WLCSP Electroless Plating Market By Type (Nickel, Copper, and Composite), and End Use (Automotive, Electronics, Aerospace, Machinery, and Others): Global Opportunity Analysis and Industry Forecast, 2020-2027
- ALL3907868
- 197 Pages
- June 2020
- Semiconductor and Electronics
Wafer level chip scale package refers to the technology of packaging an integrated circuit at the wafer level, instead of the traditional process of assembling individual units in packages after dicing them from wafer. Wafer level CSP differs from BGA as no bond wires or interposer connections are required. The key advantage of wafer level CSP as the die to PCB inductance is minimized, along with reduced package size, and enhanced thermal conduction characteristics.
WLCSP electroless plating technology is expected to increase the value of a semiconductor wafer product by adding functionality in its operation, increasing and maintaining the performance, while lowering the overall cost of packaging. The adoption of advanced WLCSP electroless plating is also creating demand for high performance chips for various consumer electronic products.
Factors such as need for circuit miniaturization and microelectronic devices, enhanced feature of WLCSP electroless plating providing better shielding as against traditional plating process, and cost-effectiveness of WLCSP electroless plating are expected to drive the market growth. However, decline in growth of semiconductor industry and volatility of the prices of raw materials hamper the market growth to a certain extent. Furthermore, increase in demand for WLCSP electroless plating in aerospace and healthcare industries is expected to be opportunistic for the market.
The global WLCSP electroless plating market is segmented into type, end use, and region. By type, the market is classified into nickel, copper, and composites. The nickel segment is further subdivided into low phosphorus, medium phosphorus, and high phosphorus. By end use, the market is divided into automotive, electronics, aerospace, machinery, and others. By region, it is analyzed across North America, Europe, Asia-Pacific, and LAMEA.
The key players profiled in the report include Atotech Deutschland GmbH, ARC Technologies, Inc., MacDermid, Inc., KC Jones Plating Company, Okuno Chemical Industries Co., Ltd. COVENTYA International, C. Uyemura & Co., Ltd., Nihon Parkerizing Co., Ltd., ERIE PLATING COMPANY, and Bales Metal Surface Solutions (Bales).
These key players have adopted strategies such as product portfolio expansion, mergers & acquisitions, agreements, geographical expansion, and collaborations, to enhance their market penetration.
KEY BENEFITS FOR STAKEHOLDERS
• This study includes the analytical depiction of the WLCSP electroless plating market forecast along with the current trends and future estimations to determine the imminent investment pockets.
• The report presents information regarding the key drivers, restraints, and opportunities in the market.
• The WLCSP electroless plating market growth is quantitatively analyzed from 2019 to 2027 to highlight the financial competency of the industry.
• Porter’s five forces analysis illustrates the potency of the buyers and suppliers in the industry.
WLCSP ELECTROLESS PLATING MARKET SEGMENTATION
BY TYPE
• Nickel
o Low Phosphorus
o Medium Phosphorus
o High Phosphorus
• Copper
• Composite
BY END USE
• Automotive
• Electronics
• Aerospace
• Machinery
• Others
BY REGION
• North America
o U.S.
o Canada
o Mexico
• Europe
o UK
o Germany
o France
o Italy
o Rest of Europe
• Asia-Pacific
o China
o Japan
o South Korea
o Australia
o Rest of Asia-Pacific
• LAMEA
o Latin America
o Middle East
o Africa
1.1.REPORT DESCRIPTION
1.2.KEY BENEFITS FOR STAKEHOLDERS
1.3.KEY MARKET SEGMENTS
1.4.RESEARCH METHODOLOGY
1.4.1.Primary research
1.4.2.Secondary research
1.4.3.Analyst tools and models
CHAPTER 2:EXECUTIVE SUMMARY
2.1.CXO PERSPECTIVE
CHAPTER 3:MARKET OVERVIEW
3.1.MARKET DEFINITION AND SCOPE
3.2.KEY FINDINGS
3.2.1.Top impacting factors
3.2.2.Top investment pockets
3.2.3.Top winning strategies
3.3.PORTER’S FIVE FORCES ANALYSIS
3.4.KEY PLAYER POSITIONING (2019)
3.5.MARKET DYNAMICS
3.5.1.Drivers
3.5.1.1.Impending need for circuit miniaturization and micro electric devices
3.5.1.2.WLCSP electroless plating provides better shielding as against traditional plating process
3.5.1.3.Cost-effectiveness of WLCSP electroless plating
3.5.2.Restraints
3.5.2.1.Slow-paced growth of the semiconductor industry
3.5.2.2.Volatility of the prices of raw materials
3.5.3.Opportunity
3.5.3.1.Increase in demand for WLCSP electroless plating in aerospace and healthcare industry vertical
3.6.ELECTROLESS PLATING FOR WLCSP BUMP AND OTHER PARTS OF WLCSP
3.6.1.What are semiconductor bumps?
