Power Discrete and Modules Market By Type (Power Discrete and Power Module), Component (Thyristor, Diodes, Rectifier, MOSFET, IGBT, and Others), Material (SiC, GaN, and Others), and Industry Vertical (Telecommunication, Industrial, Automotive, Renewable, Consumer & Enterprise, Military, Defense & Aerospace, and Medical): Global Opportunity Analysis and Industry Forecast, 2019–2026
- ALL3815952
- 333 Pages
- February 2020
- Semiconductor and Electronics
IGBT, a power module, is a power switching transistor constructed to combine the high input impedance and high switching speeds of MOSFET with the low saturation voltage of BJT. IGBT is capable of handling large collector-emitter currents with virtually zero gate current drive. The increase in applications of IGBT in consumer electronics, automotive, energy & power, and industriesboosts the growth of the power discrete and modules market. Moreover, growth of power electronics in small gadgets fuels the further growth of the power discrete and modules market.
The demand for power discrete and module is expected to increase rapidly during the forecast period, owing to various factors such as increase in demand for power electronics modules across various industry verticals, increase in emphasis on power saving, and emergence and growth of electric vehicles. However, lack of material availability such as GaN is estimated to hamper the market growth. Nonetheless, rise in number of government initiatives in HVDC and smart grids and technological advancement of power MOSFET are expected to provide lucrative growth opportunities to the power discrete and modules market players.
The global power discrete and modules market is segmented on the basis oftype, component, material, industry vertical, and region. The type segment is bifurcated into power discrete and power module. Based on component, the market is categorized into thyristor, diode, rectifier, MOSFET, IGBT, and others. The material segment is bifurcated into SiC, GaN, and others. Based on industry vertical, the market is categorized into telecommunication; industrial; automotive; renewable; consumer &enterprise; military, defense, &aerospace; and medical. On the basis of region, it is analyzed across North America (the U.S., Mexico, and Canada), Europe (the UK, Germany, France, and rest of Europe), Asia-Pacific (China, India, Japan, South Korea, and rest of Asia-Pacific), and LAMEA (Latin America, Middle East, and Africa).
The key players operating in the power discrete and module market are Infineon Technologies AG, Mitsubishi Electric Corporation, Toshiba Corporation, ON Semiconductor, STMicroelectronics, NXP Semiconductors, Renesas Electronics Corporation, Texas Instruments, ROHM Semiconductors, and Semtech Corporation.
KEY MARKET SEGMENTS
BY TYPE
• Power Discrete
• Power Module
BY COMPONENT
• Thyristor
• Diode
• Rectifier
• MOSFET
• IGBT
• Other
BY MATERIAL
• SiC
• GaN
• Others
BY INDUSTRY VERTICAL
• Telecommunication
• Industrial
• Automotive
• Renewable
• Consumer and Enterprise
• Military, Defense, and Aerospace
• Medical
BY REGION
• North America
o U.S.
o Mexico
o Canada
• Europe
o UK
o Germany
o France
o Rest of Europe
• Asia-Pacific
o China
o India
o Japan
o South Korea
o Rest of Asia-Pacific
• LAMEA
o Latin America
o Middle East
o Africa
KEY PLAYERS
• Infineon Technologies AG
• Mitsubishi Electric Corporation
• Toshiba Corporation
• ON Semiconductor
• STMicroelectronics
• NXP Semiconductors
• Renesas Electronics Corporation
• Texas Instruments
• ROHM Semiconductors
• Semtech Corporation
1.1. Report description
1.2. Key benefits for stakeholders
1.3. Key market segments
1.4. Research methodology
1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models
Chapter 2: Executive summary
2.1. CXO perspective
Chapter 3: MARKET OVERVIEW
3.1. Market definition and scope
3.2. Key findings
3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.4. Porter’s five forces analysis
