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Semiconductor and Electronics

Audio DSP Market By Type (Discrete and Integrated) and End Use (Computer, Phones, Tablets, Over-Ear Headphones, TWS, Home Entertainment, Commercial, Automotive, Portable, Smart Home, IoT, Wearable, and AR/VR): Global Opportunity Analysis and Industry Forecast, 2020–2027

  • ALL4220402
  • 243 Pages
  • February 2021
  • Semiconductor and Electronics
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The global audio DSP market was valued at $11.06 billion in 2019, and is projected to reach $23.43 billion by 2027, registering a CAGR of 9.3% from 2020 to 2027. The audio DSP market is currently in its growth stage and is expected to register substantial growth in the future, owing to high investments in R&D activities by market players and increase in focus toward Internet of Things (IoT). Other factors that drive the market growth include increase in demand for automobile & electronics and development of smart devices.

The scope of the report discusses potential opportunities for key players to enter the audio DSP market. Furthermore, it provides an in-depth analysis of the market, outlining current trends, key driving factors, and key areas of investment. The report includes Porter’s five forces analysis to understand the competitive scenario of the industry and role of each stakeholder in the value chain. Moreover, it features strategies adopted by key market players to maintain their foothold in the market.

The audio DSP market size is segmented on the basis of type, end use, and region. By type, the market is bifurcated into discrete and integrated. By end use, it is analyzed across computer, phones, tablets, over-ear headphones, TWS, home entertainment, commercial, automotive, portable, smart home, IoT, wearable, and AR/VR. By region, the market is analyzed across North America, Europe, Asia-Pacific, and LAMEA along with its prominent countries.

The key players profiled in the audio DSP industry include Texas Instrument, Altera Corporation, NXP Semiconductors, Broadcom Corporation, Analog Devices, Renesas Electronics, Xilinx Incorporated, Toshiba Corporation, LSI Corporation, and Ceva Incorporated. These key players have adopted strategies, such as product portfolio expansion, mergers & acquisitions, agreements, geographical expansion, and collaborations to enhance their market penetration.

Key Benefits For Stakeholders

• This study includes the analytical depiction of the audio DSP market forecast along with the current trends and future estimations to determine the imminent investment pockets.

• The report presents information regarding the key drivers, restraints, and opportunities in the audio DSP market.

• The audio DSP market trends are quantitatively analyzed from 2019 to 2027 to highlight the financial competency of the industry.

• Porter’s five forces analysis illustrates the potency of the buyers and suppliers in the industry.

Audio DSP Market Key Segments

By Type

• Discrete

• Integrated

By End Use

• Computer

• Phones

• Tablets

• Over-Ear Headphones

• TWS

• Home Entertainment

• Commercial

• Automotive

• Portable

• Smart Home

• IoT

• Wearable

• AR/VR

By Region

• North America

o U.S.

