (JCET)

11.10.1.Company overview

11.10.2.Key executives

11.10.3.Company snapshot

11.10.4.Operating business segments

11.10.5.Product portfolio

11.10.6.R&D expenditure

11.10.7.Business performance

11.10.8.Key strategic moves and developments

TABLE 01.GLOBAL SEMICONDUCTOR PACKAGING, BY PACKAGING PLATFORM, 2020–2030 ($MILLION)

TABLE 02.FLIP CHIP SEMICONDUCTOR PACKAGING MARKET, BY REGION, 2020–2030 ($MILLION)

TABLE 03.EMBEDDED DIE SEMICONDUCTOR PACKAGING, BY REGION, 2020–2030 ($MILLION)

TABLE 04.FAN-IN WLP SEMICONDUCTOR PACKAGING MARKET, BY REGION, 2020–2030 ($MILLION)

TABLE 05.FAN-OUT WLP SEMICONDUCTOR PACKAGING MARKET, BY REGION, 2020–2030 ($MILLION)

TABLE 06.SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)

TABLE 07.SEMICONDUCTOR PACKAGING MARKET FOR ORGANIC SUBSTRATES, BY REGION, 2020–2030 ($MILLION)

TABLE 08.SEMICONDUCTOR PACKAGING MARKET FOR BONDING-WIRE, BY REGION, 2020–2030($MILLION)

TABLE 09.SEMICONDUCTOR PACKAGING MARKET FOR LEADFRAMES, BY REGION, 2020–2030($MILLION)

TABLE 10.SEMICONDUCTOR PACKAGING FOR CERAMIC PACKAGES, BY REGION, 2020–2030($MILLION)

TABLE 11.SEMICONDUCTOR PACKAGING FOR DIE-ATTACH MATERIALS, BY REGION, 2020–2030($MILLION)

TABLE 12.SEMICONDUCTOR PACKAGING FOR OTHERS, BY REGION, 2020–2030($MILLION)

TABLE 13.GLOBAL SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)

TABLE 14.SEMICONDUCTOR PACKAGING MARKET FOR SIMPLE SEMICONDUCTOR, BY REGION, 2020–2030 ($MILLION)

TABLE 15.SEMICONDUCTOR PACKAGING MARKET, BY SUB-SEGMENT, 2020–2030 ($MILLION)

TABLE 16.SEMICONDUCTOR PACKAGING MARKET FOR SILICON (SI), BY REGION, 2020–2030 ($MILLION)

TABLE 17.SEMICONDUCTOR PACKAGING MARKET FOR GERMANIUM (GE), BY REGION, 2020–2030 ($MILLION)

TABLE 18.SEMICONDUCTOR PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY REGION, 2020–2030 ($MILLION)

TABLE 19.SEMICONDUCTOR PACKAGING MARKET, BY SUB-SEGMENT, 2020–2030 ($MILLION)

TABLE 20.SEMICONDUCTOR PACKAGING MARKET FOR III–V COMPOUND SEMICONDUCTORS, BY REGION, 2020–2030 ($MILLION)

TABLE 21.III–V COMPOUND SEMICONDUCTORS, BY SUB-SEGMENT, 2020–2030 ($MILLION)

TABLE 22.SEMICONDUCTOR PACKAGING MARKET FOR II-VI COMPOUND SEMICONDUCTORS, BY REGION, 2020–2030 ($MILLION)

TABLE 23.II-VI COMPOUND SEMICONDUCTORS, BY SUB-SEGMENT, 2020–2030 ($MILLION)

TABLE 24.SEMICONDUCTOR PACKAGING MARKET FOR IV-IV COMPOUND SEMICONDUCTORS, BY REGION, 2020–2030 ($MILLION)

TABLE 25.IV-IV COMPOUND SEMICONDUCTORS, BY SUB-SEGMENT, 2020–2030 ($MILLION)

TABLE 26.GLOBAL SEMICONDUCTOR PACKAGING, BY TECHNOLOGY, 2020–2030 ($MILLION)

TABLE 27.SEMICONDUCTOR PACKAGING MARKET FOR GRID ARRAY PACKAGE, BY REGION, 2020–2030 ($MILLION)

TABLE 28.SEMICONDUCTOR PACKAGING MARKET FOR SMALL OUTLINE PACKAGE, BY REGION, 2020–2030 ($MILLION)

TABLE 29.SEMICONDUCTOR PACKAGING MARKET FOR FLAT NO-LEADS PACKAGES, BY REGION, 2020–2030 ($MILLION)

TABLE 30.SEMICONDUCTOR PACKAGING MARKET FOR DUAL IN-LINE PACKAGE, BY REGION, 2020–2030($MILLION)

TABLE 31.SEMICONDUCTOR PACKAGING FOR OTHERS, BY REGION, 2020–2030($MILLION)

TABLE 32.SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020–2030 ($MILLION)

