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Audio IC Market By IC Type (Audio Amplifier, Audio DSP, Audio Codecs, and Microphone IC) and Application (Computer & Tablets, Phones, Headphones, Home Entertainment Systems, Automotive, Smart Home & IoT Devices, and Wearables): Global Opportunity Analysis and Industry Forecast, 2020–2027

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  • 307 Pages
  • April 2021
  • Semiconductor and Electronics
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The global audio IC market size was valued at $27.72 Billion in 2019, and is projected to reach $45.57 Billion by 2027, to register a CAGR of 7.09% from 2020 to 2027. Audio IC is an electronic device, which is used in audio processors, MEMS microphones, audio amplifiers, and subsystems. Various types of audio ICs include audio amplifiers, audio converters, audio DSPs, and audio processors. Audio amplifiers are used in sound systems such as home audio systems, musical instruments systems, loudspeakers, and sound reinforcement.

The purpose of an amplifier is to increase vibrations to the maximum extent of signals without affecting frequency or any wavelength, and help improve efficiency of a system. In addition, a digital sound processor (DSP) is a specialized microprocessor chip widely used in audio signal processing, telecommunications, digital image processing, radar, sonar and speech recognition systems, and consumer electronic devices such as mobile phones, disk drives, and high-definition television (HDTV) products.

Increase in adoption of consumer electronics devices and development of new energy efficient audio devices with enhanced user experience drives growth of the audio IC market. In addition, rise in penetration of wireless and smart infrastructure and surge in demand for Hi-Fi audio in commercial events fuel growth of the market. However, increase in demand for audio SoCs and technical faults and issues associated with integration of audio devices is a major restraint for the global audio IC industry. Furthermore, rise in demand for on-board media entertainment systems and development of VR technology is expected to create opportunities for the audio IC industry.

The global audio IC market is segmented on the basis of IC type, application, and region. By IC type, the market is segmented into audio amplifier, audio DSP, audio codecs, and microphone IC. The application segment is divided into computer & tablets, phones, headphones, home entertainment systems, automotive, smart home & IoT devices, and wearables. Region wise, the audio IC market trends have been analyzed across North America, Europe, Asia-Pacific, and LAMEA.

The key players operating in the market include as Analog Devices, Inc., Cirrus Logic, NXP Semiconductors, STMicroelectronics, Maxim Integrated, ROHM CO., LTD., Texas Instruments, ON Semiconductors, Toshiba Corporation, and Infineon. These key players have adopted various strategies, such as product portfolio expansion, mergers & acquisitions, agreements, geographical expansion, and collaborations, to increase their market penetration and strengthen their foothold in the industry.

Audio IC Market Key Segments

By IC Type

• Audio Amplifier

• Audio DSP

• Audio Codecs

• Microphone IC

By Application

• Computer & Tablets

• Phones

• Headphones

• Home Entertainment Systems

• Automotive

• Smart Home & IoT devices

• Wearables

• Others

By Region

• North America

o U.S.

o Canada

o Mexico

• Europe

o Sweden

o France

o Germany

o Russia

o Rest of Europe

• Asia-Pacific

o China

o Japan

o India

o Rest of Asia-Pacific

• LAMEA

o Latin America

o Middle East

o Africa

Key Market Players

• Analog Devices Inc.

• Cirrus Logic

• NXP Semiconductors

• STMicroelectronics

• Maxim Integrated

• ROHM CO. LTD.