o Canada

o Mexico

• Europe

o UK

o Germany

o France

o Italy

o Rest of Europe

• Asia-Pacific

o China

o Japan

o India

o South Korea

o Rest of Asia-Pacific

• LAMEA

o Latin America

o Middle East

o Africa

Key Market Players

• Texas Instrument

• Altera Corporation

• NXP Semiconductors

• Broadcom Corporation

• Analog Devices

• Renesas Electronics

• Xilinx Incorporated

• Toshiba Corporation

• LSI Corporation

• CEVA Incorporated

CHAPTER 1: INTRODUCTION

1.1. REPORT DESCRIPTION

1.2. KEY BENEFITS FOR STAKEHOLDERS

1.3. KEY MARKET SEGMENTS

1.4. RESEARCH METHODOLOGY

1.4.1. Primary research

1.4.2. Secondary research

1.4.3. Analyst tools and models

CHAPTER 2: EXECUTIVE SUMMARY

2.1. CXO PERSPECTIVE

CHAPTER 3: MARKET LANDSCAPE

3.1. MARKET DEFINITION AND SCOPE

3.2. KEY FINDINGS

3.2.1. Top impacting factors

3.2.2. Top investment pockets

3.3. PORTER’S FIVE FORCES ANALYSIS

3.4. MARKET SHARE ANALYSIS (2019)

3.6. MARKET DYNAMICS

3.6.1. Drivers

3.6.1.1. Advantage of compound semiconductors over silicon-based technology

3.6.1.2. Increase in demand for compound semiconductor epitaxial wafer in LED technology

3.6.1.3. Emerging trends toward compound semiconductor wafers in the automotive industry

3.6.2. Restraints

3.6.2.1. High-cost associated with compound semiconductor materials and components

3.6.3. Opportunity

3.6.3.1. Emerging usage of compound semiconductors in smart technologies

3.7. PRICING ANALYSIS (2019)

3.8. COVID-19 IMPACT ANALYSIS

3.8.1. COVID-19 Outbreak

3.8.2. Impact on market size

3.8.3. End user trends, preferences, and budget impact

3.8.4. Parent industry impact

3.8.5. Key player strategies to tackle negative impact

3.8.5.1. Limiting cuts to R&D expense:

3.8.5.2. Focusing on next-generation products

3.8.5.3. Shifting toward agile supply chain model

3.8.6. Opportunity window

3.9. TECHNOLOGY TRENDS

CHAPTER 4: AUDIO DSP MARKET, BY TYPE

4.1. OVERVIEW

4.2. DISCRETE

4.2.1. Key market trends, growth factors, and opportunities

4.2.2. Market size and forecast, by region

4.2.3. Market analysis, by country

4.3. INTEGRATED

4.3.1. Key market trends, growth factors, and opportunities

4.3.2. Market size and forecast, by region

4.3.3. Market analysis, by country

CHAPTER 5: AUDIO DSP MARKET, BY END USE

5.1. OVERVIEW

5.2. COMPUTER

5.2.1. Metal Organic Chemical Vapor Deposition

5.2.2. Key market trends, growth factors, and opportunities

5.2.3. Market size and forecast, by region

5.2.4. Market analysis, by country

5.3. PHONES

5.3.1. Metal Organic Molecular Beam Epitaxy

5.3.2. Key market trends, growth factors, and opportunities

5.3.3. Market size and forecast, by region

5.3.4. Market analysis, by country

5.4. TABLETS

5.4.1. Key market trends, growth factors, and opportunities

5.4.2. Market size and forecast, by region

5.4.3. Market analysis, by country

5.5. OVER-EAR HEADPHONES

5.5.1. Liquid Phase Epitaxy

5.5.2. Key market trends, growth factors, and opportunities

5.5.3. Market size and forecast, by region

5.5.4. Market analysis, by country

5.6. TWS

5.6.1. Key market trends, growth factors, and opportunities

5.6.2. Market size and forecast, by region

5.6.3. Market analysis, by country

5.7. HOME ENTERTAINMENT

5.7.1. Key market trends, growth factors, and opportunities

5.7.2. Market size and forecast, by region

5.7.3. Market analysis, by country

5.8. COMMERCIAL

5.8.1. Key market trends, growth factors, and opportunities

5.8.2. Market size and forecast, by region

5.8.3. Market analysis, by country

5.9. AUTOMOTIVE

5.9.1. Key market trends, growth factors, and opportunities

5.9.2. Market size and forecast, by region

5.9.3. Market analysis, by country

5.10. PORTABLE

5.10.1. Key market trends, growth factors, and opportunities

5.10.2. Market size and forecast, by region

5.10.3. Market analysis, by country

5.11. SMART HOME

5.11.1. Key market trends, growth factors, and opportunities

5.11.2. Market size and forecast, by region

5.11.3. Market analysis, by country

5.12. IOT

5.12.1. Key market trends, growth factors, and opportunities

5.12.2. Market size and forecast, by region

5.12.3. Market analysis, by country

5.13. WEARABLE

5.13.1. Key market trends, growth factors, and opportunities

5.13.2. Market size and forecast, by region

5.13.3. Market analysis, by country

5.14. AR/VR

5.14.1. Key market trends, growth factors, and opportunities

5.14.2. Market size and forecast, by region

5.14.3. Market analysis, by country

CHAPTER 6: AUDIO DSP MARKET, BY REGION

6.1. OVERVIEW

6.2. NORTH AMERICA

6.2.1. Key market trends, growth factors, and opportunities

6.2.2. Market size and forecast, by type

6.2.3. Market size and forecast, by end use

6.2.4. Market analysis, by country

6.2.4.1. U.S.

6.2.4.1.1. Market size and forecast, by type

6.2.4.1.2. Market size and forecast, by end use

6.2.4.2. Canada

6.2.4.2.1. Market size and forecast, by type

6.2.4.2.2. Market size and forecast, by end use

6.2.4.3. Mexico

6.2.4.3.1. Market size and forecast, by type

6.2.4.3.2. Market size and forecast, by end use

6.2.4.3.3.

