Redistribution Layer Material Market to 2027 - Global Analysis and Forecasts by Material (Polyimide (PI), Polybenzoxazole (PBO), Benzocylobutene (BCB), and Others); Application (FOWLP and 2.5D/3D IC Packaging)
- THE3206949
- 154 Pages
- February 2019
- Materials and Chemicals
The advent of IoT has enabled each device to be connected over the internet and the rising adoptions globally would result in more than billions of devices connected over the internet. Also, validating to the above mentioned point is the fact that the data traffic rate on a global level, has grown at an annual rate of more than 65% over the last five years. Also, between 2018 and 2023, the data traffic is anticipated to grow at a compound annual growth rate of close to 40 percent. This exponential growth in data traffic over the internet is out rightly attributed to the growing penetration of smartphones and other consumer electronic devices that can be connected over the internet as a result of the growing popularity of IoT.
The number of mobile subscriptions exceeds the population in many countries, which is largely due to inactive subscriptions, multiple device ownership or optimization of subscriptions for different types of calls. As a result, the number of subscribers is lower than the number of subscriptions. Today, there are around 5.3 billion subscribers globally compared to 7.9 billion subscriptions. Also, 98 million new mobile subscriptions was observed globally in first quarter of 2018. Huge populations of India and China are further proliferating the growing penetration of smart phones and other consumer electronic devices. Additionally, the Government initiatives towards digitalization of economies in these countries is leading to exponential growth of data traffic over the internet in these countries and also on a global scale for other developing economies. Brazil, Uruguay, Argentina, Chile, Colombia, UAE, Saudi Arabia, South Africa, Vietnam and Singapore are other major countries embracing the path of digitalization and resulting in huge influx of data over the internet.
The overall redistribution layer material market size has been derived using both primary and secondary source. The research process begins with exhaustive secondary research using internal and external sources to obtain qualitative and quantitative information related to the redistribution layer material market. It also provides the overview and forecast for the global redistribution layer material market based on all the segmentation provided with respect to five major reasons such as North America, Europe, Asia-Pacific, Rest of World (RoW). Also, primary interviews were conducted with industry participants and commentators in order to validate data and analysis. The participants who typically take part in such a process include industry expert such as VPs, business development managers, market intelligence managers, and national sales managers, and external consultants such as valuation experts, research analysts, and key opinion leaders specializing in the Redistribution Layer Material industry. Some of the players present in the redistribution layer material market are NXP Semiconductors N.V., Samsung Electronics Co. Ltd, Shin-Etsu Chemical Co., Ltd., SK HYNIX INC., Sumitomo Bakelite Co., Ltd, The Dow Chemical Company, Toray Industries, Inc., and Taiwan Semiconductor Manufacturing Company Ltd. Among others, Fujifilm Holdings Corporation, Hitachi Chemical DuPont MicroSystems L.L.C., and Infineon Technologies AG are other prominent players in the redistribution layer material market.
1. INTRODUCTION
1.1 SCOPE OF THE STUDY
1.2 THE INSIGHT PARTNERS RESEARCH REPORT GUIDANCE
2. KEY TAKEAWAYS
3. RESEARCH METHODOLOGY
3.1.1 Coverage
3.1.2 Secondary Research
3.1.3 Primary Research
4. REDISTRIBUTION LAYER MATERIAL MARKET - PREMIUM INSIGHTS
4.1 OTHER RDL APPLICATIONS
4.1.1 CIS Packaging RDL
4.1.2 PLP Packaging RDL
4.2 RDL TECHNOLOGY OUTLOOK
4.2.1 Wafer Level Packaging (WLP)
4.2.1.1 Wafer-Level Chip Scale Packaging (WLCSP)
4.2.1.2 Fan-Out Wafer-Level Chip Scale Packaging (WLCSP)
4.2.2 Through Silicon Vias (TSV)
4.2.3 Copper Pillar
4.2.4 Solder Bump
5. REDISTRIBUTION LAYER MATERIAL MARKET LANDSCAPE
5.1.1 Global Redistribution Layer Material Market - By Material
5.1.2 Global Redistribution Layer Material Market - By Application
5.1.2.1 Global Redistribution Layer Material Market - By 2.5D/3D IC Packaging
5.1.3 Global Redistribution Layer Material Market - By Geography
5.2 PEST ANALYSIS
5.2.1 North America PEST Analysis
5.2.2 Europe PEST Analysis
5.2.3 Asia Pacific PEST Analysis
5.2.4 Rest of World PEST Analysis
6. REDISTRIBUTION LAYER MATERIAL MARKET - KEY INDUSTRY DYNAMICS
6.1 KEY MARKET DRIVERS
6.1.1 Growing trends of miniaturization of consumer electronic devices
6.1.2 Increasing automation integrations in the highly prominent manufacturing sector worldwide
6.2 KEY MARKET RESTRAINTS
6.2.1 Higher costs incurred and O&M complexities
6.3 KEY MARKET OPPORTUNITIES
6.3.1 Proliferation of IoT and connected devices across industry verticals
6.4 FUTURE TRENDS
6.4.1 Advancements in the packaging technology
6.5 IMPACT ANALYSIS OF DRIVERS AND RESTRAINTS
7. REDISTRIBUTION LAYER MATERIAL MARKET - GLOBAL
7.1 GLOBAL REDISTRIBUTION LAYER MATERIAL MARKET OVERVIEW
7.2 GLOBAL REDISTRIBUTION LAYER MATERIAL MARKET FORECAST AND ANALYSIS
8. REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027 - APPLICATION
8.1 OVERVIEW
8.2 REDISTRIBUTION LAYER MATERIAL MARKET BREAKDOWN, BY APPLICATION, 2018 & 2027
8.3 FAN-OUT WAFER LEVEL PACKAGING (FOWLP)
8.3.1 Overview
8.3.2 FOWLP Market Revenue and Forecasts to 2027 (US$ Mn)
8.4 2.5D/3D IC PACKAGING
8.4.1 Overview
8.4.2 2.5D/3D IC Packaging Market Revenue and Forecasts to 2027 (US$ Mn)
