Flip Chip Market by Packaging Technology (3D IC, 2.5D IC, and 2D IC), Bumping Technology (Solder Bumping, Gold Bumping, and Others), and Industry (Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication, Aerospace & Defense, and Others): Global Opportunity Analysis and Industry Forecast, 2020–2027

1.1.REPORT DESCRIPTION

1.2.KEY BENEFITS FOR STAKEHOLDERS

1.3.KEY MARKET SEGMENTS

1.4.KEY MARKET PLAYERS

1.5.RESEARCH METHODOLOGY

1.5.1.Secondary research

1.5.2.Primary research

1.5.3.Analyst tools & models

CHAPTER 2:EXECUTIVE SUMMARY

2.1.KEY FINDINGS

2.1.1.Top impacting factors

2.1.2.Top investment pockets

2.2.CXO PERSPECTIVE

CHAPTER 3:MARKET OVERVIEW

3.1.MARKET DEFINITION AND SCOPE

3.2.KEY FORCES SHAPING THE GLOBAL FLIP CHIP MARKET

3.3.VALUE CHAIN ANALYSIS

3.4.MARKET DYNAMICS

3.4.1.Drivers

3.4.1.1.Thriving portable electronic market and increasing popularity of internet of things (IoT)

3.4.1.2.Usage in graphic cards and processors used in real world Solder Bumping

3.4.1.3.Technological superiority over wire bonding

3.4.2.Restraint

3.4.2.1.Higher cost and less customization options available in comparison to wire bonding