CHAPTER 4:WLCSP ELECTROLESS PLATING MARKET, BY TYPE
4.1.OVERVIEW
4.2.NICKEL
4.2.1.Low phosphorus
4.2.2.Medium phosphorus
4.2.3.High phosphorus
4.2.4.Key market trends, growth factors and opportunities
4.2.5.Market size and forecast, by region
4.2.6.Market analysis by country
4.3.COPPER
4.3.1.Key market trends, growth factors, and opportunities
4.3.2.Market size and forecast, by region
4.3.3.Market analysis by country
4.4.COMPOSITES
4.4.1.Key market trends, growth factors, and opportunities
4.4.2.Market size and forecast, by region
4.4.3.Market analysis by country
CHAPTER 5:WLCSP ELECTROLESS PLATINGMARKET, BY END USE
5.1.OVERVIEW
5.2.AUTOMOTIVE
5.2.1.Key market trends, growth factors and opportunities
5.2.2.Market size and forecast, by region
5.2.3.Market analysis by country
5.3.ELECTRONICS
5.3.1.Key market trends, growth factors, and opportunities
5.3.2.Market size and forecast, by region
5.3.3.Market analysis by country
5.4.AEROSPACE
5.4.1.Key market trends, growth factors, and opportunities
5.4.2.Market size and forecast, by region
5.4.3.Market analysis by country
5.5.MACHINERY
5.5.1.Key market trends, growth factors, and opportunities
5.5.2.Market size and forecast, by region
5.5.3.Market analysis by country
5.6.OTHERS
5.6.1.Key market trends, growth factors, and opportunities
5.6.2.Market size and forecast, by region
5.6.3.Market analysis by country
CHAPTER 6:WLCSP ELECTROLESS PLATING MARKET, BY REGION
6.1.OVERVIEW
6.2.NORTH AMERICA
6.2.1.Key market trends, growth factors, and opportunities
6.2.2.Market size and forecast, by type
6.2.3.Market size and forecast, by end use
6.2.4.Market analysis by country
6.2.4.1.U.S.
6.2.4.1.1.Market size and forecast, by type
6.2.4.1.2.Market size and forecast, by end use
6.2.4.2.Canada
6.2.4.2.1.Market size and forecast, by type
6.2.4.2.2.Market size and forecast, by end use
6.2.4.3.Mexico
6.2.4.3.1.Market size and forecast, by type
6.2.4.3.2.Market size and forecast, by end use
6.3.EUROPE
6.3.1.Key market trends, growth factors, and opportunities
6.3.2.Market size and forecast, by type
6.3.3.Market size and forecast, by end use
6.3.4.Market analysis by country
6.3.4.1.UK
6.3.4.1.1.Market size and forecast, by type
6.3.4.1.2.Market size and forecast, by end use
6.3.4.2.Germany
6.3.4.2.1.Market size and forecast, by type
6.3.4.2.2.Market size and forecast, by end use
6.3.4.3.France
6.3.4.3.1.Market size and forecast, by type
6.3.4.3.2.Market size and forecast, by end use
6.3.4.4.Italy
6.3.4.4.1.Market size and forecast, by type
6.3.4.4.2.Market size and forecast, by end use
6.3.4.5.Rest of Europe
6.3.4.5.1.Market size and forecast, by type
6.3.4.5.2.Market size and forecast, by end use
6.4.ASIA-PACIFIC
6.4.1.Key market trends, growth factors, and opportunities
6.4.2.Market size and forecast, by Type
6.4.3.Market size and forecast, by End Use
