Asia-Pacific Semiconductor Packaging and Assembly (P&A) Equipment Market : Insights and Forecast 2018-2025: Emphasis on Process Type (Plating, Inspection and Dicing, Wire Bonding, Die-Bonding, Others (Including Packaging)), Application (Consumer Electronics, Communication, Automotive, Industrial, Other) and Country
- UNI3007744
- 110 Pages
- March 2019
- Semiconductor and Electronics
“Owing to the increase in demand of advanced electronics due to growing electrification and automation of automobiles, automotive application segment is anticipated to show a remarkable CAGR during the forecast period”
The semiconductor packaging and assembly equipment market is segmented on the basis of process type and application areas. There are a number of packaging and assembly equipment processes adopted in the industry, such as plating, inspection and dicing, wire bonding, die-bonding, and others. The Die bonding held the major share in 2018. On the other hand, plating process is anticipated to be the fastest growing segment during the forecast period (2019-2025). On the basis of application, the market is bifurcated into consumer electronics, communication, automotive, industrial and others. In 2018, communications held the major share of the Asian semiconductor packaging and assembly equipment market. However, owing to the increase in demand of advanced electronics due to growing electrification and automation of automobiles, automotive application segment is anticipated to show a remarkable CAGR during the forecast period.
“The governmental funds and policies such as the National Fund and local Integrated Circuits (IC) funds, created in 2014, and the Made in China 2025 policy are some of the major reasons fuelling the demand within China”
Further, semiconductor packaging and assembly market report is bifurcated across several countries. This includes China, Japan, India, South Korea, Singapore, Taiwan and the rest of APAC. Taiwan dominated the market in 2018 and is expected to maintain its dominance while, China is expected to showcase a notable CAGR during the forecast period. The governmental funds and policies such as the National Fund and local Integrated Circuits (IC) funds, created in 2014, and the Made in China 2025 policy are some of the major reasons fuelling the demand within China.
Competitive Landscape-Top 10 Market Players
Some of the key players in the market include Amkor Technology Inc., Fujitsu Ltd., Toshiba Corporation, Qualcomm Incorporated, Renesas Electronics Corporation, Samsung Electronics, Jiangsu Changjiang Electronics Technology Co., Ltd., ChipMOS Technologies Inc., Powertech Technologies Inc., and ASE Group. These players are adopting several market strategies, such as merger & acquisition, business expansion and collaboration, among others to strengthen their foothold in the industry.
Reasons to buy this report:
• Historical and forecast market size validated through primary and secondary sources
• In depth analysis of prominent industry peers with primary focus on key business financials, product portfolio, expansion strategies, SWOT analysis and recent developments
• Examination on drivers, restraints, key trends and opportunities prevailing in the industry.
• Examination of industry attractiveness with the help of Porter’s Five Forces analysis
• Comprehensive coverage of the market across different market segments
• Deep dive country level analysis of the industry
Customization Options:
The Asia-Pacific semiconductor packaging and assembly market report can be customized, focusing a specific country or any other market segment. Besides this, UMI understands that you may have your own business need, please connect with our analyst, who will ensure you get a report that suits your needs
1.1 Market Definition 11
1.2 Objective of the Study 11
1.3 Limitation 11
1.4 Stakeholders 11
1.5 Currency used in the Report 12
2. RESEARCH METHODOLOGY OR ASSUMPTION 13
2.1 Research Methodology for Asia-Pacific Semiconductor P&A Equipment Market 13