3.4.3.Opportunity

3.4.3.1.Impending need of high frequency in electronic gadget

3.5. COVID-19 IMPACT ANALYSIS ON CLOUD MIGRATION SERVICES MARKET

3.5.1. Impact on market size

3.5.2. Consumer trends, preferences, and budget impact

3.5.3. Regulatory framework

3.5.4. Economic impact

3.5.5. Key player strategies to tackle negative impact

3.5.6. Opportunity window

CHAPTER 4:GLOBAL FLIP CHIP MARKET, BY PACKAGING TECHNOLOGY

4.1.OVERVIEW

4.2.3D IC

4.2.1.Key market trends, growth factors, and opportunities

4.2.2.Market size and forecast, by region

4.2.3.Market analysis, by country

4.3.2.5D IC

4.3.1.Key market trends, growth factors, and opportunities

4.3.2.Market size and forecast, by region

4.3.3.Market analysis, by country

4.4.2D IC

4.4.1.Key market trends, growth factors, and opportunities

4.4.2.Market size and forecast, by region

4.4.3.Market analysis, by country

CHAPTER 5:GLOBAL FLIP CHIP MARKET, BY BUMPING TECHNOLOGY

5.1.OVERVIEW

5.2.COPPER PILLAR

5.2.1.Key market trends, growth factors, and opportunities

5.2.2.Market size and forecast, by region

5.2.3.Market analysis, by country

5.3.SOLDER BUMPING

5.3.1.Key market trends, growth factors, and opportunities

5.3.2.Market size and forecast, by region

5.3.3.Market analysis, by country

5.4.GOLD BUMPING

5.4.1.Key market trends, growth factors, and opportunities

5.4.2.Market size and forecast, by region

5.4.3.Market analysis, by country

5.5.OTHERS

5.5.1.Key market trends, growth factors, and opportunities

5.5.2.Market size and forecast, by region

5.5.3.Market analysis, by country

CHAPTER 6:GLOBAL FLIP CHIP MARKET, BY INDUSTRY VERTICAL

6.1.OVERVIEW

6.2.ELECTRONICS

6.2.1.Key market trends, growth factors, and opportunities

6.2.2.Market size and forecast, by region

6.2.3.Market analysis, by country

6.3.INDUSTRIAL

6.3.1.Key market trends, growth factors, and opportunities

6.3.2.Market size and forecast, by region

6.3.3.Market analysis, by country

6.4.HEALTHCARE

6.4.1.Key market trends, growth factors, and opportunities

6.4.2.Market size and forecast, by region

6.4.3.Market analysis, by country

6.5.AUTOMOTIVE & TRANSPORT

6.5.1.Key market trends, growth factors, and opportunities

6.5.2.Market size and forecast, by region

6.5.3.Market analysis, by country

6.6.IT & TELECOMMUNICATION

6.6.1.Key market trends, growth factors, and opportunities

6.6.2.Market size and forecast, by region

6.6.3.Market analysis, by country

6.7.AEROSPACE & DEFENSE

6.7.1.Key market trends, growth factors, and opportunities

6.7.2.Market size and forecast, by region

6.7.3.Market analysis, by country

6.8.OTHERS

6.8.1.Key market trends, growth factors, and opportunities

6.8.2.Market size and forecast, by region

6.8.3.Market analysis, by country

CHAPTER 7:GLOBAL FLIP CHIP MARKET, BY REGION

7.1.OVERVIEW

7.1.1.Market size and forecast, by region

7.2.NORTH AMERICA

7.2.1.Key market trends, growth factors, and opportunities

7.2.2.Market size and forecast, by packaging technology

7.2.3.Market size and forecast, by bumping technology

7.2.4.Market size and forecast, by industry vertical

7.2.5.Market analysis, by country

7.2.5.1.U.S.