TABLE 33.SEMICONDUCTOR PACKAGING MARKET FOR CONSUMER ELECTRONICS, BY REGION, 2020–2030 ($MILLION)

TABLE 34.SEMICONDUCTOR PACKAGING FOR AUTOMOTIVE, BY REGION, 2020–2030 ($MILLION)

TABLE 35.SEMICONDUCTOR PACKAGING MARKET FOR HEALTHCARE, BY REGION, 2020–2030 ($MILLION)

TABLE 36.SEMICONDUCTOR PACKAGING MARKET FOR IT & TELECOMMUNICATION, BY REGION, 2020–2030 ($MILLION)

TABLE 37.SEMICONDUCTOR PACKAGING MARKET FOR AEROSPACE & DEFENSE, BY REGION, 2020–2030 ($MILLION)

TABLE 38.SEMICONDUCTOR PACKAGING MARKET FOR OTHERS, BY REGION, 2020–2030 ($MILLION)

TABLE 39.SEMICONDUCTOR PACKAGING MARKET REVENUE, BY REGION, 2020–2030 ($MILLION)

TABLE 40.NORTH AMERICA SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)

TABLE 41.NORTH AMERICA SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)

TABLE 42.NORTH AMERICA SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)

TABLE 43.NORTH AMERICA SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)

TABLE 44.NORTH AMERICA SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020–2030 ($MILLION)

TABLE 45.U.S. SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)

TABLE 46.U.S. SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)

TABLE 47.U.S. SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)

TABLE 48.U.S. SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)

TABLE 49.U.S. SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020-2030 ($MILLION)

TABLE 50.CANADA SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)

TABLE 51.CANADA SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)

TABLE 52.CANADA SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)

TABLE 53.CANADA SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)

TABLE 54.CANADA SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020-2030 ($MILLION)

TABLE 55.MEXICO SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)

TABLE 56.MEXICO SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)

TABLE 57.MEXICO SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)

TABLE 58.MEXICO SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)

TABLE 59.MEXICO SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020-2030 ($MILLION)

TABLE 60.EUROPE SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)

TABLE 61.EUROPE SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)

TABLE 62.EUROPE SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)

TABLE 63.EUROPE SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)

TABLE 64.EUROPE SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020–2030 ($MILLION)

TABLE 65.GERMANY SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)

TABLE 66.GERMANY SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)

TABLE 67.GERMANY SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)

TABLE 68.GERMANY SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)

TABLE 69.GERMANY SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020-2030 ($MILLION)

TABLE 70.UK SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)

TABLE 71.UK SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)

TABLE 72.UK SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)

TABLE 73.UK SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)

TABLE 74.UK SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020-2030 ($MILLION)

TABLE 75.FRANCE SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)

TABLE 76.FRANCE SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)

TABLE 77.FRANCE SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)

TABLE 78.FRANCE SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)

TABLE 79.FRANCE SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020-2030 ($MILLION)

TABLE 80.ITALY SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)

TABLE 81.ITALY SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)

TABLE 82.ITALY SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)

TABLE 83.ITALY SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)

TABLE 84.ITALY SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020-2030 ($MILLION)

TABLE 85.REST OF EUROPE SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)

TABLE 86.REST OF EUROPE SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)

TABLE 87.REST OF EUROPE SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)

TABLE 88.REST OF EUROPE SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)

TABLE 89.REST OF EUROPE SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020-2030 ($MILLION)

TABLE 90.ASIA-PACIFIC SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)

TABLE 91.ASIA-PACIFIC SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)

TABLE 92.ASIA-PACIFIC SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)

TABLE 93.ASIA-PACIFIC SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)

TABLE 94.ASIA-PACIFIC SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020–2030 ($MILLION)

TABLE 95.CHINA SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)

TABLE 96.CHINA SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)

TABLE 97.CHINA SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)

TABLE 98.CHINA SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)

TABLE 99.CHINA SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020-2030 ($MILLION)

TABLE 100.JAPAN SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)

TABLE 101.JAPAN SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)

TABLE 102.JAPAN SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)

TABLE 103.JAPAN SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)

TABLE 104.JAPAN SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020-2030 ($MILLION)

TABLE 105.INDIA SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)

TABLE 106.INDIA SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)

TABLE 107.INDIA SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)

TABLE 108.INDIA SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)

TABLE 109.INDIA SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020-2030 ($MILLION)

TABLE 110.SOUTH KOREA SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)

TABLE 111.SOUTH KOREA SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)

TABLE 112.SOUTH KOREA SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)

TABLE 113.SOUTH KOREA SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)

TABLE 114.SOUTH KOREA SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020-2030 ($MILLION)

TABLE 115.TAIWAN SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)

TABLE 116.TAIWAN SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)

TABLE 117.TAIWAN SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)

TABLE 118.TAIWAN SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)

TABLE 119.TAIWAN SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020-2030 ($MILLION)

TABLE 120.REST OF ASIA-PACIFIC SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)

