Outsourced Semiconductor Assembly and Testing Market By Service Type (Testing and Assembly), Packaging Type (Ball Grid Array, Chip Scale Package, Multi Package, Stacked Die, and Quad & Dual), and Application (Automotive, Consumer Electronics, Industrial, Telecommunication, and Others): Global Opportunity Analysis and Industry Forecast, 2021–2028

1.1.Report description

1.2.Key benefits for stakeholders

1.3.Key market segments

1.4.Research methodology

1.4.1.Primary research

1.4.2.Secondary research

1.4.3.Analyst tools and models

CHAPTER 2:EXECUTIVE SUMMARY

2.1.Key findings

2.1.1.Top impacting factors

2.1.2.Top investment pockets

2.2.CXO perspective

CHAPTER 3:MARKET OVERVIEW

3.1.Market definition and scope

3.2.Key forces shaping outsourced semiconductor assembly and test (OSAT) market

3.3.Market dynamics

3.3.1.Drivers

3.3.1.1.Increase in demand for consumer electronics

3.3.1.2.Surge in degree of urbanization across the globe

3.3.1.3.Increase in adoption of smartphones

3.3.2.Restraint

3.3.2.1.High cost associated with OSAT services

3.3.3.Opportunities

3.3.3.1.Chip market to provide a huge opportunity for OSAT companies

3.3.3.2.Rise in transition toward OSAT in emerging economies

3.4.COVID-19 impact analysis on outsourced semiconductor assembly and test (OSAT)

3.4.1.Impact on market size

3.4.2.End user trends, preferences, and budget impact

3.4.3.Key player strategies to tackle the COVID-19 impact

CHAPTER 4:OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY SERVICE TYPE

4.1.Overview

4.2.Testing

4.2.1.Key market trends, growth factors, and opportunities

4.2.2.Market size and forecast, by region

4.2.3.Market analysis, by country

4.3.Assembly

4.3.1.Key market trends, growth factors, and opportunities

4.3.2.Market size and forecast, by region

4.3.3.Market analysis, by country

CHAPTER 5:OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY PACKAGING TYPE

5.1.Overview

5.2.Ball grid array

5.2.1.Key market trends, growth factors, and opportunities

5.2.2.Market size and forecast, by region

5.2.3.Market analysis, by country

5.3.Chip scale package

5.3.1.Key market trends, growth factors, and opportunities

5.3.2.Market size and forecast, by region

5.3.3.Market analysis, by country

5.4.Multi-package

5.4.1.Key market trends, growth factors, and opportunities

5.4.2.Market size and forecast, by region

5.4.3.Market analysis, by country

5.5.Stacked die

5.5.1.Key market trends, growth factors, and opportunities

5.5.2.Market size and forecast, by region

5.5.3.Market analysis, by country

5.6.Quad & dual

5.6.1.Key market trends, growth factors, and opportunities

5.6.2.Market size and forecast, by region

5.6.3.Market analysis, by country

CHAPTER 6:OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY APPLICATION

6.1.Overview

6.2.Automotive

6.2.1.Key market trends, growth factors, and opportunities

6.2.2.Market size and forecast, by region

6.2.3.Market analysis, by country

6.3.Consumer electronics

6.3.1.Key market trends, growth factors, and opportunities

6.3.2.Market size and forecast, by region

6.3.3.Market analysis, by country

6.4.Industrial

6.4.1.Key market trends, growth factors, and opportunities

6.4.2.Market size and forecast, by region

6.4.3.Market analysis, by country

6.5.Telecommunication

6.5.1.Key market trends, growth factors, and opportunities

6.5.2.Market size and forecast, by region

6.5.3.Market analysis, by country

6.6.Others

6.6.1.Key market trends, growth factors, and opportunities

6.6.2.Market size and forecast, by region

6.6.3.Market analysis, by country

CHAPTER 7:OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY REGION

7.1.Overview

7.2.North America

7.2.1.Key market trends, growth factors, and opportunities

7.2.2.Market size and forecast, by service type

7.2.3.Market size and forecast, by packaging type

7.2.4.Market size and forecast, by application

7.2.5.Market analysis, by country

7.2.5.1.U.S.

