Potting Compound Market by Resin Type (Epoxy, Polyurethane, Silicone, Polyester, Polyamide, Polyolefin, and Acrylics), Curing Techniques (UV Curing, Thermal Curing, and Room Temperature Curing), and Application (Electrical and Electronics), and End User (Electronics, Aerospace, Automotive, Industrial, and Others): Global Opportunity Analysis and Industry Forecast, 2018 - 2025
- ALL3138277
- 505 Pages
- April 2019
- Materials and Chemicals
Potting compounds are used as encapsulants to protect electronic components and equipment from water, chemical chock, voltage discharge, vibration, and physical damage. Potting material is introduced during the electronic assembly and offers excellent adhesive properties; hence, they are extremely difficult to remove once they are placed in the desired place by making rework impossible. Potting process can be performed either manually or by using automated meter-mix-dispense (MMD) equipment.
Electronics and electrical production is rising at a rapid pace due to rise in nuclear families and resulting sale of electronics appliances. With this the need for protecting the components also increase, thereby driving the potting compounds market. Growth in preference for portable products and smaller devices has led to the trend for microelectronics, thereby driving the demand for potting material. On the other hand, growth of this market is expected to restrain by improper selection of the potting resin due to application-specific nature of few potting resins.
The global potting compounds market is segmented into resin type, curing techniques, application, end user, and region. The report focuses on resin types such as polyurethane, silicone, epoxy, polyester, polyolefin, polyamide, and others. By curing technique, the market is classified into UV curing, thermal curing, and room temperature curing. Based on application, the market is segmented into electrical and electronics.
On the basis of end user, the market is classified into electronics, aerospace, automotive, industrial, and others. Some of the major manufacturers profiled in the report include Henkel AG & Co. KGaA, The 3M Company, MG Chemicals, ELANTAS GmbH, ALPAS Srl, Dymax Corporation, Master Bond, Inc., Lord Corporation, Aremco Products, Inc., RBC Industries, Inc., Shanghai Sepna Chemical Technology Co. Ltd., DowDupont Inc, HItach Chemical LLC, WEVO-CHEMIE Gmb, Huntsman Advanced Materials, and Wacker-Chemie.
KEY BENEFITS FOR STAKEHOLDERS
The report provides an extensive qualitative and quantitative analysis of the current trends and future estimations of the potting compound market from 2018 to 2025 to determine the prevailing opportunities.
A comprehensive analysis of the factors that drive and restrict the growth of the market is provided.
Estimations and forecast based on factors impacting the market growth, in terms of value, are provided.
Profiles of leading players operating in the market are provided to understand the competitive scenario.
The report provides extensive qualitative insights on the significant segments and regions exhibiting favorable market growth
KEY MARKET SEGMENTS
• By Resin Type
Epoxy
Polyurethane
Silicone
Polyester
Polyamide
Polyolefin
Acrylics
• By Curing Technology
UV Curing
Thermal Curing
Room Temperature Curing
• By Application
Electrical
Electronics
• By End User
Electronics
Aerospace
Automotive
Industrial
Others
• By Region
o North America
U.S.
Canada
Mexico
o Europe
Germany
UK
France
Italy
Spain
Rest of Europe
o Asia-Pacific
China
Japan
India
Australia
South Korea
Rest of Europe
o LAMEA
Brazil
Saudi Arabia
South Africa
Rest of LAMEA
KEY MARKET PLAYERS
• Henkel AG & Co. KGaA
• The 3M Company.
• MG Chemicals
• ELANTAS GmbH
• ALPAS Srl
• Dymax Corporation,
• Aremco Products, Inc.
• DowDuPont Inc
• HItach Chemical LLC
• WEVO-CHEMIE GmbH
• Huntsman Advanced Materials
• Wacker-Chemie
The other players in the value chain include Master Bond, Inc., Lord Corporation, RBC Industries, Inc., and Shanghai Sepna Chemical Technology Co. Ltd.