• Texas Instruments

• ON Semiconductors

• Toshiba Corporation

• Infineon

CHAPTER 1:INTRODUCTION

1.1.Report description

1.2.Key benefits for stakeholders

1.3.Key market segments

1.4.Research methodology

1.4.1.Primary research

1.4.2.Secondary research

1.4.3.Analyst tools and models

CHAPTER 2:EXECUTIVE SUMMARY

2.1.CXO perspective

CHAPTER 3:MARKET OVERVIEW

3.1.Market definition and scope

3.2.Key findings

3.2.1.Top impacting factors

3.2.2.Top investment pockets

3.3.Porter’s five forces analysis

3.4.Market Share Analysis, 2019

3.4.1.Top 5 players revenue share, 2019

3.4.2.Top 5 players volume share, 2019

3.5.Market dynamics

3.5.1.Drivers

3.5.1.1.Increased adoption of consumer electronics devices

3.5.1.2.Development of new energy efficient audio devices with enhanced user experience

3.5.1.3.Rising penetration of wireless and smart infrastructure

3.5.1.4.Surge in demand for HiFi audio in commercial events

3.5.2.Restraint

3.5.2.1.Increase in demand for Audio SoC

3.5.2.2.Technological issues related with integration of audio devices

3.5.3.Opportunities

3.5.3.1.Rise in demand for on-board media entertainment systems

3.5.3.2.Development of VR technology

3.6.COVID-19 Impact Analysis

3.6.1.Impact on market size

3.6.2.End user trends, preferences, and budget impact

3.6.3.Key player strategies to tackle COVID-19 impact

CHAPTER 4:AUDIO IC MARKET, BY IC TYPE

4.1.Overview

4.2.Audio amplifier

4.2.1.Key market trends, growth factors, and opportunities

4.2.2.Market size and forecast, by region

4.2.3.Market analysis, by country

4.3.Audio DSP

4.3.1.Key market trends, growth factors, and opportunities

4.3.2.Market size and forecast, by region

4.3.3.Market analysis, by country

4.4.Audio Codecs

4.4.1.Key market trends, growth factors, and opportunities

4.4.2.Market size and forecast, by region

4.4.3.Market analysis, by country

4.5.Microphone IC

4.5.1.Key market trends, growth factors, and opportunities

4.5.2.Market size and forecast, by region

4.5.3.Market analysis, by country

CHAPTER 5:AUDIO IC MARKET, BY APPLICATION

5.1.Overview

5.2.Computer & Tablets

5.2.1.Key market trends, growth factors, and opportunities

5.2.2.Market size and forecast, by region

5.2.3.Market analysis, by country

5.3.Phones

5.3.1.Key market trends, growth factors, and opportunities

5.3.2.Market size and forecast, by region

5.3.3.Market analysis, by country

5.4.Headphones

5.4.1.Key market trends, growth factors, and opportunities

5.4.2.Market size and forecast, by region

5.4.3.Market analysis, by country

5.5.Home entertainment system

5.5.1.Key market trends, growth factors, and opportunities

5.5.2.Market size and forecast, by region

5.5.3.Market analysis, by country

5.6.Automotive

5.6.1.Key market trends, growth factors, and opportunities

5.6.2.Market size and forecast, by region

5.6.3.Market analysis, by country

5.7.Smart home & IoT devices

5.7.1.Key market trends, growth factors, and opportunities

5.7.2.Market size and forecast, by region

5.7.3.Market analysis, by country

5.8.Wearables

5.8.1.Key market trends, growth factors, and opportunities

5.8.2.Market size and forecast, by region

5.8.3.Market analysis, by country

CHAPTER 6:AUDIO IC MARKET, BY REGION

6.1.Overview

6.2.North America

6.2.1.Key market trends, growth factors, and opportunities

6.2.2.Market size and forecast, by IC type

6.2.3.Market size and forecast, by application

6.2.4.Market analysis, by country

6.2.4.1.U.S.