6.3. EUROPE

6.3.1. Key market trends, growth factors, and opportunities

6.3.2. Market size and forecast, by type

6.3.3. Market size and forecast, by end use

6.3.4. Market analysis, by country

6.3.4.2. UK

6.3.4.2.1. Market size and forecast, by type

6.3.4.2.2. Market size and forecast, by end use

6.3.4.3. Germany

6.3.4.3.2. Market size and forecast, by end use

6.3.4.4. France

6.3.4.4.1. Market size and forecast, by type

6.3.4.4.2. Market size and forecast, by end use

6.3.4.5. Rest of Europe

6.3.4.5.1. Market size and forecast, by type

6.3.4.5.2. Market size and forecast, by end use

6.4. ASIA-PACIFIC

6.4.1. Key market trends, growth factors, and opportunities

6.4.2. Market size and forecast, by type

6.4.3. Market size and forecast, by end use

6.4.4. Market analysis, by country

6.4.4.1. China

6.4.4.1.1. Market size and forecast, by type

6.4.4.1.2. Market size and forecast, by end use

6.4.4.2. Japan

6.4.4.2.2. Market size and forecast, by end use

6.4.4.3. India

6.4.4.3.1. Market size and forecast, by type

6.4.4.3.2. Market size and forecast, by end use

6.4.4.4. Rest of Asia-Pacific

6.4.4.4.1. Market size and forecast, by type

6.4.4.4.2. Market size and forecast, by end use

6.5. LAMEA

6.5.1. Key market trends, growth factors, and opportunities

6.5.2. Market size and forecast, by type

6.5.3. Market size and forecast, by end use

6.5.4. Market analysis, by country

6.5.4.1. Latin America

6.5.4.1.1. Market size and forecast, by type

6.5.4.1.2. Market size and forecast, by end use

6.5.4.2. Middle East

6.5.4.2.1. Market size and forecast, by type

6.5.4.2.2. Market size and forecast, by end use

6.5.4.3. Africa

6.5.4.3.1. Market size and forecast, by type

6.5.4.3.2. Market size and forecast, by end use

CHAPTER 7: COMPANY PROFILES

7.1. ANALOG DEVICES INCORPORATED

7.1.1. Company overview

7.1.2. Key Executives

7.1.3. Company snapshot

7.1.4. Operating business segments

7.1.5. Product portfolio

7.1.6. R&D Expenditure

7.1.7. Business performance

7.1.8. Key strategic moves and developments

7.2. BROADCOM INCORPORATED (BROADCOM CORPORATION)

7.2.1. Company overview

7.2.2. Key Executives

7.2.3. Company snapshot

7.2.4. Operating Business Segments

7.2.5. Product Portfolio

7.2.6. R&D Expenditure

7.2.7. Business performance

7.2.8. Key strategic moves and developments

7.3. CEVA INCORPORATED

7.3.1. Company overview

7.3.2. Key Executives

7.3.3. Company snapshot

7.3.4. Operating business segments

7.3.5. Product portfolio

7.3.6. R&D Expenditure

7.3.7. Business performance

7.3.8. Key strategic moves and developments

7.4. INTEL CORPORATION (ALTERA CORPORATION)

7.4.1. Company overview

7.4.2. Key Executives

7.4.3. Company snapshot

7.4.4. Operating business segments

7.4.5. Product portfolio

7.4.6. R&D Expenditure

7.4.7. Business performance

7.4.8. Key strategic moves and developments

7.5. NXP SEMICONDUCTORS N.V

7.5.1. Company overview

7.5.2. Key Executives

7.5.3. Company snapshot

7.5.4. Operating business segments

7.5.5. Product portfolio

7.5.6. R&D Expenditure

7.5.7. Business performance

7.5.8. Key strategic moves and developments

7.6. QUALCOMM INCORPORATED

7.6.1. Company overview

7.6.2. Key Executives

7.6.3. Company snapshot

7.6.4. Operating Business Segments