7.2.5.1.1.Market size and forecast, by packaging technology

7.2.5.1.2.Market size and forecast, by bumping technology

7.2.5.1.3.Market size and forecast, by industry vertical

7.2.5.2.CANADA

7.2.5.2.1.Market size and forecast, by packaging technology

7.2.5.2.2.Market size and forecast, by bumping technology

7.2.5.2.3.Market size and forecast, by industry vertical

7.3.EUROPE

7.3.1.Key market trends, growth factors, and opportunities

7.3.2.Market size and forecast, by packaging technology

7.3.3.Market size and forecast, by bumping technology

7.3.4.Market size and forecast, by industry vertical

7.3.5.Market analysis, by country

7.3.5.1.GERMANY

7.3.5.1.1.Market size and forecast, by packaging technology

7.3.5.1.2.Market size and forecast, by bumping technology

7.3.5.1.3.Market size and forecast, by industry vertical

7.3.5.2.FRANCE

7.3.5.2.1.Market size and forecast, by packaging technology

7.3.5.2.2.Market size and forecast, by bumping technology

7.3.5.2.3.Market size and forecast, by industry vertical

7.3.5.3.UK

7.3.5.3.1.Market size and forecast, by packaging technology

7.3.5.3.2.Market size and forecast, by bumping technology

7.3.5.3.3.Market size and forecast, by industry vertical

7.3.5.4.SPAIN

7.3.5.4.1.Market size and forecast, by packaging technology

7.3.5.4.2.Market size and forecast, by bumping technology

7.3.5.4.3.Market size and forecast, by industry vertical

7.3.5.5.REST OF EUROPE

7.3.5.5.1.Market size and forecast, by packaging technology

7.3.5.5.2.Market size and forecast, by bumping technology

7.3.5.5.3.Market size and forecast, by industry vertical

7.4.ASIA-PACIFIC

7.4.1.Key market trends, growth factors, and opportunities

7.4.2.Market size and forecast, by packaging technology

7.4.3.Market size and forecast, by bumping technology

7.4.4.Market size and forecast, by industry vertical

7.4.5.Market analysis, by country

7.4.5.1.JAPAN

7.4.5.1.1.Market size and forecast, by packaging technology

7.4.5.1.2.Market size and forecast, by bumping technology

7.4.5.1.3.Market size and forecast, by industry vertical

7.4.5.2.CHINA

7.4.5.2.1.Market size and forecast, by packaging technology

7.4.5.2.2.Market size and forecast, by bumping technology

7.4.5.2.3.Market size and forecast, by industry vertical

7.4.5.3.INDIA

7.4.5.3.1.Market size and forecast, by packaging technology

7.4.5.3.2.Market size and forecast, by bumping technology

7.4.5.3.3.Market size and forecast, by industry vertical

7.4.5.4.AUSTRALIA

7.4.5.4.1.Market size and forecast, by packaging technology

7.4.5.4.2.Market size and forecast, by bumping technology

7.4.5.4.3.Market size and forecast, by industry vertical

7.4.5.5.REST OF ASIA-PACIFIC

7.4.5.5.1.Market size and forecast, by packaging technology

7.4.5.5.2.Market size and forecast, by bumping technology

7.4.5.5.3.Market size and forecast, by industry vertical

7.5.LAMEA

7.5.1.Key market trends, growth factors, and opportunities

7.5.2.Market size and forecast, by packaging technology

7.5.3.Market size and forecast, by bumping technology

7.5.4.Market size and forecast, by industry vertical

7.5.5.Market analysis, by country

7.5.5.1.LATIN AMERICA

7.5.5.1.1.Market size and forecast, by packaging technology

7.5.5.1.2.Market size and forecast, by bumping technology

7.5.5.1.3.Market size and forecast, by industry vertical

7.5.5.2.MIDDLE EAST

7.5.5.2.1.Market size and forecast, by packaging technology

7.5.5.2.2.Market size and forecast, by bumping technology

7.5.5.2.3.Market size and forecast, by industry vertical

7.5.5.3.AFRICA

7.5.5.3.1.Market size and forecast, by packaging technology

7.5.5.3.2.Market size and forecast, by bumping technology

7.5.5.3.3.Market size and forecast, by industry vertical

CHAPTER 8:COMPETITIVE LANDSCAPE

8.1.KEY PLAYERS POSITIONING ANALYSIS, 2019

8.2.TOP WINNING STRATEGIES

8.3.COMPETITIVE DASHBOARD

8.4.KEY DEVELOPMENTS

8.4.1.Product launches

8.4.2.Partnership

8.4.3.Product development

8.4.4.Business expansion

8.4.5.Acquisition

CHAPTER 9:COMPANY PROFILE

9.1.3M

9.1.1.Company overview

9.1.2.Key executives

9.1.3.Company snapshot

9.1.4.Operating business segments

9.1.5.Product portfolio

9.1.6.R&D expenditure

9.1.7.Business performance

9.1.8.Key strategic moves and developments

9.2.ADVANCED MICRO DEVICES, INC.

9.2.1.Company overview

9.2.2.Key executives

9.2.3.Company snapshot

9.2.4.Operating business segments

9.2.5.Product portfolio

9.2.6.R&D expenditure

9.2.7.Business performance

9.2.8.Key strategic moves and developments

9.3.AMKOR TECHNOLOGY

9.3.1.Company overview

9.3.2.Key executives

9.3.3.Company snapshot

9.3.4.Product portfolio

9.3.5.R&D expenditure

9.3.6.Business performance

9.3.7.Key strategic moves and developments

9.4.APPLE INC.

9.4.1.Company overview

9.4.2.Key executives

9.4.3.Company snapshot

9.4.4.Operating business segments

9.4.5.Product portfolio

9.4.6.R&D expenditure

9.4.7.Business performance

9.4.8.Key strategic moves and developments

9.5.FUJITSU LIMITED

9.5.1.Company overview

9.5.2.Key Executives

9.5.3.Company snapshot

9.5.4.Operating business segments

9.5.5.Product portfolio

9.5.6.R&D Expenditure

9.5.7.Business performance

9.5.8.Key strategic moves and developments

9.6.INTEL CORPORATION

9.6.1.Company overview

9.6.2.Key executives

9.6.3.Company snapshot

9.6.4.Operating business segments

9.6.5.Product portfolio

9.6.6.R&D expenditure

9.6.7.Business performance

9.6.8.Key strategic moves and developments

9.7.INTERNATIONAL BUSINESS MACHINES CORPORATION

9.7.1.Company overview

9.7.2.Key Executives

9.7.3.Company snapshot

9.7.4.Operating business segments

9.7.5.Product portfolio

9.7.6.R&D expenditure

9.7.7.Business performance

9.7.8.Key strategic moves and developments

9.8.SAMSUNG ELECTRONICS CO., LTD.

9.8.1.Company overview

9.8.2.Key Executives

9.8.3.Company snapshot

9.8.4.Operating business segments

9.8.5.Product portfolio

9.8.6.R&D expenditure

9.8.7.Business performance

9.8.8.Key strategic moves and developments

9.9.TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED

9.9.1.Company overview

9.9.2.Key executives

9.9.3.Company snapshot

9.9.4.Product portfolio

9.9.5.R&D expenditure

9.9.6.Business performance

9.9.7.Key strategic moves and developments

9.10.TEXAS INSTRUMENTS INCORPORATED

9.10.1.Company overview

9.10.2.Key executives

9.10.3.Company snapshot

9.10.4.Operating business segments

9.10.5.Product portfolio

9.10.6.R&D expenditure

9.10.7.Business performance

TABLE 01.COMPARISON BETWEEN THE PROPERTIES OF WIRE BONDING AND FLIP CHIP

TABLE 02.GLOBAL FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019-2027 ($BILLION)

TABLE 03.FLIP CHIP MARKET REVENUE FOR 3D IC, BY REGION 2019–2027 ($BILLION)

TABLE 04.FLIP CHIP MARKET REVENUE FOR2.5D IC, BY REGION 2019–2027 ($BILLION)

TABLE 05.FLIP CHIP MARKET REVENUE FOR 2D IC, BY REGION 2019–2027 ($BILLION)

TABLE 06.GLOBAL FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019-2027 ($BILLION)