8.4.3 Redistribution Layer Material Market Breakdown, By 2.5D/3D IC Packaging, 2018 & 2027
8.4.3.1 High Bandwidth Memory (HBM) Overview
8.4.3.1.1 High Bandwidth Memory Market Revenue and Forecasts to 2027 (US$ Mn)
8.4.3.2 Multi-Chip Integration Overview
8.4.3.2.1 Multi-Chip Integration Market Revenue and Forecasts to 2027 (US$ Mn)
8.4.3.3 Package on Package (FOPOP) Overview
8.4.3.3.1 Package on Package Market Revenue and Forecasts to 2027 (US$ Mn)
8.4.3.4 Others Overview
8.4.3.4.1 Others Market Revenue and Forecasts to 2027 (US$ Mn)
9. REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027 - MATERIAL
9.1 OVERVIEW
9.2 REDISTRIBUTION LAYER MATERIAL MARKET BREAKDOWN, BY MATERIAL, 2018 & 2027
9.3 POLYIMIDE (PI)
9.3.1 Overview
9.3.2 Polyimide (PI) Market Revenue and Forecasts to 2027 (US$ Mn)
9.4 POLYBENZOXAZOLE (PBO)
9.4.1 Overview
9.4.2 Polybenzoxazole (PBO) Market Revenue and Forecasts to 2027 (US$ Mn)
9.5 BENZOCYLOBUTENE (BCB)
9.5.1 Overview
9.5.2 Benzocylobutene (BCB) Market Revenue and Forecasts to 2027 (US$ Mn)
9.6 OTHERS
9.6.1 Overview
9.6.2 Others Market Revenue and Forecasts to 2027 (US$ Mn)
10. REDISTRIBUTION LAYER MATERIAL MARKET - GEOGRAPHICAL ANALYSIS
10.1 OVERVIEW
10.2 NORTH AMERICA REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027
10.2.1 Overview
10.2.2 North America Redistribution Layer Material Market Breakdown by Key Countries
10.2.2.1 U.S. Redistribution Layer Material Market Revenue and Forecasts to 2027 (US$ Mn)
10.2.2.2 Rest of North America Redistribution Layer Material Market Revenue and Forecasts to 2027 (US$ Mn)
10.2.3 North America Redistribution Layer Material Market Breakdown by Material
10.2.4 North America Redistribution Layer Material Market Breakdown by Application
10.2.4.1 North America Redistribution Layer Material Market Breakdown by 2.5D/3D IC Packaging
10.3 EUROPE REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027
10.3.1 Overview
10.3.2 Europe Redistribution Layer Material Market Breakdown by Key Countries
10.3.2.1 Portugal Redistribution Layer Material Market Revenue and Forecasts to 2027 (US$ Mn)
10.3.2.2 Germany Redistribution Layer Material Market Revenue and Forecast to 2027 (US$ Mn)
10.3.2.3 U.K. Redistribution Layer Material Market Revenue and Forecasts to 2027 (US$ Mn)
10.3.2.4 Rest of Europe Redistribution Layer Material Market Revenue and Forecasts to 2027 (US$ Mn)
10.3.3 Europe Redistribution Layer Material Market Breakdown by Material
10.3.4 Europe Redistribution Layer Material Market Breakdown by Application
10.3.4.1 Europe Redistribution Layer Material Market Breakdown by 2.5D/3D IC Packaging
10.4 APAC REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027
10.4.1 Overview
10.4.2 APAC Redistribution Layer Material Market Breakdown by Key Countries
10.4.3 South Korea Redistribution Layer Material Market Revenue and Forecasts to 2027 (US$ Mn)
10.4.3.1 China Redistribution Layer Material Market Revenue and Forecasts to 2027 (US$ Mn)
10.4.3.2 Taiwan Redistribution Layer Material Market Revenue and Forecasts to 2027 (US$ Mn)
10.4.3.3 Japan Redistribution Layer Material Market Revenue and Forecasts to 2027 (US$ Mn)