7.6.5. Product Portfolio

7.6.6. R&D Expenditure

7.6.7. Business performance

7.6.8. Key strategic moves and developments

7.7. RENESAS ELECTRONICS CORPORATION

7.7.1. Company overview

7.7.2. Key Executives

7.7.3. Company snapshot

7.7.4. Operating business segments

7.7.5. Product portfolio

7.7.6. R&D Expenditure

7.7.7. Business performance

7.7.8. Key strategic moves and developments

7.8. TEXAS INSTRUMENTS INCORPORATED.

7.8.1. Company overview

7.8.2. Key Executives

7.8.3. Company snapshot

7.8.4. Operating business segments

7.8.5. Product portfolio

7.8.6. R&D Expenditure

7.8.7. Business performance

7.8.8. Key strategic moves and developments

7.9. TOSHIBA CORPORATION

7.9.1. Company overview

7.9.2. Key Executives

7.9.3. Company snapshot.

7.9.4. Operating business segments

7.9.5. Product portfolio

7.9.6. R&D Expenditure

7.9.7. Business performance

7.9.8. Key strategic moves and developments

7.10. XILINX INCORPORATED

7.10.1. Company overview

7.10.2. Key Executives

7.10.3. Company snapshot

7.10.4. Operating business segments

7.10.5. Product portfolio

7.10.6. R&D Expenditure

7.10.7. Business performance

7.10.8. Key strategic moves and developments

LIST OF TABLES

TABLE 01. GLOBAL AUDIO DSP MARKET, BY TYPE, 2019-2027($MILLION)

TABLE 02. GLOBAL AUDIO DSP MARKET REVENUE FOR III-V COMPOUND SEMICONDUCTOR, BY REGION 2019-2027 ($MILLION)

TABLE 03. GLOBAL AUDIO DSP MARKET REVENUE FOR II-VI COMPOUND SEMICONDUCTOR, BY REGION 2019-2027 ($MILLION)

TABLE 04. GLOBAL AUDIO DSP MARKET, BY END USE, 2019-2027($MILLION)

TABLE 05. GLOBAL AUDIO DSP MARKET, BY SUBSEGMENT, 2019-2027($MILLION)

TABLE 06. GLOBAL AUDIO DSP MARKET REVENUE FOR CHEMICAL VAPOR DESPOSITION, BY REGION 2019-2027 ($MILLION)

TABLE 07. GLOBAL AUDIO DSP MARKET, BY SUBSEGMENT, 2019-2027($MILLION)

TABLE 08. GLOBAL AUDIO DSP MARKET REVENUE FOR MOLECULAR BEAM EPITAXY, BY REGION 2019-2027 ($MILLION)

TABLE 09. GLOBAL AUDIO DSP MARKET REVENUE FOR HYDRIDE VAPOR PHASE EPITAXY, BY REGION 2019–2027 ($MILLION)

TABLE 10. GLOBAL AUDIO DSP MARKET, BY SUBSEGMENT, 2019-2027($MILLION)

TABLE 11. GLOBAL AUDIO DSP MARKET REVENUE FOR AMMONOTHERMAL, BY REGION 2019–2027 ($MILLION)

TABLE 12. GLOBAL AUDIO DSP MARKET REVENUE FOR ATOMIC LAYER DEPOSITION, BY REGION 2019–2027 ($MILLION)

TABLE 13. GLOBAL AUDIO DSP MARKET REVENUE FOR OTHERS, BY REGION 2019–2027 ($MILLION)

TABLE 14. GLOBAL AUDIO DSP MARKET REVENUE FOR OTHERS, BY REGION 2019–2027 ($MILLION)

TABLE 15. GLOBAL AUDIO DSP MARKET REVENUE FOR OTHERS, BY REGION 2019–2027 ($MILLION)

TABLE 16. GLOBAL AUDIO DSP MARKET REVENUE FOR OTHERS, BY REGION 2019–2027 ($MILLION)

TABLE 17. GLOBAL AUDIO DSP MARKET REVENUE FOR OTHERS, BY REGION 2019–2027 ($MILLION)

TABLE 18. GLOBAL AUDIO DSP MARKET REVENUE FOR OTHERS, BY REGION 2019–2027 ($MILLION)

TABLE 19. GLOBAL AUDIO DSP MARKET REVENUE FOR OTHERS, BY REGION 2019–2027 ($MILLION)

TABLE 20. GLOBAL AUDIO DSP MARKET REVENUE FOR OTHERS, BY REGION 2019–2027 ($MILLION)

TABLE 21. NORTH AMERICA AUDIO DSP MARKET, BY TYPE, 2019–2027 ($MILLION)

TABLE 22. NORTH AMERICA AUDIO DSP MARKET, BY END USE, 2019–2027 ($MILLION)

TABLE 23. U. S. AUDIO DSP MARKET, BY TYPE, 2019–2027 ($MILLION)

TABLE 24. U. S. AUDIO DSP MARKET, BY END USE, 2019–2027 ($MILLION)