6.4.4.Market analysis by country
6.4.4.1.China
6.4.4.1.1.Market size and forecast, by type
6.4.4.1.2.Market size and forecast, by end use
6.4.4.2.Japan
6.4.4.2.1.Market size and forecast, by type
6.4.4.2.2.Market size and forecast, by end use
6.4.4.3.South Korea
6.4.4.3.1.Market size and forecast, by type
6.4.4.3.2.Market size and forecast, by end use
6.4.4.4.Australia
6.4.4.4.1.Market size and forecast, by type
6.4.4.4.2.Market size and forecast, by end use
6.4.4.5.Rest of Asia-Pacific
6.4.4.5.1.Market size and forecast, by type
6.4.4.5.2.Market size and forecast, by end use
6.5.LAMEA
6.5.1.Key market trends, growth factors, and opportunities
6.5.2.Market size and forecast, by type
6.5.3.Market size and forecast, by end use
6.5.4.Market analysis by country
6.5.4.1.Latin America
6.5.4.1.1.Market size and forecast, by type
6.5.4.1.2.Market size and forecast, by End Use
6.5.4.2.Middle East
6.5.4.2.1.Market size and forecast, by type
6.5.4.2.2.Market size and forecast, by end use
6.5.4.3.Africa
6.5.4.3.1.Market size and forecast, by type
6.5.4.3.2.Market size and forecast, by end use
CHAPTER 7:COMPANY PROFILES
7.1.ARC TECHNOLOGIES, INC.
7.1.1.Company overview
7.1.2.Key Executives
7.1.3.Company snapshot
7.1.4.Product portfolio
7.2.ATOTECH DEUTSCHLAND GMBH
7.2.1.Company overview
7.2.2.Key Executives
7.2.3.Company snapshot
7.2.4.Operating business segments
7.2.5.Product portfolio
7.2.6.R&D Expenditure
7.2.7.Business performance
7.2.8.Key strategic moves and developments
7.3.BALES (BALES METAL SURFACE SOLUTIONS)
7.3.1.Company overview
7.3.2.Key Executives
7.3.3.Company snapshot
7.3.4.Product portfolio
7.3.5.Key strategic moves and developments
7.4.C. UYEMURA & CO., LTD.
7.4.1.Company overview
7.4.2.Key Executives
7.4.3.Company snapshot
7.4.4.Operating business segments
7.4.5.Product portfolio
7.4.6.R&D Expenditure
7.4.7.Business performance
7.4.8.Key strategic moves and developments
7.5.COVENTYA INTERNATIONAL
7.5.1.Company overview
7.5.2.Key Executives
7.5.3.Company snapshot
7.5.4.Product portfolio
7.5.5.Key strategic moves and developments
7.6.ERIE PLATING COMPANY
7.6.1.Company overview
7.6.2.Key Executives
7.6.3.Company snapshot
7.6.4.Product portfolio
7.7.KC JONES PLATING COMPANY
7.7.1.Company overview
7.7.2.Key Executives
7.7.3.Company snapshot
7.7.4.Product portfolio
7.7.5.Key strategic moves and developments
7.8.MACDERMID, INC.
7.8.1.Company overview
7.8.2.Key executives
7.8.3.Company snapshot
7.8.4.Product portfolio
7.8.5.Key strategic moves and developments
7.9.NIHON PARKERIZING CO., LTD.
7.9.1.Company overview
7.9.2.Key Executives
7.9.3.Company snapshot
7.9.4.Operating business segments
7.9.5.Product portfolio
7.9.6.R&D Expenditure
7.9.7.Business performance
7.9.8.Key strategic moves and developments
7.10.OKUNO CHEMICAL INDUSTRIES CO., LTD.
