Global Bonding Wire Market , 2020-2026
- GEN3845055
- 121 Pages
- April 2020
- Semiconductor and Electronics
The bonding wire market is segmented on the basis of product, application, and region. The report offers a breakdown of market shares by product, including Gold Wire, Silver Wire, Copper Wire, Palladium Coated Copper Bonding Wire (PCC). By application, the bonding wire market is classified into Communications, Consumer Electronics, Automotive, Aerospace & Defense, Industrial, Medical. On the basis of region, the bonding wire industry is analyzed across North America, Europe, Asia-Pacific, South America and MEA (the Middle East, and Africa).
By Product:
- Gold Wire
- Silver Wire
- Copper Wire
- Palladium Coated Copper Bonding Wire (PCC)
By Application:
- Communications
- Consumer Electronics
- Automotive
- Aerospace & Defense
- Industrial
- Medical
By region, the market is analyzed across North America, Asia Pacific, Europe, Middle East & Africa and South America. This report forecasts revenue growth at global, regional & country level from 2020 to 2026.
- North America (U.S., Canada, Mexico, etc.)
- Asia-Pacific (China, Japan, India, Korea, Australia, Indonesia, Taiwan, Thailand, etc.)
- Europe (Germany, UK, France, Italy, Russia, Spain, etc.)
- Middle East & Africa (Turkey, Saudi Arabia, Iran, Egypt, Nigeria, UAE, Israel, South Africa, etc.)
- South America (Brazil, Argentina, Colombia, Chile, Venezuela, Peru, etc.)
The market research report covers the analysis of key stake holders of the bonding wire market. Some of the leading players profiled in the report include:
- Heraeus Holding GmbH
- TANAKA HOLDINGS Co., Ltd.
- MK Electron Co., Ltd.
- Ningbo Kangqiang Electronics Co., Ltd.
- Beijing Doublink Solders Co., Ltd.
- Yantai Yesno Electronic Materials Co., Ltd. (Parent of Yuh-Cheng Materials Co., Ltd.)
- LT Metal Co., Ltd. (Heesung Metal Industry Co., Ltd.)
- Nippon Micrometal Corporation (NIPPON STEEL Chemical & Material Co., Ltd.)
- Shandong Keda Dingxin Electronic Technology Co., Ltd.
- Sichuan Winner Special Electronic Materials Co., Ltd.
- Yantai Zhaojin Kanfort Precious Metals Co., Ltd.
- Zhejiang Jiabo Technology Co., Ltd.
- AMETEK, Inc.
- Custom Chip Connections, Inc.
- Henan Youke Electronic Material Co., Ltd.
- Microbonds Inc.
- TATSUTA Electric Wire & Cable Co., Ltd.
- Taya Group
- Wire Technology Co. Ltd.
- Niche-Tech Holdings Limited
*list is not exhaustive, request free sample to get a complete list of companies
The base year of the study is 2019, and forecasts run up to 2026.
Research Objective
- To analyze and forecast the market size of global bonding wire market.
- To classify and forecast global bonding wire market based on product, application, and region.
- To identify drivers and challenges for global bonding wire market.
- To examine competitive developments such as mergers & acquisitions, agreements, collaborations and partnerships, etc., in global bonding wire market.
- To conduct pricing analysis for global bonding wire market.
- To identify and analyze the profile of leading players operating in global bonding wire market.