TABLE 121.REST OF ASIA-PACIFIC SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)

TABLE 122.REST OF ASIA-PACIFIC SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)

TABLE 123.REST OF ASIA-PACIFIC SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)

TABLE 124.REST OF ASIA-PACIFIC SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020-2030 ($MILLION)

TABLE 125.LAMEA SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)

TABLE 126.LAMEA SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)

TABLE 127.LAMEA SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)

TABLE 128.LAMEA SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)

TABLE 129.LAMEA SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020–2030 ($MILLION)

TABLE 130.LATIN AMERICA SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)

TABLE 131.LATIN AMERICA SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)

TABLE 132.LATIN AMERICA SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)

TABLE 133.LATIN AMERICA SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)

TABLE 134.LATIN AMERICA SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020-2030 ($MILLION)

TABLE 135.MIDDLE EAST AND AFRICA SEMICONDUCTOR PACKAGING MARKET, BY TYPE, 2020–2030 ($MILLION)

TABLE 136.MIDDLE EAST AND AFRICA SEMICONDUCTOR PACKAGING MARKET, BY PACKAGING MATERIAL, 2020–2030 ($MILLION)

TABLE 137.MIDDLE EAST AND AFRICA SEMICONDUCTOR PACKAGING MARKET, BY WAFER MATERIAL, 2020–2030 ($MILLION)

TABLE 138.MIDDLE EAST AND AFRICA SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2020–2030 ($MILLION)

TABLE 139.MIDDLE EAST AND AFRICA SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2020-2030 ($MILLION)

TABLE 140.AMKOR TECHNOLOGY.: COMPANY SNAPSHOT

TABLE 141.AMKOR TECHNOLOGY: VIDEO ANALYTICS PRODUCT PORTFOLIO

TABLE 142.KEY EXECUTIVES

TABLE 143.ASE GROUP: COMPANY SNAPSHOT

TABLE 144.ASE GROUP: OPERATING SEGMENTS

TABLE 145.ASE GROUP: PRODUCT PORTFOLIO

TABLE 146.FUJITSU LIMITED: KEY EXECUTIVE

TABLE 147.FUJITSU LIMITED: COMPANY SNAPSHOT

TABLE 148.FUJITSU LIMITED: OPERATING SEGMENTS

TABLE 149.FUJITSU LIMITED: PRODUCT PORTFOLIO

TABLE 150.TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED:KEY EXECUTIVES

TABLE 151.TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: COMPANY SNAPSHOT

TABLE 152.TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: PRODUCT PORTFOLIO

TABLE 153.TEXAS INSTRUMENTS INCORPORATED:KEY EXECUTIVES

TABLE 154.TEXAS INSTRUMENTS INCORPORATED: COMPANY SNAPSHOT

TABLE 155.TI: OPERATING SEGMENTS

TABLE 156.TI: PRODUCT PORTFOLIO

TABLE 157.CHIPMOS TECHNOLOGY INC.:KEY EXECUTIVES

TABLE 158.CHIPMOS TECHNOLOGY INC.: COMPANY SNAPSHOT

TABLE 159.CHIPMOS TECHNOLOGY INC.: OPERATING SEGMENTS

TABLE 160.CHIPMOS TECHNOLOGY INC.: PRODUCT PORTFOLIO

TABLE 161.INTEL CORPORATION:KEY EXECUTIVES

TABLE 162.INTEL CORPORATION: COMPANY SNAPSHOT

TABLE 163.INTEL CORPORATION: OPERATING SEGMENTS

TABLE 164.INTEL CORPORATION: PRODUCT PORTFOLIO

TABLE 165.INTEL CORPORATION: KEY STRATEGIC MOVES AND DEVELOPMENTS

TABLE 166.SAMSUNG:KEY EXECUTIVES

TABLE 167.SAMSUNG: COMPANY SNAPSHOT

TABLE 168.SAMSUNG: OPERATING SEGMENTS

TABLE 169.SAMSUNG: PRODUCT PORTFOLIO

TABLE 170.SAMSUNG: KEY STRATEGIC MOVES AND DEVELOPMENTS

TABLE 171.POWER TECHNOLOGY INC.:KEY EXECUTIVES

TABLE 172.POWER TECHNOLOGY INC.: COMPANY SNAPSHOT

TABLE 173.POWER TECHNOLOGY INC.: PRODUCT CATEGORY

TABLE 174.POWER TECHNOLOGY INC.: PRODUCT PORTFOLIO

TABLE 175.POWER TECHNOLOGY INC.: KEY STRATEGIC MOVES AND DEVELOPMENTS

TABLE 176.JCET:KEY EXECUTIVES

TABLE 177.JCET: COMPANY SNAPSHOT

TABLE 178.JCET: OPERATING SEGMENTS

TABLE 179.JCET: PRODUCT PORTFOLIO

TABLE 180.JCET: KEY STRATEGIC MOVES AND DEVELOPMENTS