TABLE 25. CANADA. AUDIO DSP MARKET, BY TYPE, 2019–2027 ($MILLION)

TABLE 26. CANADA. AUDIO DSP MARKET, BY END USE, 2019–2027 ($MILLION)

TABLE 27. MEXICO, AUDIO DSP MARKET, BY TYPE, 2019–2027 ($MILLION)

TABLE 28. MEXICO. AUDIO DSP MARKET, BY END USE, 2019–2027 ($MILLION)

TABLE 29. EUROPE AUDIO DSP MARKET, BY TYPE, 2019–2027 ($MILLION)

TABLE 30. EUROPE AUDIO DSP MARKET, BY END USE, 2019–2027 ($MILLION)

TABLE 31. UK AUDIO DSP MARKET, BY TYPE, 2019–2027 ($MILLION)

TABLE 32. U.K. AUDIO DSP MARKET, BY END USE, 2019–2027 ($MILLION)

TABLE 33. GERMANY AUDIO DSP MARKET, BY TYPE, 2019–2027 ($MILLION)

TABLE 34. GERMANY. AUDIO DSP MARKET, BY END USE, 2019–2027 ($MILLION)

TABLE 35. FRANCE AUDIO DSP MARKET, BY TYPE, 2019–2027 ($MILLION)

TABLE 36. FRANCE. AUDIO DSP MARKET, BY END USE, 2019–2027 ($MILLION)

TABLE 37. REST OF EUROPE AUDIO DSP MARKET, BY TYPE, 2019–2027 ($MILLION)

TABLE 38. REST OF EUROPE. AUDIO DSP MARKET, BY END USE, 2019–2027 ($MILLION)

TABLE 39. ASIA-PACIFIC AUDIO DSP MARKET, BY TYPE, 2019–2027 ($MILLION)

TABLE 40. ASIA-PACIFIC AUDIO DSP MARKET, BY END USE, 2019–2027 ($MILLION)

TABLE 41. CHINA AUDIO DSP MARKET, BY TYPE, 2019–2027 ($MILLION)

TABLE 42. CHINA. AUDIO DSP MARKET, BY END USE, 2019–2027 ($MILLION)

TABLE 43. JAPAN AUDIO DSP MARKET, BY TYPE, 2019–2027 ($MILLION)

TABLE 44. JAPAN. AUDIO DSP MARKET, BY END USE, 2019–2027 ($MILLION)

TABLE 45. INDIA AUDIO DSP MARKET, BY TYPE, 2019–2027 ($MILLION)

TABLE 46. INDIA. AUDIO DSP MARKET, BY END USE, 2019–2027 ($MILLION)

TABLE 47. REST OF ASIA-PACIFIC AUDIO DSP MARKET, BY TYPE, 2019–2027 ($MILLION)

TABLE 48. REST OF ASIA-PACIFIC. AUDIO DSP MARKET, BY END USE, 2019–2027 ($MILLION)

TABLE 49. LAMEA AUDIO DSP MARKET, BY TYPE, 2019–2027 ($MILLION)

TABLE 50. LAMEA AUDIO DSP MARKET, BY END USE, 2019–2027 ($MILLION)

TABLE 51. LATIN AMERICA AUDIO DSP MARKET, BY TYPE, 2019–2027 ($MILLION)

TABLE 52. LATIN AMERICA. AUDIO DSP MARKET, BY END USE, 2019–2027 ($MILLION)

TABLE 53. MIDDLE EAST AUDIO DSP MARKET, BY TYPE, 2019–2027 ($MILLION)

TABLE 54. MIDDLE EAST. AUDIO DSP MARKET, BY END USE, 2019–2027 ($MILLION)

TABLE 55. AFRICA AUDIO DSP MARKET, BY TYPE, 2019–2027 ($MILLION)

TABLE 56. AFRICA. AUDIO DSP MARKET, BY END USE, 2019–2027 ($MILLION)