1.1. Report description
1.2. Key benefits for stakeholders
1.3. Key market segments
1.4. Research methodology
1.4.1. Secondary research
1.4.2. Primary research
1.5. Analyst tools and models
Chapter: 2: EXECUTIVE SUMMARY
2.1. Key findings of the study
2.2. CXO perspective
Chapter: 3: MARKET OVERVIEW
3.1. Market definition and scope
3.2. Key findings
3.2.1. Top investment pockets
3.2.2. Top winning strategies
3.3. Porter’s five forces analysis
3.4. Market dynamics
3.4.1. Drivers
3.4.1.1. Perfectly suitable properties for electronic applications
3.4.1.2. Increased consumer electronic industry output and trend for miniaturization
3.4.2. Restraint
3.4.2.1. Improper section of potting resin
3.4.3. Opportunity
3.4.3.1. Gradual adoption of two component polyurethane potting compounds
3.5. Top player positioning, 2017
Chapter: 4: GLOBAL POTTING COMPOUNDS MARKET, BY RESIN TYPE
4.1. Overview
4.1.1. Market size and forecast
4.2. Epoxy
4.2.1. Key market trends, growth factors, and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market share analysis, by country
4.3. Polyurethane
4.3.1. Key market trends, growth factors, and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market share analysis, by country
4.4. Silicone
4.4.1. Key market trends, growth factors, and opportunities
4.4.2. Market size and forecast, by region
4.4.3. Market share analysis, by country
4.5. Polyester
4.5.1. Key market trends, growth factors, and opportunities
4.5.2. Market size and forecast, by region
4.5.3. Market share analysis, by country
4.6. Polyamide
4.6.1. Key market trends, growth factors, and opportunities
4.6.2. Market size and forecast, by region
4.6.3. Market share analysis, by country
4.7. Polyolefin
4.7.1. Key market trends, growth factors, and opportunities
4.7.2. Market size and forecast, by region
4.7.3. Market share analysis, by country
4.8. Acrylics
4.8.1. Key market trends, growth factors, and opportunities
4.8.2. Market size and forecast, by region
4.8.3. Market share analysis, by country
Chapter: 5: GLOBAL POTTING COMPOUNDS MARKET, BY CURING TECHNIQUE
5.1. Overview
5.1.1. Market size and forecast
5.2. UV Curing
5.2.1. Key market trends, growth factors, and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market share analysis, by country
5.3. Thermal Curing
5.3.1. Key market trends, growth factors, and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market share analysis, by country
5.4. Room Temperature Curing
5.4.1. Key market trends, growth factors, and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market share analysis, by country