3.4.1. Moderate to high bargaining power of suppliers
3.4.2. Moderate threat of new entrants
3.4.3. Moderate threat of substitutes
3.4.4. Moderate to high intensity of rivalry
3.4.5. Moderate to high bargaining power of buyers
3.5. Patent Analysis
3.5.1. By Region (2012-2019)
3.5.2. By applicant
3.6. Market dynamics
3.6.1. Drivers
3.6.1.1. Increase in demand of power electronics modules across various industry verticals
3.6.1.2. Increasing emphasis on power saving.
3.6.1.3. Growth in demand of electric vehicles, plug-in electric vehicles, and hybrid electric vehicles.
3.6.2. Restraint
3.6.2.1. Lack of availability of GaN material
3.6.3. Opportunities
3.6.3.1. Government initiatives in HVDC and smart grid
3.6.3.1. Technological advancement in power MOSFET
Chapter 4: Power discrete and modules Market, BY type
4.1. Overview
4.2. Power discrete
4.2.1. Key market trends, growth factors, and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market analysis, by country
4.3. Power modules
4.3.1. Key market trends, growth factors, and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market analysis, by country
Chapter 5: Power discrete and modules Market, BY Component
5.1. Overview
5.2. Thyristor
5.2.1. Key market trends, growth factors, and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market analysis, by country
5.3. Diodes
5.3.1. Key market trends, growth factors, and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market analysis, by country
5.4. Rectifier
5.4.1. Key market trends, growth factors, and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market analysis, by country
5.5. MOSFET
5.5.1. Key market trends, growth factors, and opportunities
5.5.2. Market size and forecast, by region
5.5.3. Market analysis, by country
5.6. IGBT
5.6.1. Key market trends, growth factors, and opportunities
5.6.2. Market size and forecast, by region
5.6.3. Market analysis, by country
5.7. Others
5.7.1. Key market trends, growth factors, and opportunities
5.7.2. Market size and forecast, by region
5.7.3. Market analysis, by country
Chapter 6: Power discrete and modules Market, BY Material
6.1. Overview
6.2. SiC
6.2.1. Key market trends, growth factors, and opportunities
6.2.2. Market size and forecast, by region
6.2.3. Market analysis, by country
6.3. GaN
6.3.1. Key market trends, growth factors, and opportunities
6.3.2. Market size and forecast, by region
6.3.3. Market analysis, by country
6.4. Others
6.4.1. Key market trends, growth factors, and opportunities
6.4.2. Market size and forecast, by region
6.4.3. Market analysis, by country
Chapter 7: Power discrete and modules Market, BY Industry vertical
7.1. Overview
7.2. Telecommunication
7.2.1. Key market trends, growth factors, and opportunities
7.2.2. Market size and forecast, by region
7.2.3. Market analysis, by country
7.3. Industrial
7.3.1. Key market trends, growth factors, and opportunities
7.3.2. Market size and forecast, by region
7.3.3. Market analysis, by country
7.4. Automotive
7.4.1. Key market trends, growth factors, and opportunities
7.4.2. Market size and forecast, by region
7.4.3. Market analysis, by country
7.5. Renewable
7.5.1. Key market trends, growth factors, and opportunities
7.5.2. Market size and forecast, by region
7.5.3. Market analysis, by country
7.6. Consumer Electronics
7.6.1. Key market trends, growth factors, and opportunities
7.6.2. Market size and forecast, by region
7.6.3. Market analysis, by country
7.7. Military & Defense
7.7.1. Key market trends, growth factors, and opportunities
7.7.2. Market size and forecast, by region
7.7.3. Market analysis, by country
7.8. Medical
7.8.1. Key market trends, growth factors, and opportunities
7.8.2. Market size and forecast, by region
7.8.3. Market analysis, by country
Chapter 8: Power discrete and modules market, BY Region
8.1. Overview
8.2. North America
8.2.1. Key market trends, growth factors, and opportunities
8.2.2. Market size and forecast, by type
8.2.3. Market size and forecast, by component
8.2.4. Market size and forecast, by material
8.2.5. Market size and forecast, by industry vertical
8.2.6. Market analysis, by country
8.2.6.1. U.S.
8.2.6.1.2. Market size and forecast, by type
8.2.6.1.3. Market size and forecast, by component
8.2.6.1.4. Market size and forecast, by material
8.2.6.1.5. Market size and forecast, by industry vertical
8.2.6.2. Canada
8.2.6.2.2. Market size and forecast, by type
8.2.6.2.3. Market size and forecast, by component
8.2.6.2.4. Market size and forecast, by material
8.2.6.2.5. Market size and forecast, by industry vertical
8.2.6.3. Mexico
8.2.6.3.2. Market size and forecast, by type
8.2.6.3.3. Market size and forecast, by component
8.2.6.3.4. Market size and forecast, by material
8.2.6.3.5. Market size and forecast, by industry vertical
8.3. Europe
8.3.1. Key market trends, growth factors, and opportunities
8.3.2. Market size and forecast, by type
8.3.3. Market size and forecast, by component
8.3.4. Market size and forecast, by material
8.3.5. Market size and forecast, by industry vertical
8.3.6. Market analysis, by country
8.3.6.1. Germany
8.3.6.1.2. Market size and forecast, by type
8.3.6.1.3. Market size and forecast, by component
8.3.6.1.4. Market size and forecast, by material
8.3.6.1.5. Market size and forecast, by industry vertical
8.3.6.2. France
8.3.6.2.2. Market size and forecast, by type
8.3.6.2.3. Market size and forecast, by component