6.2.4.1.1.Market size and forecast, by IC type

6.2.4.1.2.Market size and forecast, by application

6.2.4.2.Canada

6.2.4.2.1.Market size and forecast, by IC type

6.2.4.2.2.Market size and forecast, by application

6.2.4.3.Mexico

6.2.4.3.1.Market size and forecast, by IC type

6.2.4.3.2.Market size and forecast, by application

6.3.Europe

6.3.1.Key market trends, growth factors, and opportunities

6.3.2.Market size and forecast, by IC type

6.3.3.Market size and forecast, by application

6.3.4.Market analysis, by country

6.3.4.1.Germany

6.3.4.1.1.Market size and forecast, by IC type

6.3.4.1.2.Market size and forecast, by application

6.3.4.2.France

6.3.4.2.1.Market size and forecast, by IC type

6.3.4.2.2.Market size and forecast, by application

6.3.4.3.UK

6.3.4.3.1.Market size and forecast, by IC type

6.3.4.3.2.Market size and forecast, by application

6.3.4.4.Italy

6.3.4.4.1.Market size and forecast, by IC type

6.3.4.4.2.Market size and forecast, by application

6.3.4.5.Rest of Europe

6.3.4.5.1.Market size and forecast, by IC type

6.3.4.5.2.Market size and forecast, by application

6.4.Asia-Pacific

6.4.1.Key market trends, growth factors, and opportunities

6.4.2.Market size and forecast, by IC type

6.4.3.Market size and forecast, by application

6.4.4.Market analysis, by country

6.4.4.1.China

6.4.4.1.1.Market size and forecast, by IC type

6.4.4.1.2.Market size and forecast, by application

6.4.4.2.Japan

6.4.4.2.1.Market size and forecast, by IC type

6.4.4.2.2.Market size and forecast, by application

6.4.4.3.India

6.4.4.3.1.Market size and forecast, by IC type

6.4.4.3.2.Market size and forecast, by application

6.4.4.4.South Korea

6.4.4.4.1.Market size and forecast, by IC type

6.4.4.4.2.Market size and forecast, by application

6.4.4.5.Rest of Asia-Pacific

6.4.4.5.1.Market size and forecast, by IC type

6.4.4.5.2.Market size and forecast, by application

6.5.LAMEA

6.5.1.Key market trends, growth factors, and opportunities

6.5.2.Market size and forecast, by IC type

6.5.3.Market size and forecast, by application

6.5.4.Market analysis, by country

6.5.4.1.Latin America

6.5.4.1.1.Market size and forecast, by IC type

6.5.4.1.2.Market size and forecast, by application

6.5.4.2.Middle East

6.5.4.2.1.Market size and forecast, by IC type

6.5.4.2.2.Market size and forecast, by application

6.5.4.3.Africa

6.5.4.3.1.Market size and forecast, by IC type

6.5.4.3.2.Market size and forecast, by application

CHAPTER 7:COMPETITIVE LANDSCAPE

7.1.Introduction

7.1.1.Market Player Positioning, 2019

7.2.Top Winning Strategies

7.3.Product Mapping of Top 10 Players

7.4.Competitive Dashboard

7.5.Competitive Heatmap

7.6.Key Developments

7.6.1.New Product Launches

7.6.2.Mergers and Acquisitions

7.6.3.Other Developments

CHAPTER 8:COMPANY PROFILES

8.1.Analog Devices, Inc. (ADI)

8.1.1.Company overview

8.1.2.Key executives

8.1.3.Company snapshot

8.1.4.Product portfolio

8.1.5.R&D expenditure

8.1.6.Business performance

8.1.7.Key strategic moves and developments

8.2.Cirrus Logic, Inc.

8.2.1.Company overview

8.2.2.Key executives

8.2.3.Company snapshot

8.2.4.Product portfolio

8.2.5.R&D expenditure

8.2.6.Business performance

8.2.7.Key strategic moves and developments

8.3.Infineon Technologies AG

8.3.1.Company overview

8.3.2.Key executives

8.3.3.Company snapshot

8.3.4.Operating business segments

8.3.5.Product portfolio

8.3.6.R&D expenditure

8.3.7.Business performance

8.3.8.Key strategic moves and developments

8.4.Maxim Integrated

8.4.1.Company overview

8.4.2.Key executives

8.4.3.Company snapshot

8.4.4.Product portfolio

8.4.5.R&D expenditure

8.4.6.Business performance

8.4.7.Key strategic moves and developments

8.5.NXP Semiconductor

8.5.1.Company overview

8.5.2.Company snapshot

8.5.3.Product portfolio

8.5.4.R&D Expenditure

8.5.5.Business performance

8.5.6.Key strategic moves and developments

8.6.ON Semiconductor

8.6.1.Company overview

8.6.2.Key executives

8.6.3.Company snapshot

8.6.4.Operating business segments

8.6.5.Product portfolio

8.6.6.R&D expenditure

8.6.7.Business performance

8.6.8.Key strategic moves and developments

8.7.ROHM CO., LTD.