7.2.5.1.1.Market size and forecast, by service type

7.2.5.1.2.Market size and forecast, by packaging type

7.2.5.1.3.Market size and forecast, by application

7.2.5.2.Canada

7.2.5.2.1.Market size and forecast, by service type

7.2.5.2.2.Market size and forecast, by packaging type

7.2.5.2.3.Market size and forecast, by application

7.2.5.3.Mexico

7.2.5.3.1.Market size and forecast, by service type

7.2.5.3.2.Market size and forecast, by packaging type

7.2.5.3.3.Market size and forecast, by application

7.3.Europe

7.3.1.Key market trends, growth factors, and opportunities

7.3.2.Market size and forecast, by service type

7.3.3.Market size and forecast, by packaging type

7.3.4.Market size and forecast, by application

7.3.5.Market analysis, by country

7.3.5.1.UK

7.3.5.1.1.Market size and forecast, by service type

7.3.5.1.2.Market size and forecast, by packaging type

7.3.5.1.3.Market size and forecast, by application

7.3.5.2.Germany

7.3.5.2.1.Market size and forecast, by service type

7.3.5.2.2.Market size and forecast, by packaging type

7.3.5.2.3.Market size and forecast, by application

7.3.5.3.France

7.3.5.3.1.Market size and forecast, by service type

7.3.5.3.2.Market size and forecast, by packaging type

7.3.5.3.3.Market size and forecast, by application

7.3.5.4.Russia

7.3.5.4.1.Market size and forecast, by service type

7.3.5.4.2.Market size and forecast, by packaging type

7.3.5.4.3.Market size and forecast, by application

7.3.5.5.Rest of Europe

7.3.5.5.1.Market size and forecast, by service type

7.3.5.5.2.Market size and forecast, by packaging type

7.3.5.5.3.Market size and forecast, by application

7.4.Asia-Pacific

7.4.1.Key market trends, growth factors, and opportunities

7.4.2.Market size and forecast, by service type

7.4.3.Market size and forecast, by packaging type

7.4.4.Market size and forecast, by application

7.4.5.Market analysis, by country

7.4.5.1.China

7.4.5.1.1.Market size and forecast, by service type

7.4.5.1.2.Market size and forecast, by packaging type

7.4.5.1.3.Market size and forecast, by application

7.4.5.2.Japan

7.4.5.2.1.Market size and forecast, by service type

7.4.5.2.2.Market size and forecast, by packaging type

7.4.5.2.3.Market size and forecast, by application

7.4.5.3.India

7.4.5.3.1.Market size and forecast, by service type

7.4.5.3.2.Market size and forecast, by packaging type

7.4.5.3.3.Market size and forecast, by application

7.4.5.4.Taiwan

7.4.5.4.1.Market size and forecast, by service type

7.4.5.4.2.Market size and forecast, by packaging type

7.4.5.4.3.Market size and forecast, by application

7.4.5.5.Rest of Asia-Pacific

7.4.5.5.1.Market size and forecast, by service type

7.4.5.5.2.Market size and forecast, by packaging type

7.4.5.5.3.Market size and forecast, by application

7.5.LAMEA

7.5.1.Key market trends, growth factors, and opportunities

7.5.2.Market size and forecast, by service type

7.5.3.Market size and forecast, by packaging type

7.5.4.Market size and forecast, by application

7.5.5.Market analysis, by country

7.5.5.1.Latin America

7.5.5.1.1.Market size and forecast, by service type

7.5.5.1.2.Market size and forecast, by packaging type

7.5.5.1.3.Market size and forecast, by application

7.5.5.2.Middle East

7.5.5.2.1.Market size and forecast, by service type

7.5.5.2.2.Market size and forecast, by packaging type

7.5.5.2.3.Market size and forecast, by application

7.5.5.3.Africa

7.5.5.3.1.Market size and forecast, by service type

7.5.5.3.2.Market size and forecast, by packaging type

7.5.5.3.3.Market size and forecast, by application

CHAPTER 8:COMPETITIVE LANDSCAPE

8.1.Introduction

8.2.Key players Positioning, 2020

8.3.Top winning strategies

8.3.1.Top winning strategies, by year

8.3.2.Top winning strategies, by development

8.3.3.Top winning strategies, by company

CHAPTER 9:COMPANY PROFILES

9.1.AMKOR TECHNOLOGY, INC.