10.4.3.4 Rest of APAC Redistribution Layer Material Market Revenue and Forecasts to 2027 (US$ Mn)
10.4.4 APAC Redistribution Layer Material Market Breakdown by Material
10.4.5 APAC Redistribution Layer Material Market Breakdown by Application
10.4.5.1 APAC Redistribution Layer Material Market Breakdown by 2.5D/3D IC Packaging
10.5 REST OF WORLD (ROW) REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027
10.5.1 Overview
10.5.2 ROW Redistribution Layer Material Market Breakdown by Material
10.5.3 ROW Redistribution Layer Material Market Breakdown by Application
10.5.3.1 ROW Redistribution Layer Material Market Breakdown by 2.5D/3D IC Packaging
11. INDUSTRY LANDSCAPE
11.1 OVERVIEW
11.2 MARKET INITIATIVE
11.3 MERGER AND ACQUISITION
11.4 NEW DEVELOPMENT
11.5 MARKET POSITIONING - GLOBAL TOP 5 PLAYERS RANKING
12. COMPANY PROFILES
12.1 ADVANCED SEMICONDUCTOR ENGINEERING, INC. (ASE GROUP)
12.1.1 Key Facts
12.1.2 Business Description
12.1.3 Products and Services
12.1.4 Financial Overview
12.1.5 SWOT Analysis
12.1.6 Key Developments
12.2 AMKOR TECHNOLOGY, INC.
12.2.1 Key Facts
12.2.2 Business Description
12.2.3 Products and Services
12.2.4 Financial Overview
12.2.5 SWOT Analysis
12.2.6 Key Developments
12.3 FUJIFILM HOLDINGS CORPORATION
12.3.1 Key Facts
12.3.2 Business Description
12.3.3 Products and Services
12.3.4 Financial Overview
12.3.5 SWOT Analysis
12.3.6 Key Developments
12.4 HITACHI CHEMICAL DUPONT MICROSYSTEMS L.L.C.
12.4.1 Key Facts
12.4.2 Business Description
12.4.3 Products and Services
12.4.4 Financial Overview
12.4.5 SWOT Analysis
12.5 INFINEON TECHNOLOGIES AG
12.5.1 Key Facts
12.5.2 Business Description
12.5.3 Products and Services
12.5.4 Financial Overview
12.5.5 SWOT Analysis
12.5.6 Key Developments
12.6 JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.(JCET)
12.6.1 Key Facts
12.6.2 Business Description
12.6.3 Products and Services
12.6.4 Financial Overview
12.6.5 SWOT Analysis
12.6.6 Key Developments
12.7 NXP SEMICONDUCTORS N.V.
12.7.1 Key Facts
12.7.2 Business Description
12.7.3 Products and Services
12.7.4 Financial Overview
12.7.5 SWOT Analysis
12.7.6 Key Developments
12.8 SAMSUNG ELECTRONICS CO. LTD.
12.8.1 Key Facts
12.8.2 Business Description
12.8.3 Products and Services
12.8.4 Financial Overview
12.8.5 SWOT Analysis
12.8.6 Key Developments
12.9 SHIN-ETSU CHEMICAL CO., LTD.
12.9.1 Key Facts
12.9.2 Business Description
12.9.3 Products and Services
12.9.4 Financial Overview
12.9.5 SWOT Analysis
12.9.6 Key Developments
12.10 SK HYNIX INC.
12.10.1 Key Facts
12.10.2 Business Description
12.10.3 Products and Services
12.10.4 Financial Overview
12.10.5 SWOT Analysis
12.10.6 Key Developments
12.11 SUMITOMO BAKELITE CO., LTD.
12.11.1 Key Facts
12.11.2 Business Description
12.11.3 Products and Services
12.11.4 Financial Overview
12.11.5 SWOT Analysis
12.11.6 Key Developments
12.12 THE DOW CHEMICAL COMPANY
12.12.1 Key Facts
12.12.2 Business Description
12.12.3 Products and Services
12.12.4 Financial Overview
12.12.5 SWOT Analysis
12.12.6 Key Developments
12.13 TORAY INDUSTRIES, INC.
12.13.1 Key Facts
12.13.2 Business Description
12.13.3 Products and Services
12.13.4 Financial Overview