8.7.1.Company overview

8.7.2.Key executives

8.7.3.Company snapshot

8.7.4.Product portfolio

8.7.5.R&D expenditure

8.7.6.Business performance

8.7.7.Key strategic moves and developments

8.8.STMICROELECTRONICS N.V.

8.8.1.Company overview

8.8.2.Company snapshot

8.8.3.Operating business segments

8.8.4.Product portfolio

8.8.5.R&D Expenditure

8.8.6.Business performance

8.8.7.Key strategic moves and developments

8.9.TEXAS INSTRUMENTS INCORPORATED

8.9.1.Company overview

8.9.2.Key Executives

8.9.3.Company snapshot

8.9.4.Operating business segments

8.9.5.Product portfolio

8.9.6.R&D Expenditure

8.9.7.Business performance

8.9.8.Key strategic moves and developments

8.10.TOSHIBA CORPORATION

8.10.1.Company overview

8.10.2.Key Executives

8.10.3.Company snapshot.

8.10.4.Operating business segments

8.10.5.Product portfolio

8.10.6.R&D Expenditure

8.10.7.Business performance

8.10.8.Key strategic moves and developments

LIST OF TABLES

TABLE 01.AUDIO IC MARKET, BY IC TYPE, 2019–2027 ($MILLION)

TABLE 02.AUDIO IC MARKET FOR AUDIO AMPLIFIER, BY REGION, 2019–2027 ($MILLION)

TABLE 03.AUDIO IC MARKET FOR AUDIO DSP, BY REGION, 2019–2027 ($MILLION)

TABLE 04.AUDIO IC MARKET FOR AUDIO CODECS, BY REGION, 2019–2027 ($MILLION)

TABLE 05.AUDIO IC MARKET FOR MICROPHONE IC, BY REGION, 2019–2027 ($MILLION)

TABLE 06.AUDIO IC MARKET, BY APPLICATION, 2019–2027 ($MILLION)

TABLE 07.AUDIO IC MARKET FOR COMPUTER & TABLETS, BY REGION, 2019–2027 ($MILLION)

TABLE 08.AUDIO IC MARKET FOR PHONES, BY REGION, 2019–2027 ($MILLION)

TABLE 09.AUDIO IC MARKET FOR OVER-EAR HEADPHONES, BY REGION, 2019–2027 ($MILLION)

TABLE 10.AUDIO IC MARKET FOR HOME ENTERTAINMENT, BY REGION, 2019–2027 ($MILLION)

TABLE 11.AUDIO IC MARKET FOR AUTOMOTIVE, BY REGION, 2019–2027 ($MILLION)

TABLE 12.AUDIO IC MARKET FOR SMART HOME & IOT DEVICES, BY REGION, 2019–2027 ($MILLION)

TABLE 13.AUDIO IC MARKET FOR WEARABLES, BY REGION, 2019–2027 ($MILLION)

TABLE 14.AUDIO IC MARKET REVENUE, BY REGION, 2019–2027 ($MILLION)

TABLE 15.NORTH AMERICA AUDIO IC MARKET, BY IC TYPE, 2019–2027 ($MILLION)

TABLE 16.NORTH AMERICA AUDIO IC MARKET, BY APPLICATION, 2019–2027 ($MILLION)

TABLE 17.U.S. AUDIO IC MARKET, BY IC TYPE, 2019–2027 ($MILLION)

TABLE 18.U.S. AUDIO IC MARKET, BY APPLICATION, 2019–2027 ($MILLION)

TABLE 19.CANADA AUDIO IC MARKET, BY IC TYPE, 2019–2027 ($MILLION)