Chapter: 6: GLOBAL POTTING COMPOUNDS MARKET, BY APPLICATION
6.1. Overview
6.1.1. Market size and forecast
6.2. Electrical
6.2.1. Key market trends, growth factors, and opportunities
6.2.2. Market size and forecast, by region
6.2.3. Market size and forecast, by type
6.2.4. Market share analysis, by country
6.3. Electronics
6.3.1. Key market trends, growth factors, and opportunities
6.3.2. Market size and forecast, by region
6.3.3. Market size and forecast, by type
6.3.4. Market share analysis, by country
Chapter: 7: GLOBAL POTTING COMPOUNDS MARKET, BY END USER
7.1. Overview
7.1.1. Market size and forecast
7.2. Electronics
7.2.1. Key market trends, growth factors, and opportunities
7.2.2. Market size and forecast, by region
7.2.3. Market share analysis, by country
7.3. Aerospace
7.3.1. Key market trends, growth factors, and opportunities
7.3.2. Market size and forecast, by region
7.3.3. Market share analysis, by country
7.4. Automotive
7.4.1. Key market trends, growth factors, and opportunities
7.4.2. Market size and forecast, by region
7.4.3. Market share analysis, by country
7.5. Industrial
7.5.1. Key market trends, growth factors, and opportunities
7.5.2. Market size and forecast, by region
7.5.3. Market share analysis, by country
7.6. Others
7.6.1. Key market trends, growth factors, and opportunities
7.6.2. Market size and forecast, by region
7.6.3. Market share analysis, by country
Chapter: 8: GLOBAL POTTING COMPOUNDS MARKET, BY REGION
8.1. Overview
8.1.1. Market size and forecast
8.2. North America
8.2.1. Key market trends, growth factors, and opportunities
8.2.2. Market size and forecast, by resin type
8.2.3. Market size and forecast, by curing technique
8.2.4. Market size and forecast, by application
8.2.4.1. Market size and forecast, by electrical application
8.2.4.2. Market size and forecast, by electronics application
8.2.4.3. Market size and forecast, by electrical application
8.2.4.4. Market size and forecast, by electronics application
8.2.5. Market size and forecast, by end-user
8.2.6. Market share analysis, by country
8.2.7. U.S.
8.2.7.1. Market size and forecast, by resin type
8.2.7.2. Market size and forecast, by curing technique
8.2.7.3. Market size and forecast, by application
8.2.7.3.1. Market size and forecast, by electrical application
8.2.7.3.2. Market size and forecast, by electronics application
8.2.7.3.3. Market size and forecast, by electrical application
8.2.7.3.4. Market size and forecast, by electronics application
8.2.7.4. Market size and forecast, by end-user
8.2.8. Canada
8.2.8.1. Market size and forecast, by resin type
8.2.8.2. Market size and forecast, by curing technique
8.2.8.3. Market size and forecast, by application
8.2.8.3.1. Market size and forecast, by electrical application
8.2.8.3.2. Market size and forecast, by electronics application
8.2.8.3.3. Market size and forecast, by electrical application
8.2.8.3.4. Market size and forecast, by electronics application
8.2.8.4. Market size and forecast, by end-user
8.2.9. Mexico
8.2.9.1. Market size and forecast, by resin type
8.2.9.2. Market size and forecast, by curing technique
8.2.9.3. Market size and forecast, by application
8.2.9.3.1. Market size and forecast, by electrical application
8.2.9.3.2. Market size and forecast, by electronics application
8.2.9.3.3. Market size and forecast, by electrical application
8.2.9.3.4. Market size and forecast, by electronics application
8.2.9.4. Market size and forecast, by end-user
8.3. Europe
8.3.1. Key market trends, growth factors, and opportunities
8.3.2. Market size and forecast, by resin type
8.3.3. Market size and forecast, by curing technique
8.3.4. Market size and forecast, by application
8.3.4.1. Market size and forecast, by electrical application
8.3.4.2. Market size and forecast, by electronics application
8.3.4.3. Market size and forecast, by electrical application
8.3.4.4. Market size and forecast, by electronics application
8.3.5. Market size and forecast, by end-user
8.3.6. Market share analysis, by country
8.3.7. France
8.3.7.1. Market size and forecast, by resin type
8.3.7.2. Market size and forecast, by curing technique
8.3.7.3. Market size and forecast, by application
8.3.7.3.1. Market size and forecast, by electrical application
8.3.7.3.2. Market size and forecast, by electronics application
8.3.7.3.3. Market size and forecast, by electrical application
8.3.7.3.4. Market size and forecast, by electronics application
8.3.7.4. Market size and forecast, by end-user
8.3.8. Germany
8.3.8.1. Market size and forecast, by resin type
8.3.8.2. Market size and forecast, by curing technique
8.3.8.3. Market size and forecast, by application
8.3.8.3.1. Market size and forecast, by electrical application
8.3.8.3.2. Market size and forecast, by electronics application
8.3.8.3.3. Market size and forecast, by electrical application
8.3.8.3.4. Market size and forecast, by electronics application
8.3.8.4. Market size and forecast, by end-user
8.3.9. UK
8.3.9.1. Market size and forecast, by resin type