9.1.1.Company overview

9.1.2.Key executives

9.1.3.Company snapshot

9.1.4.Operating business segments

9.1.5.Product portfolio

9.1.6.R&D expenditure

9.1.7.Business performance

9.1.8.Key strategic moves and developments

9.2.ASE TECHNOLOGY HOLDING, CO., LTD.

9.2.1.Company overview

9.2.2.Key executives

9.2.3.Company snapshot

9.2.4.Operating business segments

9.2.5.Product portfolio

9.2.6.R&D expenditure

9.2.7.Business performance

9.2.8.Key strategic moves and developments

9.3.CHIPMOS TECHNOLOGY INC.

9.3.1.Company overview

9.3.2.Key executives

9.3.3.Company snapshot

9.3.4.Operating business segments

9.3.5.Product portfolio

9.3.6.R&D expenditure

9.3.7.Business performance

9.4.HANA MICRON INC.

9.4.1.Company overview

9.4.2.Key executives

9.4.3.Company snapshot

9.4.4.Operating business segments

9.4.5.Product portfolio

9.4.6.R&D expenditure

9.4.7.Business performance

9.4.8.Key strategic moves and developments

9.5.JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD (JCET)

9.5.1.Company overview

9.5.2.Key executives

9.5.3.Company snapshot

9.5.4.Operating business segments

9.5.5.Product portfolio

9.5.6.R&D expenditure

9.5.7.Business performance

9.5.8.Key strategic moves and developments

9.6.KING YUAN ELECTRONICS CORP. (KYEC)

9.6.1.Company overview

9.6.2.Key executives

9.6.3.Company snapshot

9.6.4.Operating business segments

9.6.5.Product portfolio

9.6.6.R&D expenditure

9.6.7.Business performance

9.6.8.Key strategic moves and developments

9.7.POWERTECH TECHNOLOGY INC. (PTI)

9.7.1.Company overview

9.7.2.Key executives

9.7.3.Company snapshot

9.7.4.Operating business segments

9.7.5.Product portfolio

9.7.6.R&D expenditure

9.7.7.Business performance

9.7.8.Key strategic moves and developments

9.8.TIANSHUI HUATIAN TECHNOLOGY CO., LTD

9.8.1.Company overview

9.8.2.Key executives

9.8.3.Company snapshot

9.8.4.Operating business segments

9.8.5.Product portfolio

9.8.6.Business performance

9.9.TONGFU MICROELECTRONICS CO., LTD

9.9.1.Company overview

9.9.2.Key executives

9.9.3.Company snapshot

9.9.4.Operating business segments

9.9.5.Product portfolio

9.9.6.Business performance

9.9.7.Key strategic moves and developments

9.10.UNISEM GROUP

9.10.1.Company overview

9.10.2.Key executives

9.10.3.Company snapshot

9.10.4.Operating business segments

9.10.5.Product portfolio

9.10.6.R&D expenditure

9.10.7.Business performance

9.10.8.Key strategic moves and developments

TABLE 01.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET, BY SERVICE TYPE, 2019–2028 ($MILLION)

TABLE 02.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR TESTING, BY REGION 2019–2028 ($MILLION)

TABLE 03.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR ASSEMBLY, BY REGION 2019–2028 ($MILLION)

TABLE 04.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2019–2028 ($MILLION)

TABLE 05.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR BALL GRID ARRAY, BY REGION 2019–2028 ($MILLION)

TABLE 06.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR CHIP SCALE PACKAGE, BY REGION 2019–2028 ($MILLION)

TABLE 07.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR MULTI-PACKAGE, BY REGION 2019–2028 ($MILLION)

TABLE 08.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR STACKED DIE, BY REGION 2019-2028 ($MILLION)

TABLE 09.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR QUAD & DUAL, BY REGION 2019-2028 ($MILLION)

TABLE 10.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)

TABLE 11.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR AUTOMOTIVE, BY REGION 2019–2028 ($MILLION)

TABLE 12.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR CONSUMER ELECTRONICS, BY REGION 2019–2028($MILLION)

TABLE 13.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR INDUSTRIAL, BY REGION 2019–2028 ($MILLION)

TABLE 14.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR TELECOMMUNICATION, BY REGION 2019–2028 ($MILLION)

TABLE 15.OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE FOR OTHERS, BY REGION 2019-2028 ($MILLION)