TABLE 20.CANADA AUDIO IC MARKET, BY APPLICATION, 2019–2027 ($MILLION)

TABLE 21.MEXICO AUDIO IC MARKET, BY IC TYPE, 2019–2027 ($MILLION)

TABLE 22.MEXICO AUDIO IC MARKET, BY APPLICATION, 2019–2027 ($MILLION)

TABLE 23.EUROPE AUDIO IC MARKET, BY IC TYPE, 2019–2027 ($MILLION)

TABLE 24.EUROPE AUDIO IC MARKET, BY APPLICATION, 2019–2027 ($MILLION)

TABLE 25.GERMANY AUDIO IC MARKET, BY IC TYPE, 2019–2027 ($MILLION)

TABLE 26.GERMANY AUDIO IC MARKET, BY APPLICATION, 2019–2027 ($MILLION)

TABLE 27.FRANCE AUDIO IC MARKET, BY IC TYPE, 2019–2027 ($MILLION)

TABLE 28.FRANCE AUDIO IC MARKET, BY APPLICATION, 2019–2027 ($MILLION)

TABLE 29.UK AUDIO IC MARKET, BY IC TYPE, 2019–2027 ($MILLION)

TABLE 30.UK AUDIO IC MARKET, BY APPLICATION, 2019–2027 ($MILLION)

TABLE 31.ITALY AUDIO IC MARKET, BY IC TYPE, 2019–2027 ($MILLION)

TABLE 32.ITALY AUDIO IC MARKET, BY APPLICATION, 2019–2027 ($MILLION)

TABLE 33.REST OF EUROPE AUDIO IC MARKET, BY IC TYPE, 2019–2027 ($MILLION)

TABLE 34.REST OF EUROPE AUDIO IC MARKET, BY APPLICATION, 2019–2027 ($MILLION)

TABLE 35.ASIA-PACIFIC AUDIO IC MARKET, BY IC TYPE, 2019–2027 ($MILLION)

TABLE 36.ASIA-PACIFIC AUDIO IC MARKET, BY APPLICATION, 2019–2027 ($MILLION)

TABLE 37.CHINA AUDIO IC MARKET, BY IC TYPE, 2019–2027 ($MILLION)

TABLE 38.CHINA AUDIO IC MARKET, BY APPLICATION, 2019–2027 ($MILLION)

TABLE 39.JAPAN AUDIO IC MARKET, BY IC TYPE, 2019–2027 ($MILLION)

TABLE 40.JAPAN AUDIO IC MARKET, BY APPLICATION, 2019–2027 ($MILLION)

TABLE 41.INDIA AUDIO IC MARKET, BY IC TYPE, 2019–2027 ($MILLION)

TABLE 42.INDIA AUDIO IC MARKET, BY APPLICATION, 2019–2027 ($MILLION)

TABLE 43.SOUTH KOREA AUDIO IC MARKET, BY IC TYPE, 2019–2027 ($MILLION)

TABLE 44.SOUTH KOREA AUDIO IC MARKET, BY APPLICATION, 2019–2027 ($MILLION)

TABLE 45.REST OF ASIA-PACIFIC AUDIO IC MARKET, BY IC TYPE, 2019–2027 ($MILLION)

TABLE 46.REST OF ASIA-PACIFIC AUDIO IC MARKET, BY APPLICATION, 2019–2027 ($MILLION)

TABLE 47.LAMEA AUDIO IC MARKET, BY IC TYPE, 2019–2027 ($MILLION)

TABLE 48.LAMEA AUDIO IC MARKET, BY APPLICATION, 2019–2027 ($MILLION)

TABLE 49.LATIN AMERICA AUDIO IC MARKET, BY IC TYPE, 2019–2027 ($MILLION)

TABLE 50.LATIN AMERICA AUDIO IC MARKET, BY APPLICATION, 2019–2027 ($MILLION)

TABLE 51.MIDDLE EAST AUDIO IC MARKET, BY IC TYPE, 2019–2027 ($MILLION)