12.13.5 SWOT Analysis
12.13.6 Key Developments
12.14 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
12.14.1 Key Facts
12.14.2 Business Description
12.14.3 Products and Services
12.14.4 Financial Overview
12.14.5 SWOT Analysis
12.14.6 Key Developments
13. ADDITIONAL CUSTOMIZATION
13.1 PRICING ANALYSIS
13.2 PRODUCT MAPPING
14. APPENDIX
14.1 ABOUT THE INSIGHT PARTNERS
14.2 GLOSSARY OF TERMS
LIST OF TABLES
TABLE 1. GLOBAL REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027 (US$ MN)
TABLE 2. NORTH AMERICA REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027 - BY MATERIAL (US$ MN)
TABLE 3. NORTH AMERICA REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027 - BY APPLICATION (US$ MN)
TABLE 4. NORTH AMERICA REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027 - BY 2.5D/3D IC PACKAGING (US$ MN)
TABLE 5. EUROPE REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027 - BY MATERIAL (US$ MN)
TABLE 6. EUROPE REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027 - BY APPLICATION (US$ MN)
TABLE 7. EUROPE REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027 - BY 2.5D/3D IC PACKAGING (US$ MN)
TABLE 8. APAC REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027 - BY MATERIAL (US$ MN)
TABLE 9. APAC REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027 - BY APPLICATION (US$ MN)
TABLE 10. APAC REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027 - BY 2.5D/3D IC PACKAGING (US$ MN)
TABLE 11. ROW REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027 - BY MATERIAL (US$ MN)
TABLE 12. ROW REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027 - BY APPLICATION (US$ MN)
TABLE 13. ROW REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027 - BY 2.5D/3D IC PACKAGING (US$ MN)
TABLE 14. GLOSSARY OF TERM: REDISTRIBUTION LAYER MATERIAL MARKET
LIST OF FIGURES
FIGURE 1. GLOBAL REDISTRIBUTION LAYER MATERIAL MARKET, (US$ MN), 2018 & 2027
FIGURE 2. APAC REDISTRIBUTION LAYER MATERIAL MARKET REVENUE (US$ MN),
2018 & 2027
FIGURE 3. NORTH AMERICA 2.5D/3D IC PACKAGING RDL MATERIAL MARKET REVENUE
(US$ MN), 2018 & 2027
FIGURE 4. REDISTRIBUTION LAYER MATERIAL MARKET SEGMENTATION
FIGURE 5. REDISTRIBUTION LAYER MATERIAL MARKET SEGMENTATION - GEOGRAPHIC
FIGURE 6. NORTH AMERICA - PEST ANALYSIS
FIGURE 7. EUROPE - PEST ANALYSIS
FIGURE 8. ASIA PACIFIC - PEST ANALYSIS
FIGURE 9. ROW - PEST ANALYSIS
FIGURE 10. SUBSCRIPTION PENETRATION IN QUARTER-1 2018 (PERCENT OF POPULATION)
FIGURE 11. REDISTRIBUTION LAYER MATERIAL MARKET IMPACT ANALYSIS OF DRIVER AND RESTRAINTS
FIGURE 12. GLOBAL REDISTRIBUTION LAYER MATERIAL MARKET
FIGURE 13. GLOBAL REDISTRIBUTION LAYER MATERIAL MARKET FORECAST AND ANALYSIS
FIGURE 14. REDISTRIBUTION LAYER MATERIAL MARKET BREAKDOWN, BY APPLICATION,
2018 & 2027 (%)
FIGURE 15. GLOBAL FAN-OUT WAFER LEVEL PACKAGING MARKET REVENUE AND FORECASTS TO 2027 (US$ MN)
FIGURE 16. GLOBAL 2.5D/3D IC PACKAGING MARKET REVENUE AND FORECASTS TO 2027 (US$ MN)
FIGURE 17. REDISTRIBUTION LAYER MATERIAL MARKET BREAKDOWN, BY 2.5D/3D IC PACKAGING, 2018 & 2027 (%)
FIGURE 18. GLOBAL HIGH BANDWIDTH MEMORY MARKET REVENUE AND FORECASTS TO 2027 (US$ MN)
FIGURE 19. GLOBAL MULTI-CHIP INTEGRATION MARKET REVENUE AND FORECASTS TO 2027 (US$ MN)