7.10.1.Company overview
7.10.2.Key Executives
7.10.3.Company snapshot
7.10.4.Product portfolio
7.10.5.Key strategic moves and developments
TABLE 01.GLOBAL WLCSP ELECTROLESS PLATING MARKET, BY TYPE, 2019-2027($MILLION)
TABLE 02.GLOBAL WLCSP ELECTROLESS PLATING MARKET, BY SUBSEGMENT, 2019-2027($MILLION)
TABLE 03.GLOBAL WLCSP ELECTROLESS PLATING MARKET REVENUE FOR NICKEL, BY REGION 2019-2027 ($MILLION)
TABLE 04.GLOBAL WLCSP ELECTROLESS PLATING MARKET REVENUE FOR COPPER, BY REGION 2019-2027 ($MILLION)
TABLE 05.GLOBAL WLCSP ELECTROLESS PLATING MARKET REVENUE FOR COMPOSITES, BY REGION 2019–2027 ($MILLION)
TABLE 06.GLOBAL WLCSP ELECTROLESS PLATING MARKET, BY END USE, 2019-2027($MILLION)
TABLE 07.GLOBAL WLCSP ELECTROLESS PLATING MARKET REVENUE FOR AUTOMOTIVE, BY REGION 2019-2027 ($MILLION)
TABLE 08.GLOBAL WLCSP ELECTROLESS PLATING MARKET REVENUE FOR ELECTRONICS, BY REGION 2019-2027 ($MILLION)
TABLE 09.GLOBAL WLCSP ELECTROLESS PLATING MARKET REVENUE FOR AEROSPACE, BY REGION 2019–2027 ($MILLION)
TABLE 10.GLOBAL WLCSP ELECTROLESS PLATING MARKET REVENUE FOR MACHINERY, BY REGION 2019–2027 ($MILLION)
TABLE 11.GLOBAL WLCSP ELECTROLESS PLATING MARKET REVENUE FOR OTHERS, BY REGION 2019–2027 ($MILLION)
TABLE 12.NORTH AMERICA WLCSP ELECTROLESS PLATING MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 13.NORTH AMERICA WLCSP ELECTROLESS PLATING MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 14.U. S. WLCSP ELECTROLESS PLATING MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 15.U. S. WLCSP ELECTROLESS PLATING MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 16.CANADA WLCSP ELECTROLESS PLATING MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 17.CANADA WLCSP ELECTROLESS PLATING MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 18.MEXICO WLCSP ELECTROLESS PLATING MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 19.MEXICO WLCSP ELECTROLESS PLATING MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 20.EUROPE WLCSP ELECTROLESS PLATING MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 21.EUROPE WLCSP ELECTROLESS PLATING MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 22.UK WLCSP ELECTROLESS PLATING MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 23.UK WLCSP ELECTROLESS PLATING MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 24.GERMANY WLCSP ELECTROLESS PLATING MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 25.GERMANY WLCSP ELECTROLESS PLATING MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 26.FRNACE WLCSP ELECTROLESS PLATING MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 27.FRNACE WLCSP ELECTROLESS PLATING MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 28.ITALY WLCSP ELECTROLESS PLATING MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 29.ITALY WLCSP ELECTROLESS PLATING MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 30.REST OF EUROPE WLCSP ELECTROLESS PLATING MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 31.REST OF EUROPE WLCSP ELECTROLESS PLATING MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 32.ASIA-PACIFIC WLCSP ELECTROLESS PLATING MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 33.ASIA-PACIFIC WLCSP ELECTROLESS PLATING MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 34.CHINA WLCSP ELECTROLESS PLATING MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 35.CHINA WLCSP ELECTROLESS PLATING MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 36.JAPAN WLCSP ELECTROLESS PLATING MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 37.JAPAN WLCSP ELECTROLESS PLATING MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 38.SOUTH KOREA WLCSP ELECTROLESS PLATING MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 39.SOUTH KOREA WLCSP ELECTROLESS PLATING MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 40.AUSTRALIA WLCSP ELECTROLESS PLATING MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 41.AUSTRALIA WLCSP ELECTROLESS PLATING MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 42.REST OF ASIA-PACIFIC WLCSP ELECTROLESS PLATING MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 43.REST OF ASIA-PACIFIC WLCSP ELECTROLESS PLATING MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 44.LAMEA WLCSP ELECTROLESS PLATING MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 45.LAMEA WLCSP ELECTROLESS PLATING MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 46.LATIN AMERICA WLCSP ELECTROLESS PLATING MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 47.LATIN AMERICA WLCSP ELECTROLESS PLATING MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 48.MIDDLE EAST WLCSP ELECTROLESS PLATING MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 49.MIDDLE EAST WLCSP ELECTROLESS PLATING MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 50.AFRICA WLCSP ELECTROLESS PLATING MARKET, BY TYPE, 2019–2027 ($MILLION)
TABLE 51.AFRICA WLCSP ELECTROLESS PLATING MARKET, BY END USE, 2019–2027 ($MILLION)
TABLE 52.ARC TECHNOLOGIES, INC.: KEY EXECUTIVES
TABLE 53.ARC TECHNOLOGIES, INC.: COMPANY SNAPSHOT
TABLE 54.ARC TECHNOLOGIES, INC.: PRODUCT PORTFOLIO
TABLE 55.ATOTECH DEUTSCHLAND GMBH: KEY EXECUTIVES
TABLE 56.ATOTECH DEUTSCHLAND GMBH: COMPANY SNAPSHOT
TABLE 57.ATOTECH DEUTSCHLAND GMBH: OPERATING SEGMENTS
TABLE 58.ATOTECH DEUTSCHLAND GMBH: PRODUCT PORTFOLIO
TABLE 59.ATOTECH DEUTSCHLAND GMBH: R&D EXPENDITURE, 2016–2018 ($MILLION)
TABLE 60.ATOTECH DEUTSCHLAND GMBH: NET SALES, 2016–2018 ($MILLION)
TABLE 61.ATOTECH DEUTSCHLAND GMBH: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 62.BALES: KEY EXECUTIVES
TABLE 63.BALES: COMPANY SNAPSHOT
TABLE 64.BALES: PRODUCT PORTFOLIO
TABLE 65.C. UYEMURA & CO., LTD.: KEY EXECUTIVES
TABLE 66.C. UYEMURA & CO., LTD.: COMPANY SNAPSHOT
TABLE 67.C. UYEMURA & CO., LTD.: OPERATING SEGMENTS
TABLE 68.C. UYEMURA & CO., LTD.: PRODUCT PORTFOLIO
TABLE 69.C. UYEMURA & CO., LTD.: R&D EXPENDITURE, 2017–2019 ($MILLION)
TABLE 70.C. UYEMURA & CO., LTD.: REVENUE, 2017–2019 ($MILLION)
TABLE 71.COVENTYA INTERNATIONAL: KEY EXECUTIVES
TABLE 72.COVENTYA INTERNATIONAL: COMPANY SNAPSHOT
TABLE 73.COVENTYA INTERNATIONAL: PRODUCT PORTFOLIO
TABLE 74.ERIE PLATING COMPANY: KEY EXECUTIVES
TABLE 75.ERIE PLATING COMPANY: COMPANY SNAPSHOT
TABLE 76.ERIE PLATING COMPANY: PRODUCT PORTFOLIO
TABLE 77.KC JONES PLATING COMPANY: KEY EXECUTIVES
TABLE 78.KC JONES PLATING COMPANY: COMPANY SNAPSHOT
TABLE 79.KC JONES PLATING COMPANY: PRODUCT PORTFOLIO
TABLE 80.MACDERMID, INC.: KEY EXECUTIVES
TABLE 81.MACDERMID, INC.: COMPANY SNAPSHOT
TABLE 82.MACDERMID, INC.: PRODUCT PORTFOLIO
TABLE 83.NIHON PARKERIZING CO., LTD.: KEY EXECUTIVES
TABLE 84.NIHON PARKERIZING CO., LTD.: COMPANY SNAPSHOT
TABLE 85.NIHON PARKERIZING CO., LTD.: OPERATING SEGMENTS
TABLE 86.NIHON PARKERIZING CO., LTD.: PRODUCT PORTFOLIO
TABLE 87.NIHON PARKERIZING CO., LTD.: R&D EXPENDITURE, 2017–2019 ($MILLION)
TABLE 88.NIHON PARKERIZING CO., LTD.: NET SALES, 2017–2019 ($MILLION)
TABLE 89.OKUNO CHEMICAL INDUSTRIES CO., LTD.: KEY EXECUTIVES
TABLE 90.OKUNO CHEMICAL INDUSTRIES CO., LTD.: COMPANY SNAPSHOT
TABLE 91.OKUNO CHEMICAL INDUSTRIES CO., LTD.: PRODUCT PORTFOLIO
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