TABLE 57. ANALOG DEVICES INCORPORATED.:KEY EXECUTIVES

TABLE 58. ANALOG DEVICES INCORPORATED.: COMPANY SNAPSHOT

TABLE 59. ANALOG DEVICES INCORPORATED.: OPERATING SEGMENTS

TABLE 60. ANALOG DEVICES INCORPORATED.: PRODUCT PORTFOLIO

TABLE 61. ANALOG DEVICES INCORPORATED.: KEY STRATEGIC MOVES AND DEVELOPMENTS

TABLE 62. BROADCOM INCORPORATED.:KEY EXECUTIVES

TABLE 63. BROADCOM INCORPORATED.: COMPANY SNAPSHOT

TABLE 64. BROADCOM INCORPORATED.: OPERATING SEGMENTS

TABLE 65. BROADCOM INCORPORATED.: PRODUCT PORTFOLIO

TABLE 66. BROADCOM INCORPORATED.: KEY STRATEGIC MOVES AND DEVELOPMENTS

TABLE 67. CEVA INCORPORATED.:KEY EXECUTIVES

TABLE 68. CEVA INCORPORATED.: COMPANY SNAPSHOT

TABLE 69. CEVA INCORPORATED.: OPERATING SEGMENTS

TABLE 70. CEVA INCORPORATED.: PRODUCT PORTFOLIO

TABLE 71. CEVA INCORPORATED.: KEY STRATEGIC MOVES AND DEVELOPMENTS

TABLE 72. INTEL CORPORATION.:KEY EXECUTIVES

TABLE 73. INTEL CORPORATION.: COMPANY SNAPSHOT

TABLE 74. INTEL CORPORATION.: OPERATING SEGMENTS

TABLE 75. INTEL CORPORATION.: PRODUCT PORTFOLIO

TABLE 76. INTEL CORPORATION.: KEY STRATEGIC MOVES AND DEVELOPMENTS

TABLE 77. NXP SEMICONDUCTORS N.V.:KEY EXECUTIVES

TABLE 78. NXP SEMICONDUCTORS N.V.: COMPANY SNAPSHOT

TABLE 79. NXP SEMICONDUCTORS N.V.: OPERATING SEGMENTS

TABLE 80. NXP SEMICONDUCTORS N.V.: PRODUCT PORTFOLIO

TABLE 81. NXP SEMICONDUCTORS N.V.: KEY STRATEGIC MOVES AND DEVELOPMENTS

TABLE 82. QUALCOMM INCORPORATED.:KEY EXECUTIVES

TABLE 83. QUALCOMM INCORPORATED.: COMPANY SNAPSHOT

TABLE 84. QUALCOMM INCORPORATED.: OPERATING SEGMENTS

TABLE 85. QUALCOMM INCORPORATED.: PRODUCT PORTFOLIO

TABLE 86. QUALCOMM INCORPORATED.: KEY STRATEGIC MOVES AND DEVELOPMENTS

TABLE 87. RENESAS ELECTRONICS CORPORATION.:KEY EXECUTIVES

TABLE 88. RENESAS ELECTRONICS CORPORATION.: COMPANY SNAPSHOT

TABLE 89. RANESAS ELECTRONICS CORPORATION.: OPERATING SEGMENTS

TABLE 90. RANESAS ELECTRONICS CORPORATION: PRODUCT PORTFOLIO

TABLE 91. RANESAS ELECTRONICS CORPORATION.: KEY STRATEGIC MOVES AND DEVELOPMENTS

TABLE 92. TEXAS INSTRUMENTS INCORPORATED.:KEY EXECUTIVES

TABLE 93. TEXAS INSTRUMENTS INCORPORATED.: COMPANY SNAPSHOT

TABLE 94. TEXAS INSTRUMENTS INCORPORATED.: OPERATING SEGMENTS

TABLE 95. TEXAS INSTRUMENTS INCORPORATED.: PRODUCT PORTFOLIO

TABLE 96. TEXAS INSTRUMENTS INCORPORATED.: KEY STRATEGIC MOVES AND DEVELOPMENTS

TABLE 97. TOSHIBA CORPORATION.:KEY EXECUTIVES

TABLE 98. TOSHIBA CORPORATION.: COMPANY SNAPSHOT

TABLE 99. TOSHIBA CORPORATION.: OPERATING SEGMENTS

TABLE 100. TOSHIBA CORPORATION.: PRODUCT PORTFOLIO

TABLE 101. TOSHIBA CORPORATION.: KEY STRATEGIC MOVES AND DEVELOPMENTS

TABLE 102. XILINX INCORPORATED.:KEY EXECUTIVES

TABLE 103. XILINX INCORPORATED.: COMPANY SNAPSHOT

TABLE 104. XILINX INCORPORATED.: OPERATING END MARKETS

TABLE 105. XILINX INCORPORATED.: PRODUCT PORTFOLIO

TABLE 106. XILINX INCORPORATED.: KEY STRATEGIC MOVES AND DEVELOPMENTS

 
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