FIGURE 20. GLOBAL PACKAGE ON PACKAGE MARKET REVENUE AND FORECASTS TO 2027 (US$ MN)
FIGURE 21. GLOBAL OTHERS MARKET REVENUE AND FORECASTS TO 2027 (US$ MN)
FIGURE 22. REDISTRIBUTION LAYER MATERIAL MARKET BREAKDOWN, BY MATERIAL,
2018 & 2027 (%)
FIGURE 23. GLOBAL POLYIMIDE (PI) MARKET REVENUE AND FORECASTS TO 2027 (US$ MN)
FIGURE 24. GLOBAL POLYBENZOXAZOLE (PBO) MARKET REVENUE AND FORECASTS TO 2027 (US$ MN)
FIGURE 25. GLOBAL BENZOCYLOBUTENE (BCB) MARKET REVENUE AND FORECASTS TO 2027 (US$ MN)
FIGURE 26. GLOBAL OTHERS MARKET REVENUE AND FORECASTS TO 2027 (US$ MN)
FIGURE 27. REDISTRIBUTION LAYER MATERIAL MARKET, GLOBAL BREAKDOWN BY REGIONS, 2018 & 2027 (%)
FIGURE 28. NORTH AMERICA REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027 (US$ MN)
FIGURE 29. NORTH AMERICA REDISTRIBUTION LAYER MATERIAL MARKET BREAKDOWN
BY KEY COUNTRIES, 2018 & 2027(%)
FIGURE 30. U.S. REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027 (US$ MN)
FIGURE 31. REST OF NORTH AMERICA REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027 (US$ MN)
FIGURE 32. NORTH AMERICA REDISTRIBUTION LAYER MATERIAL MARKET BREAKDOWN,
BY MATERIAL, 2018 & 2027 (%)
FIGURE 33. NORTH AMERICA REDISTRIBUTION LAYER MATERIAL MARKET BREAKDOWN,
BY APPLICATION, 2018 & 2027 (%)
FIGURE 34. EUROPE REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027 (US$ MN)
FIGURE 35. EUROPE REDISTRIBUTION LAYER MATERIAL MARKET BREAKDOWN BY KEY COUNTRIES, 2018 & 2027(%)
FIGURE 36. PORTUGAL REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027 (US$ MN)
FIGURE 37. GERMANY REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027 (US$ MN)
FIGURE 38. U.K. REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027 (US$ MN)
FIGURE 39. REST OF EUROPE REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027 (US$ MN)
FIGURE 40. EUROPE REDISTRIBUTION LAYER MATERIAL MARKET BREAKDOWN, BY MATERIAL, 2018 & 2027 (%)
FIGURE 41. EUROPE REDISTRIBUTION LAYER MATERIAL MARKET BREAKDOWN,
BY APPLICATION, 2018 & 2027 (%)
FIGURE 42. APAC REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027 (US$ MN)
FIGURE 43. APAC REDISTRIBUTION LAYER MATERIAL MARKET BREAKDOWN BY KEY COUNTRIES, 2018 & 2027(%)
FIGURE 44. SOUTH KOREA REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027 (US$ MN)
FIGURE 45. CHINA REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027 (US$ MN)
FIGURE 46. TAIWAN REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027 (US$ MN)
FIGURE 47. JAPAN REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027 (US$ MN)
FIGURE 48. REST OF APAC REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027 (US$ MN)
FIGURE 49. APAC REDISTRIBUTION LAYER MATERIAL MARKET BREAKDOWN, BY MATERIAL, 2018 & 2027 (%)
FIGURE 50. APAC REDISTRIBUTION LAYER MATERIAL MARKET BREAKDOWN, BY APPLICATION, 2018 & 2027 (%)
FIGURE 51. ROW REDISTRIBUTION LAYER MATERIAL MARKET REVENUE AND FORECASTS TO 2027 (US$ MN)
FIGURE 52. ROW REDISTRIBUTION LAYER MATERIAL MARKET BREAKDOWN, BY MATERIAL, 2018 & 2027 (%)
FIGURE 53. ROW REDISTRIBUTION LAYER MATERIAL MARKET BREAKDOWN, BY APPLICATION, 2018 & 2027 (%)
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