The report is useful in providing answers to several critical questions that are important for the industry stakeholders such as manufacturers and partners, end users, etc., besides allowing them in strategizing investments and capitalizing on market opportunities. Key target audience are:
- Manufacturers of bonding wire
- Raw material suppliers
- Market research and consulting firms
- Government bodies such as regulating authorities and policy makers
- Organizations, forums and alliances related to bonding wire
1.1 Market Definition
1.2 Key Benefit
1.3 Market Segment
Part 2. Methodology
2.1 Primary
2.2 Secondary
Part 3. Executive Summary
Part 4. Market Overview
4.1 Introduction
4.2 Market Size and Forecast
4.3 Market Dynamics
4.3.1 Drivers
4.3.2 Restraints
4.4 Impact of COVID-19 Pandemic on Global Economy
4.5 Porter's Five Forces Analysis
4.5.1 Bargaining Power of Suppliers
4.5.2 Bargaining Power of Consumers
4.5.3 Threat of New Entrants
4.5.4 Threat of Substitute Products and Services
4.5.5 Degree of Competition
Part 5. Global Market for Bonding Wire by Product
5.1 Market Overview
5.2 Gold Wire
5.2.1 Market Size and Forecast
5.3 Silver Wire
5.3.1 Market Size and Forecast
5.4 Copper Wire
5.4.1 Market Size and Forecast
5.5 Palladium Coated Copper Bonding Wire (PCC)
5.5.1 Market Size and Forecast
Part 6. Global Market for Bonding Wire by Application
6.1 Market Overview
6.2 Communications
6.2.1 Market Size and Forecast
6.3 Consumer Electronics
6.3.1 Market Size and Forecast
6.4 Automotive
6.4.1 Market Size and Forecast
6.5 Aerospace & Defense
6.5.1 Market Size and Forecast
6.6 Industrial
6.6.1 Market Size and Forecast
6.7 Medical
6.7.1 Market Size and Forecast
Part 7. Global Market for Bonding Wire by Geography
7.1 Overview
7.1.1 Market Size and Forecast
7.2 North America
7.2.1 Market Size and Forecast
7.2.2 North America: Bonding Wire Market by Country
7.2.2.1 United States
7.2.2.2 Canada
7.2.2.3 Mexico
7.3 Europe
7.3.1 Market Size and Forecast
7.3.2 Europe: Bonding Wire Market by Country
7.3.2.1 Germany
7.3.2.2 France
7.3.2.3 United Kingdom
7.3.2.4 Italy
7.3.2.5 Rest of The Europe
7.4 Asia-Pacific
7.4.1 Market Size and Forecast
7.4.2 Asia-Pacific: Bonding Wire Market by Country
7.4.2.1 China
7.4.2.2 India
7.4.2.3 Japan
7.4.2.4 South Korea
7.4.2.5 ASEAN Countries
7.5 Middle East and Africa (MEA)
7.5.1 Market Size and Forecast
7.5.2 MEA: Bonding Wire Market by Country
7.5.2.1 Saudi Arabia
7.5.2.2 South Africa
7.5.2.3 Turkey
7.6 South America
7.6.1 Market Size and Forecast
7.6.2 South America: Bonding Wire Market by Country
7.6.2.1 Brazil
7.6.2.2 Argentina
7.6.2.3 Rest of South America
Part 8. Competitive Landscape
8.1 Market Share
8.2 Mergers & Acquisitions, Agreements, Collaborations and Partnerships
Part 9. Key Competitor Profiles
9.1 Heraeus Holding GmbH
9.2 TANAKA HOLDINGS Co., Ltd.
9.3 MK Electron Co., Ltd.
9.4 Ningbo Kangqiang Electronics Co., Ltd.
9.5 Beijing Doublink Solders Co., Ltd.
9.6 Yantai Yesno Electronic Materials Co., Ltd. (Parent of Yuh-Cheng Materials Co., Ltd.)
9.7 LT Metal Co., Ltd. (Heesung Metal Industry Co., Ltd.)
9.8 Nippon Micrometal Corporation (NIPPON STEEL Chemical & Material Co., Ltd.)
9.9 Shandong Keda Dingxin Electronic Technology Co., Ltd.
9.10 Sichuan Winner Special Electronic Materials Co., Ltd.
9.11 Yantai Zhaojin Kanfort Precious Metals Co., Ltd.
9.12 Zhejiang Jiabo Technology Co., Ltd.
9.13 AMETEK, Inc.
9.14 Custom Chip Connections, Inc.
9.15 Henan Youke Electronic Material Co., Ltd.
9.16 Microbonds Inc.
9.17 TATSUTA Electric Wire & Cable Co., Ltd.
9.18 Taya Group
9.19 Wire Technology Co. Ltd.
9.20 Niche-Tech Holdings Limited
*LIST IS NOT EXHAUSTIVE
Part 10. Patent Analysis
10.1 Patent Statistics
10.2 Regional Analysis
10.3 Trends Analysis
DISCLAIMER
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