TABLE 52.MIDDLE EAST AUDIO IC MARKET, BY APPLICATION, 2019–2027 ($MILLION)

TABLE 53.AFRICA AUDIO IC MARKET, BY IC TYPE, 2019–2027 ($MILLION)

TABLE 54.AFRICA AUDIO IC MARKET, BY APPLICATION, 2019–2027 ($MILLION)

TABLE 55.KEY NEW PRODUCT LAUNCHES (2017–2020)

TABLE 56.KEY EXPANSIONS (2017–2020)

TABLE 57.OTHER DEVELOPMENTS (2017 – 2020)

TABLE 58.ANALOG DEVICES, INC.: KEY EXECUTIVES

TABLE 59.ANALOG DEVICES, INC.: COMPANY SNAPSHOT

TABLE 60.ANALOG DEVICES, INC.: PRODUCT PORTFOLIO

TABLE 61.ANALOG DEVICES, INC.: KEY STRATEGIC MOVES AND DEVELOPMENTS

TABLE 62.CIRRUS LOGIC, INC.: KEY EXECUTIVES

TABLE 63.CIRRUS LOGIC, INC.: COMPANY SNAPSHOT

TABLE 64.CIRRUS LOGIC, INC.: PRODUCT PORTFOLIO

TABLE 65.INFINEON TECHNOLOGIES AG: KEY EXECUTIVES

TABLE 66.INFINEON TECHNOLOGIES AG: COMPANY SNAPSHOT

TABLE 67.INFINEON TECHNOLOGIES AG: OPERATING SEGMENTS

TABLE 68.INFINEON TECHNOLOGIES AG: PRODUCT PORTFOLIO

TABLE 69.MAXIM INTEGRATED: KEY EXECUTIVES

TABLE 70.MAXIM INTEGRATED: COMPANY SNAPSHOT

TABLE 71.MAXIM INTEGRATED: PRODUCT PORTFOLIO

TABLE 72.COMPANY SNAPSHOT

TABLE 73.NXP: PRODUCT PORTFOLIO

TABLE 74.ON SEMICONDUCTOR: KEY EXECUTIVES

TABLE 75.ON SEMICONDUCTOR: COMPANY SNAPSHOT

TABLE 76.ON SEMICONDUCTOR.: OPERATING SEGMENTS

TABLE 77.ON SEMICONDUCTOR: PRODUCT PORTFOLIO

TABLE 78.ROHM CO., LTD.: KEY EXECUTIVES

TABLE 79.ROHM CO., LTD.: COMPANY SNAPSHOT

TABLE 80.ROHM CO., LTD.: PRODUCT PORTFOLIO

TABLE 81.STMICROELECTRONICS: COMPANY SNAPSHOT

TABLE 82.STMICROELECTRONICS: OPERATING SEGMENTS

TABLE 83.STMICROELECTRONICS: PRODUCT PORTFOLIO

TABLE 84.TEXAS INSTRUMENTS INCORPORATED.:KEY EXECUTIVES

TABLE 85.TEXAS INSTRUMENTS INCORPORATED.: COMPANY SNAPSHOT

TABLE 86.TEXAS INSTRUMENTS INCORPORATED.: OPERATING SEGMENTS

TABLE 87.TEXAS INSTRUMENTS INCORPORATED.: PRODUCT PORTFOLIO

TABLE 88.TEXAS INSTRUMENTS INCORPORATED.: KEY STRATEGIC MOVES AND DEVELOPMENTS

TABLE 89.TOSHIBA CORPORATION.:KEY EXECUTIVES

TABLE 90.TOSHIBA CORPORATION.: COMPANY SNAPSHOT

TABLE 91.TOSHIBA CORPORATION.: OPERATING SEGMENTS

TABLE 92.TOSHIBA CORPORATION.: PRODUCT PORTFOLIO

TABLE 93.TOSHIBA CORPORATION.: KEY STRATEGIC MOVES AND DEVELOPMENTS

 
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