8.3.6.2.4. Market size and forecast, by material
8.3.6.2.5. Market size and forecast, by industry vertical
8.3.6.3. UK
8.3.6.3.2. Market size and forecast, by type
8.3.6.3.3. Market size and forecast, by component
8.3.6.3.4. Market size and forecast, by material
8.3.6.3.5. Market size and forecast, by industry vertical
8.3.6.4. Rest of Europe
8.3.6.4.2. Market size and forecast, by type
8.3.6.4.3. Market size and forecast, by component
8.3.6.4.4. Market size and forecast, by material
8.3.6.4.5. Market size and forecast, by industry vertical
8.4. Asia-Pacific
8.4.1. Key market trends, growth factors, and opportunities
8.4.2. Market size and forecast, by type
8.4.3. Market size and forecast, by component
8.4.4. Market size and forecast, by material
8.4.5. Market size and forecast, by industry vertical
8.4.6. Market analysis, by country
8.4.6.1. Japan
8.4.6.1.2. Market size and forecast, by type
8.4.6.1.3. Market size and forecast, by component
8.4.6.1.4. Market size and forecast, by material
8.4.6.1.5. Market size and forecast, by industry vertical
8.4.6.2. China
8.4.6.2.1. Market size and forecast, by type
8.4.6.2.2. Market size and forecast, by component
8.4.6.2.3. Market size and forecast, by material
8.4.6.2.4. Market size and forecast, by industry vertical
8.4.6.3. India
8.4.6.3.2. Market size and forecast, by type
8.4.6.3.3. Market size and forecast, by component
8.4.6.3.4. Market size and forecast, by material
8.4.6.3.5. Market size and forecast, by industry vertical
8.4.6.4. South Korea
8.4.6.4.2. Market size and forecast, by type
8.4.6.4.3. Market size and forecast, by component
8.4.6.4.4. Market size and forecast, by material
8.4.6.4.5. Market size and forecast, by industry vertical
8.4.6.5. Rest of Asia-Pacific
8.4.6.5.2. Market size and forecast, by type
8.4.6.5.3. Market size and forecast, by component
8.4.6.5.4. Market size and forecast, by material
8.4.6.5.5. Market size and forecast, by industry vertical
8.5. LAMEA
8.5.1. Key market trends, growth factors, and opportunities
8.5.2. Market size and forecast, by type
8.5.3. Market size and forecast, by component
8.5.4. Market size and forecast, by material
8.5.5. Market size and forecast, by industry vertical
8.5.6. Market analysis, by country
8.5.6.1. Latin America
8.5.6.1.2. Market size and forecast, by type
8.5.6.1.3. Market size and forecast, by component
8.5.6.1.4. Market size and forecast, by material
8.5.6.1.5. Market size and forecast, by industry vertical
8.5.6.2. Middle East
8.5.6.2.2. Market size and forecast, by type
8.5.6.2.3. Market size and forecast, by component
8.5.6.2.4. Market size and forecast, by material
8.5.6.2.5. Market size and forecast, by industry vertical
8.5.6.3. Africa
8.5.6.3.2. Market size and forecast, by type
8.5.6.3.3. Market size and forecast, by component
8.5.6.3.4. Market size and forecast, by material
8.5.6.3.5. Market size and forecast, by industry vertical
Chapter 9: COMPETITIVE LANDSCAPE
9.1. Introduction
9.1.1. Market player positioning, 2019
9.2. Top winning strategies
9.3. Product Mapping Of Top 10 Player
9.4. Competitive Dashboard
9.5. Competitive Heatmap
Chapter 10: Company profiles
10.1. Infineon Technologies AG
10.1.1. Company overview
10.1.2. Company snapshot
10.1.3. Operating business segments
10.1.4. Product portfolio
10.1.5. Business performance
10.1.6. Key strategic moves and developments
10.2. Mitsubishi Electric Corporation
10.2.1. Company overview
10.2.2. Company snapshot
10.2.3. Operating business segments
10.2.4. Product portfolio
10.2.5. Business performance
10.2.6. Key strategic moves and developments
10.3. NXP Semiconductor
10.3.1. Company overview
10.3.2. Company snapshot
10.3.3. Product portfolio
10.3.4. Product portfolio
10.3.5. R&D Expenditure
10.3.6. Business performance
10.3.7. Key strategic moves and developments
10.4. ON Semiconductor
10.4.1. Company overview
10.4.2. Company snapshot
10.4.3. Operating business segments
10.4.4. Product portfolio
10.4.5. Business performance
10.4.6. Key strategic moves and developments
10.5. ROHM Semiconductors
10.5.1. Company overview
10.5.2. Company snapshot
10.5.3. Operating business segments
10.5.4. Product portfolio
10.5.5. R&D Expenditure
10.5.6. Business performance
10.5.7. Key strategic moves and developments
10.6. Renesas Electronics
10.6.1. Company overview
10.6.2. Company snapshot
10.6.3. Operating business segments
10.6.4. Product portfolio
10.6.5. R&D Expenditure
10.6.6. Business performance
10.6.7. Key strategic moves and developments
10.7. STMicroelectronics
10.7.1. Company overview
10.7.2. Company snapshot
10.7.3. Operating business segments
10.7.4. Product portfolio
10.7.5. R&D Expenditure
10.7.6. Business performance
10.7.7. Key strategic moves and developments
10.8. Semtech Corporation
10.8.1. Company overview
10.8.2. Company snapshot
10.8.3. Operating business segments
10.8.4. Product portfolio
10.8.5. Business performance
10.8.6. Key strategic moves and developments
10.9. Texas Instruments
10.9.1. Company overview
10.9.2. Company snapshot
10.9.3. Operating business segments
10.9.4. Product portfolio
10.9.5. R&D Expenditure
10.9.6. Business performance
10.9.7. Key strategic moves and developments
10.10. Toshiba Corporation
10.10.1. Company overview
10.10.2. Company snapshot
10.10.3. Operating business segments
10.10.4. Product portfolio
10.10.5. Business performance
10.10.6. Key strategic moves and developments
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