TABLE 07.FLIP CHIP MARKET REVENUE FORCOPPER PILLAR, BY REGION 2019–2027 ($BILLION)

TABLE 08.FLIP CHIP MARKET REVENUE FORSOLDER BUMPING, BY REGION, 2019–2027 ($BILLION)

TABLE 09.FLIP CHIP MARKET REVENUE FOR GOLD BUMPING, BY REGION 2019–2027 ($BILLION)

TABLE 10.FLIP CHIP MARKET REVENUE FOR OTHERS, BY REGION 2019–2027 ($BILLION)

TABLE 11.GLOBAL FLIP CHIP MARKET, BY INDUSTRY VERTICAL, 2019–2027 ($BILLION)

TABLE 12.FLIP CHIP MARKET REVENUE FORELECTRONICS, BY REGION, 2019–2027 ($BILLION)

TABLE 13.FLIP CHIP MARKET REVENUE FOR INDUSTRIAL, BY REGION, 2019–2027 ($BILLION)

TABLE 14.GLOBAL FLIP CHIP MARKET REVENUE FOR HEALTHCARE, BY REGION 2019–2027 ($BILLION)

TABLE 15.GLOBAL FLIP CHIP MARKET REVENUE FOR AUTOMOTIVE & TRANSPORT, BY REGION 2019–2027 ($BILLION)

TABLE 16.GLOBAL FLIP CHIP MARKET REVENUE FOR IT & TELECOMMUNICATION, BY REGION 2019–2027 ($BILLION)

TABLE 17.GLOBAL FLIP CHIP MARKET REVENUE FOR AEROSPACE & DEFENSE, BY REGION 2019–2027 ($BILLION)

TABLE 18.GLOBAL FLIP CHIP MARKET REVENUE FOR OTHERS, BY REGION 2019–2027 ($BILLION)

TABLE 19.FLIP CHIP MARKET REVENUE, BY REGION, 2019–2027 ($BILLION)

TABLE 20.NORTH AMERICA FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 21.NORTH AMERICA FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 22.NORTH AMERICA FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL, 2019–2027 ($BILLION)

TABLE 23.NORTH AMERICA FLIP CHIP MARKET REVENUE, BY COUNTRY, 2019–2027 ($BILLION)

TABLE 24.U.S. FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 25.U.S. FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 26.U.S. FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL 2019–2027 ($BILLION)

TABLE 27.CANADA FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 28.CANADA FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 29.CANADA FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL 2019–2027 ($BILLION)

TABLE 30.EUROPE FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 31.EUROPE FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 32.EUROPE FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL, 2019–2027 ($BILLION)

TABLE 33.EUROPE FLIP CHIP MARKET REVENUE, BY COUNTRY, 2019–2027 ($BILLION)

TABLE 34.GERMANY FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 35.GERMANY FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 36.GERMANY FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL 2019–2027 ($BILLION)

TABLE 37.FRANCE FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 38.FRANCE FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 39.FRANCE FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL 2019–2027 ($BILLION)

TABLE 40.UK FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 41.UK FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 42.UK FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL 2019–2027 ($BILLION)

TABLE 43.SPAIN FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 44.SPAIN FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 45.SPAIN FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL 2019–2027 ($BILLION)

TABLE 46.REST OF EUROPE FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 47.REST OF EUROPE FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 48.REST OF EUROPE FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL 2019–2027 ($BILLION)

TABLE 49.ASIA-PACIFIC FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 50.ASIA-PACIFIC FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 51.ASIA-PACIFIC FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL, 2019–2027 ($BILLION)

TABLE 52.ASIA-PACIFIC FLIP CHIP MARKET REVENUE, BY COUNTRY, 2019–2027 ($BILLION)

TABLE 53.JAPAN FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 54.JAPAN FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 55.JAPAN FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL 2019–2027 ($BILLION)

TABLE 56.CHINA FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 57.CHINA FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 58.CHINA FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL 2019–2027 ($BILLION)

TABLE 59.INDIA FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 60.INDIA FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 61.INDIA FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL 2019–2027 ($BILLION)

TABLE 62.AUSTRALIA FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 63.AUSTRALIA FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 64.AUSTRALIA FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL 2019–2027 ($BILLION)

TABLE 65.REST OF ASIA-PACIFIC FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 66.REST OF ASIA-PACIFIC FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 67.REST OF ASIA-PACIFIC FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL 2019–2027 ($BILLION)

TABLE 68.LAMEA FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 69.LAMEA FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 70.LAMEA FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL, 2019–2027 ($BILLION)