8.3.9.2. Market size and forecast, by curing technique
8.3.9.3. Market size and forecast, by application
8.3.9.3.1. Market size and forecast, by electrical application
8.3.9.3.2. Market size and forecast, by electronics application
8.3.9.3.3. Market size and forecast, by electrical application
8.3.9.3.4. Market size and forecast, by electronics application
8.3.9.4. Market size and forecast, by end-user
8.3.10. Spain
8.3.10.1. Market size and forecast, by resin type
8.3.10.2. Market size and forecast, by curing technique
8.3.10.3. Market size and forecast, by application
8.3.10.3.1. Market size and forecast, by electrical application
8.3.10.3.2. Market size and forecast, by electronics application
8.3.10.3.3. Market size and forecast, by electrical application
8.3.10.3.4. Market size and forecast, by electronics application
8.3.10.4. Market size and forecast, by end-user
8.3.11. Italy
8.3.11.1. Market size and forecast, by resin type
8.3.11.2. Market size and forecast, by curing technique
8.3.11.3. Market size and forecast, by application
8.3.11.3.1. Market size and forecast, by electrical application
8.3.11.3.2. Market size and forecast, by electronics application
8.3.11.3.3. Market size and forecast, by electrical application
8.3.11.3.4. Market size and forecast, by electronics application
8.3.11.4. Market size and forecast, by end-user
8.3.12. Rest of Europe
8.3.12.1. Market size and forecast, by resin type
8.3.12.2. Market size and forecast, by curing technique
8.3.12.3. Market size and forecast, by application
8.3.12.3.1. Market size and forecast, by electrical application
8.3.12.3.2. Market size and forecast, by electronics application
8.3.12.3.3. Market size and forecast, by electrical application
8.3.12.3.4. Market size and forecast, by electronics application
8.3.12.4. Market size and forecast, by end-user
8.4. Asia-Pacific
8.4.1. Key market trends, growth factors, and opportunities
8.4.2. Market size and forecast, by resin type
8.4.3. Market size and forecast, by curing technique
8.4.4. Market size and forecast, by application
8.4.4.1. Market size and forecast, by electrical application
8.4.4.2. Market size and forecast, by electronics application
8.4.4.3. Market size and forecast, by electrical application
8.4.4.4. Market size and forecast, by electronics application
8.4.5. Market size and forecast, by end-user
8.4.6. Market share analysis, by country
8.4.7. India
8.4.7.1. Market size and forecast, by resin type
8.4.7.2. Market size and forecast, by curing technique
8.4.7.3. Market size and forecast, by application
8.4.7.3.1. Market size and forecast, by electrical application
8.4.7.3.2. Market size and forecast, by electronics application
8.4.7.3.3. Market size and forecast, by electrical application
8.4.7.3.4. Market size and forecast, by electronics application
8.4.7.4. Market size and forecast, by end-user
8.4.8. China
8.4.8.1. Market size and forecast, by resin type
8.4.8.2. Market size and forecast, by curing technique
8.4.8.3. Market size and forecast, by application
8.4.8.3.1. Market size and forecast, by electrical application
8.4.8.3.2. Market size and forecast, by electronics application
8.4.8.3.3. Market size and forecast, by electrical application
8.4.8.3.4. Market size and forecast, by electronics application
8.4.8.4. Market size and forecast, by end-user
8.4.9. Japan
8.4.9.1. Market size and forecast, by resin type
8.4.9.2. Market size and forecast, by curing technique
8.4.9.3. Market size and forecast, by application
8.4.9.3.1. Market size and forecast, by electrical application
8.4.9.3.2. Market size and forecast, by electronics application
8.4.9.3.3. Market size and forecast, by electrical application
8.4.9.3.4. Market size and forecast, by electronics application
8.4.9.4. Market size and forecast, by end-user
8.4.10. South Korea
8.4.10.1. Market size and forecast, by resin type
8.4.10.2. Market size and forecast, by curing technique
8.4.10.3. Market size and forecast, by application
8.4.10.3.1. Market size and forecast, by electrical application
8.4.10.3.2. Market size and forecast, by electronics application
8.4.10.3.3. Market size and forecast, by electrical application
8.4.10.3.4. Market size and forecast, by electronics application
8.4.10.4. Market size and forecast, by end-user
8.4.11. Australia
8.4.11.1. Market size and forecast, by resin type
8.4.11.2. Market size and forecast, by curing technique
8.4.11.3. Market size and forecast, by application
8.4.11.3.1. Market size and forecast, by electrical application
8.4.11.3.2. Market size and forecast, by electronics application
8.4.11.3.3. Market size and forecast, by electrical application
8.4.11.3.4. Market size and forecast, by electronics application
8.4.11.4. Market size and forecast, by end-user
8.4.12. Rest of Asia-Pacific
8.4.12.1. Market size and forecast, by resin type
8.4.12.2. Market size and forecast, by curing technique
8.4.12.3. Market size and forecast, by application