TABLE 16.NORTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE 2019–2028 ($MILLION)

TABLE 17.NORTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE 2019–2028($MILLION)

TABLE 18.NORTH AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION 2019–2028 ($MILLION)

TABLE 19.U.S. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE, 2019-2028 ($MILLION)

TABLE 20.U.S. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2019–2028 ($MILLION)

TABLE 21.U.S. OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)

TABLE 22.CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE, 2019–2028 ($MILLION)

TABLE 23.CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2019–2028 ($MILLION)

TABLE 24.CANADA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION 2019–2028 ($MILLION)

TABLE 25.MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE, 2019–2028 ($MILLION)

TABLE 26.MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE 2019–2028 ($MILLION)

TABLE 27.MEXICO OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)

TABLE 28.EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE, 2019–2028 ($MILLION)

TABLE 29.EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2019–2028 ($MILLION)

TABLE 30.EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)

TABLE 31.UK OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE, 2019–2028 ($MILLION)

TABLE 32.UK OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2019–2028 ($MILLION)

TABLE 33.UK OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)

TABLE 34.GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE, 2019–2028 ($MILLION)

TABLE 35.GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2019–2028 ($MILLION)

TABLE 36.GERMANY OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)

TABLE 37.FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE, 2019–2028 ($MILLION)

TABLE 38.FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2019–2028 ($MILLION)

TABLE 39.FRANCE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)

TABLE 40.RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE2019–2028 ($MILLION)

TABLE 41.RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2019–2028 ($MILLION)

TABLE 42.RUSSIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)

TABLE 43.REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE, TYPE2019–2028 ($MILLION)

TABLE 44.REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2019–2028 ($MILLION)

TABLE 45.REST OF EUROPE OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)

TABLE 46.ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE, 2019–2028 ($MILLION)

TABLE 47.ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2019–2028($MILLION)

TABLE 48.ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)

TABLE 49.CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE2019–2028 ($MILLION)

TABLE 50.CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE 2019–2028 ($MILLION)

TABLE 51.CHINA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)

TABLE 52.JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE, 2019–2028 ($MILLION)

TABLE 53.JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2019–2028 ($MILLION)

TABLE 54.JAPAN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)

TABLE 55.INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE, 2019–2028 ($MILLION)

TABLE 56.INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2019–2028 ($MILLION)

TABLE 57.INDIA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)

TABLE 58.TAIWAN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE, 2019–2028 ($MILLION)

TABLE 59.TAIWAN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2019–2028 ($MILLION)

TABLE 60.TAIWAN OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)

TABLE 61.REST OF ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE, 2019–2028($MILLION)

TABLE 62.REST OF ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE 2019–2028($MILLION)

TABLE 63.REST OF ASIA-PACIFIC OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)

TABLE 64.LAMEA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE, 2019–2028 ($MILLION)

TABLE 65.LAMEA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2019–2028 ($MILLION)

TABLE 66.LAMEA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)

TABLE 67.LATIN AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE, 2019–2028 ($MILLION)

TABLE 68.LATIN AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2019–2028 ($MILLION)

TABLE 69.LATIN AMERICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)

TABLE 70.MIDDLE EAST OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE, 2019–2028 ($MILLION)

TABLE 71.MIDDLE EAST OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2019–2028($MILLION)

TABLE 72.MIDDLE EAST OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)

TABLE 73.AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY SERVICE TYPE, 2019–2028 ($MILLION)

TABLE 74.AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY PACKAGING TYPE, 2019–2028 ($MILLION)

TABLE 75.AFRICA OUTSOURCED SEMICONDUCTOR ASSEMBLY AND TEST (OSAT) MARKET REVENUE, BY APPLICATION, 2019–2028 ($MILLION)