TABLE 71.LAMEA FLIP CHIP MARKET REVENUE, BY COUNTRY, 2019–2027 ($BILLION)

TABLE 72.LATIN AMERICA FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 73.LATIN AMERICA FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 74.LATIN AMERICA FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL 2019–2027 ($BILLION)

TABLE 75.MIDDLE EAST FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 76.MIDDLE EAST FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 77.MIDDLE EAST FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL 2019–2027 ($BILLION)

TABLE 78.AFRICA FLIP CHIP MARKET REVENUE, BY PACKAGING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 79.AFRICA FLIP CHIP MARKET REVENUE, BY BUMPING TECHNOLOGY, 2019–2027 ($BILLION)

TABLE 80.AFRICA FLIP CHIP MARKET REVENUE, BY INDUSTRY VERTICAL 2019–2027 ($BILLION)

TABLE 81.KEY NEW PRODUCT LAUNCHES (2016-2019)

TABLE 82.PARTNERSHIP (2016-2019)

TABLE 83.PRODUCT DEVELOPMENT (2016-2019)

TABLE 84.KEY EXPANSION (2016-2019)

TABLE 85.KEY ACQUISITION (2016-2019)

TABLE 86.3M: KEY EXECUTIVES

TABLE 87.3M: COMPANY SNAPSHOT

TABLE 88.3M: OPERATING SEGMENTS

TABLE 89.3M: PRODUCT PORTFOLIO

TABLE 90.3M: KEY STRATEGIC MOVES AND DEVELOPMENTS

TABLE 91.ADVANCED MICRO DEVICES, INC.: KEY EXECUTIVES

TABLE 92.ADVANCED MICRO DEVICES, INC.: COMPANY SNAPSHOT

TABLE 93.ADVANCED MICRO DEVICES, INC.: OPERATING SEGMENTS

TABLE 94.ADVANCED MICRO DEVICES, INC.: PRODUCT PORTFOLIO

TABLE 95.AMKOR TECHNOLOGY.: COMPANY SNAPSHOT

TABLE 96.AMKOR TECHNOLOGY: VIDEO ANALYTICS PRODUCT PORTFOLIO

TABLE 97.APPLE INC.: KEY EXECUTIVES

TABLE 98.APPLE INC.: COMPANY SNAPSHOT

TABLE 99.APPLE INC.: PRODUCT CATEGORIES

TABLE 100.APPLE INC.: PRODUCT PORTFOLIO

TABLE 101.FUJITSU LIMITED: KEY EXECUTIVES

TABLE 102.FUJITSU LIMITED: COMPANY SNAPSHOT

TABLE 103.FUJITSU LIMITED: OPERATING SEGMENTS

TABLE 104.FUJITSU LIMITED: PRODUCT PORTFOLIO

TABLE 105.INTEL CORPORATION: KEY EXECUTIVES

TABLE 106.INTEL CORPORATION: COMPANY SNAPSHOT

TABLE 107.INTEL CORPORATION: OPERATING SEGMENTS

TABLE 108.INTEL CORPORATION: VIDEO ANALYTICS PRODUCT PORTFOLIO

TABLE 109.INTERNATIONAL BUSINESS MACHINES CORPORATION: KEY EXECUTIVES

TABLE 110.INTERNATIONAL BUSINESS MACHINES CORPORATION: COMPANY SNAPSHOT

TABLE 111.INTERNATIONAL BUSINESS MACHINES CORPORATION: OPERATING SEGMENTS

TABLE 112.INTERNATIONAL BUSINESS MACHINES CORPORATION: PRODUCT PORTFOLIO

TABLE 113.SAMSUNG ELECTRONICS CO., LTD.: KEY EXECUTIVES

TABLE 114.SAMSUNG ELECTRONICS CO., LTD.: COMPANY SNAPSHOT

TABLE 115.SAMSUNG ELECTRONICS CO., LTD.: OPERATING SEGMENTS

TABLE 116.SAMSUNG ELECTRONICS CO., LTD.: PRODUCT PORTFOLIO

TABLE 120.TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: KEY STRATEGIC MOVES AND DEVELOPMENTS

TABLE 121.TEXAS INSTRUMENTS INCORPORATED: KEY EXECUTIVES

TABLE 122.TEXAS INSTRUMENTS INCORPORATED: COMPANY SNAPSHOT

TABLE 123.TEXAS INSTRUMENTS INCORPORATED: OPERATING SEGMENTS

TABLE 124.TEXAS INSTRUMENTS INCORPORATED: PRODUCT PORTFOLIO