8.4.12.3.1. Market size and forecast, by electrical application
8.4.12.3.2. Market size and forecast, by electronics application
8.4.12.3.3. Market size and forecast, by electrical application
8.4.12.3.4. Market size and forecast, by electronics application
8.4.12.4. Market size and forecast, by end-user
8.5. LAMEA
8.5.1. Key market trends, growth factors, and opportunities
8.5.2. Market size and forecast, by resin type
8.5.3. Market size and forecast, by curing technique
8.5.4. Market size and forecast, by application
8.5.4.1. Market size and forecast, by electrical application
8.5.4.2. Market size and forecast, by electronics application
8.5.4.3. Market size and forecast, by electrical application
8.5.4.4. Market size and forecast, by electronics application
8.5.5. Market size and forecast, by end-user
8.5.6. Market share analysis, by country
8.5.7. Brazil
8.5.7.1. Market size and forecast, by resin type
8.5.7.2. Market size and forecast, by curing technique
8.5.7.3. Market size and forecast, by application
8.5.7.3.1. Market size and forecast, by electrical application
8.5.7.3.2. Market size and forecast, by electronics application
8.5.7.3.3. Market size and forecast, by electrical application
8.5.7.3.4. Market size and forecast, by electronics application
8.5.7.4. Market size and forecast, by end-user
8.5.8. Saudi Arabia
8.5.8.1. Market size and forecast, by resin type
8.5.8.2. Market size and forecast, by curing technique
8.5.8.3. Market size and forecast, by application
8.5.8.3.1. Market size and forecast, by electrical application
8.5.8.3.2. Market size and forecast, by electronics application
8.5.8.3.3. Market size and forecast, by electrical application
8.5.8.3.4. Market size and forecast, by electronics application
8.5.8.4. Market size and forecast, by end-user
8.5.9. South Africa
8.5.9.1. Market size and forecast, by resin type
8.5.9.2. Market size and forecast, by curing technique
8.5.9.3. Market size and forecast, by application
8.5.9.3.1. Market size and forecast, by electrical application
8.5.9.3.2. Market size and forecast, by electronics application
8.5.9.3.3. Market size and forecast, by electrical application
8.5.9.3.4. Market size and forecast, by electronics application
8.5.9.4. Market size and forecast, by end-user
8.5.10. Rest of LAMEA
8.5.10.1. Market size and forecast, by resin type
8.5.10.2. Market size and forecast, by curing technique
8.5.10.3. Market size and forecast, by application
8.5.10.3.1. Market size and forecast, by electrical application
8.5.10.3.2. Market size and forecast, by electronics application
8.5.10.3.3. Market size and forecast, by electrical application
8.5.10.3.4. Market size and forecast, by electronics application
8.5.10.4. Market size and forecast, by end-user
Chapter: 9: COMPANY PROFILES
9.1. 3M
9.1.1. Company overview
9.1.2. Company snapshot
9.1.3. Operating business segments
9.1.4. Product portfolio
9.1.5. Business performance
9.2. Altana
9.2.1. Company overview
9.2.2. Company snapshot
9.2.3. Operating business segments
9.2.4. Product portfolio
9.2.5. Business performance
9.2.6. Key strategic moves and developments
9.3. Aremco Products Inc.
9.3.1. Company overview
9.3.2. Company snapshot
9.3.3. Operating business segments
9.3.4. Product portfolio
9.4. DowDuPont
9.4.1. Company overview
9.4.2. Company snapshot
9.4.3. Operating business segments
9.4.4. Product portfolio
9.4.5. Business performance
9.5. Dymax Corporation
9.5.1. Company overview
9.5.2. Company snapshot
9.5.3. Operating business segments
9.5.4. Product portfolio
9.6. Henkel AG & Co. KGaA
9.6.1. Company overview
9.6.2. Company snapshot
9.6.3. Operating business segments
9.6.4. Product portfolio
9.6.5. Business performance
9.6.6. Key strategic moves and developments
9.7. Hitachi Chemical Co., Ltd.
9.7.1. Company overview
9.7.2. Company snapshot
9.7.3. Operating business segments
9.7.4. Product portfolio
9.7.5. Business performance
9.8. Huntsman International LLC
9.8.1. Company overview
9.8.2. Company snapshot
9.8.3. Operating business segments
9.8.4. Product portfolio
9.8.5. Business performance
9.9. LORD Corporation
9.9.1. Company overview
9.9.2. Company snapshot
9.9.3. Product portfolio
9.10. Master Bond Inc.
9.10.1. Company overview
9.10.2. Company snapshot
9.10.3. Product portfolio
9.10.4. Key strategic moves and developments
9.11. MG Chemicals
9.11.1. Company overview
9.11.2. Company snapshot
9.11.3. Product portfolio
9.12. RBC Industries, Inc.
9.12.1. Company overview
9.12.2. Company snapshot
9.12.3. Operating business segments
9.12.4. Product portfolio
9.13. Shanghai SEPNA Chemical Technology Co., Ltd.
9.13.1. Company overview
9.13.2. Company snapshot
9.13.3. Operating business segments
9.13.4. Product portfolio
9.14. Wacker Chemie AG
9.14.1. Company overview
9.14.2. Company snapshot
9.14.3. Operating business segments
9.14.4. Product portfolio
9.14.5. Business performance
9.15. Wevo-Chemie GmbH
9.15.1. Company overview
9.15.2. Company snapshot
9.15.3. Product portfolio
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