TABLE 76.AMKOR TECHNOLOGY, INC.:KEY EXECUTIVES

TABLE 77.AMKOR TECHNOLOGY, INC.: COMPANY SNAPSHOT

TABLE 78.AMKOR TECHNOLOGY, INC.: OPERATING SEGMENTS

TABLE 79.AMKOR TECHNOLOGY, INC.: PRODUCT PORTFOLIO

TABLE 80.AMKOR TECHNOLOGY, INC.: KEY STRATEGIC MOVES AND DEVELOPMENTS

TABLE 81.ASE TECHNOLOGY HOLDING, CO., LTD:KEY EXECUTIVES

TABLE 82.ASE TECHNOLOGY HOLDING, CO., LTD: COMPANY SNAPSHOT

TABLE 83.ASE TECHNOLOGY HOLDING, CO., LTD: OPERATING SEGMENTS

TABLE 84.ASE TECHNOLOGY HOLDING, CO., LTD: PRODUCT PORTFOLIO

TABLE 85.ASE TECHNOLOGY HOLDING, CO., LTD: KEY STRATEGIC MOVES AND DEVELOPMENTS

TABLE 86.CHIPMOS TECHNOLOGY INC.:KEY EXECUTIVES

TABLE 87.CHIPMOS TECHNOLOGY INC.: COMPANY SNAPSHOT

TABLE 88.CHIPMOS TECHNOLOGY INC.: OPERATING SEGMENTS

TABLE 89.CHIPMOS TECHNOLOGY INC.: PRODUCT PORTFOLIO

TABLE 90.HANA MICRON INC.:KEY EXECUTIVES

TABLE 91.HANA MICRON INC.: COMPANY SNAPSHOT

TABLE 92.HANA MICRON INC.: OPERATING SEGMENTS

TABLE 93.HANA MICRON INC.: PRODUCT PORTFOLIO

TABLE 94.HANA MICRON INC.: KEY STRATEGIC MOVES AND DEVELOPMENTS

TABLE 95.JCET:KEY EXECUTIVES

TABLE 96.JCET: COMPANY SNAPSHOT

TABLE 97.JCET: OPERATING SEGMENTS

TABLE 98.JCET: PRODUCT PORTFOLIO

TABLE 99.JCET: KEY STRATEGIC MOVES AND DEVELOPMENTS

TABLE 100.KING YUAN ELECTRONICS CORP.:KEY EXECUTIVES

TABLE 101.KING YUAN ELECTRONICS CORP.: COMPANY SNAPSHOT

TABLE 102.KING YUAN ELECTRONICS CORP.: OPERATING SEGMENTS

TABLE 103.KING YUAN ELECTRONICS CORP.: PRODUCT PORTFOLIO

TABLE 104.KING YUAN ELECTRONICS CORP.: KEY STRATEGIC MOVES AND DEVELOPMENTS

TABLE 105.POWER TECHNOLOGY INC.:KEY EXECUTIVES

TABLE 106.POWER TECHNOLOGY INC.: COMPANY SNAPSHOT

TABLE 107.POWER TECHNOLOGY INC.: PRODUCT CATEGORY

TABLE 108.POWER TECHNOLOGY INC.: PRODUCT PORTFOLIO

TABLE 109.POWER TECHNOLOGY INC.: KEY STRATEGIC MOVES AND DEVELOPMENTS

TABLE 110.TIANSHUI HUATIAN TECHNOLOGY CO., LTD:KEY EXECUTIVES

TABLE 111.TIANSHUI HUATIAN TECHNOLOGY CO., LTD: COMPANY SNAPSHOT

TABLE 112.TIANSHUI HUATIAN TECHNOLOGY CO., LTD: OPERATING SEGMENTS

TABLE 113.TIANSHUI HUATIAN TECHNOLOGY CO., LTD: PRODUCT PORTFOLIO

TABLE 114.TONGFU MICROELECTRONICS CO., LTD:KEY EXECUTIVES

TABLE 115.TONGFU MICROELECTRONICS CO., LTD: COMPANY SNAPSHOT

TABLE 116.TONGFU MICROELECTRONICS CO., LTD: OPERATING SEGMENTS

TABLE 117.TONGFU MICROELECTRONICS CO., LTD: PRODUCT PORTFOLIO

TABLE 118.TONGFU MICROELECTRONICS CO., LTD: KEY STRATEGIC MOVES AND DEVELOPMENTS

TABLE 119.UNISEM GROUP:KEY EXECUTIVES

TABLE 120.UNISEM GROUP: COMPANY SNAPSHOT

TABLE 121.UNISEM GROUP: OPERATING SEGMENTS

TABLE 122.UNISEM GROUP: PRODUCT PORTFOLIO

TABLE 123.UNISEM GROUP: KEY STRATEGIC MOVES AND DEVELOPMENTS