2.1.1 Main objective of the Asia-Pacific Semiconductor P&A Equipment Market Study 14
3. INDUSTRY PERFORMANCE 15
4. EXECUTIVE SUMMARY 16
5. MARKET OVERVIEW 18
5.1 Introduction 18
5.2 Market Dynamics 19
5.2.1 Market Trend & Drivers 19
5.2.1.1 Increase in Sales of Smart Phones and Other Smart Consumer Electronic Devices 19
5.2.1.2 Improved Medical Applications and Equipment 20
5.2.1.3 Growing Scope in the Internet of Things 21
5.2.1.4 Increase in Vehicle Automation 23
5.2.2 Market Restraints 23
5.2.2.1 The requirement of High Investment 23
5.2.3 Market Opportunities 24
5.2.3.1 Rise in Use of 3D Packaging technology 24
5.2.3.2 Development of new Assembly Process 25
5.3 Key Market Indicators 26
5.3.1 Demand and Supply Side Analysis 26
5.3.1.1 Top Winning Strategies 26
5.3.1.1.1 Top Product launches 27
5.3.1.1.2 Business Expansions 28
5.3.1.1.3 Top Acquisition, Partnerships, Collaborations 28
5.3.2 Value Chain Analysis 29
6. MARKET INSIGHTS by PROCESS TYPE 31
6.1 General Overview 31
6.2 Plating 32
6.3 Inspection and Dicing 33
6.4 Wire Bonding 34
6.5 Die-Bonding 35
6.6 Others (Including Packaging) 36
7. MARKET INSIGHTS BY APPLICATION 37
7.1 General Overview 37
7.2 Consumer Electronics 38
7.3 Communication 39
7.4 Automotive 40
7.5 Industrial 41
7.6 Other Industry 42
8. MARKET INSIGHTS BY COUNTRY 43
8.1 General Overview 43
8.1.1 APAC Semiconductor P&A Equipment Market by Country, 2018-25 43
8.1.1.1 China Semiconductor P&A Equipment Market 44
8.1.1.1.1 Chinese Export Import data of Semiconductor Devices (2012-2018) 45
8.1.1.1.2 China Semiconductor P&A Equipment Market Size, 2018-25 45
8.1.1.2 Japan Semiconductor P&A Equipment Market 46
8.1.1.2.1 Production Value of Japanese Electronic Industry (2012-2017) 47
8.1.1.2.2 Japan Export Import data of Semiconductor Devices (2012-2018) 48
8.1.1.2.3 Japan Semiconductor P&A Equipment Market Size, 2018-25 48
8.1.1.3 India Semiconductor P&A Equipment Market 49
8.1.1.3.1 Key notable developments in Semiconductor & Electronic Sector 50
8.1.1.3.2 Key Government Initiative for Semiconductor & Electronic Sector 51
8.1.1.3.3 India Export Import data of Semiconductor Devices (2012-2018) 52
8.1.1.3.4 India Semiconductor P&A Equipment Market Size, 2018-25 52
8.1.1.4 Singapore Semiconductor P&A Equipment Market 53
8.1.1.4.1 Singapore Export Import data of Semiconductor Devices (2012-2018) 54
8.1.1.4.2 Singapore Semiconductors Market size and Local Production (2015-18) 54
8.1.1.4.3 Singapore Semiconductor P&A Equipment Market Size, 2018-25 55
8.1.1.5 South Korea Semiconductor P&A Equipment Market 56
8.1.1.5.1 South Korea Export Import data of Semiconductor Devices (2012-2018) 56
8.1.1.5.2 South Korea Semiconductor P&A Equipment Market Size, 2018-25 57
8.1.1.6 Taiwan Semiconductor P&A Equipment Market 58
8.1.1.6.1 Taiwan Semiconductor Equipment Market & Local Production (2015-18) 58
8.1.1.6.2 Taiwan Export Import data of Semiconductor Devices (2011-2017) 59
8.1.1.6.3 Taiwan Semiconductor P&A Equipment Market Size, 2018-25 59
8.1.1.7 Rest of APAC Semiconductor P&A Equipment Market 60
8.1.1.7.1 Malaysia Semiconductor Production, 2013-2017 (US$ billion) 61
8.1.1.7.2 Malaysia Export Import data of Semiconductor Devices (2012-2018) 61
8.1.1.7.3 Rest of APAC Semiconductor P&A Equipment Market Size, 2018-25 62
9. COMPETITIVE SCENARIO 64
9.1 Porter’s Five Forces Analysis 64
9.1.1 Bargaining power of Buyer 64
9.1.2 Bargaining power of Supplier 65
9.1.3 Threat of new entrants 65
9.1.4 Availability of Substitute 65
9.1.5 Industry Rivalry 65
9.2 APAC Semiconductor P&A Equipment Market Share Analysis, 2018 66
10. TOP COMPANY PROFILES 68
10.1 Amkor Technology Inc. 68
10.1.1 Key Facts 68
10.1.2 Business Description 68
10.1.3 Key Product/Services Offerings 69
10.1.4 SWOT Analysis 70
10.1.5 Key Financials 71
10.1.5.1 Revenue Split 71
10.1.6 Recent Developments 72
10.2 Fujitsu Ltd. 73
10.2.1 Key Facts 73
10.2.2 Business Description 73
10.2.3 Key Product/Services Offerings 74
10.2.4 SWOT Analysis 74
10.2.5 Key Financials 75
10.2.5.1 Revenue Split 75
10.2.6 Recent Developments 76
10.3 Toshiba Corporation 77
10.3.1 Key Facts 77
10.3.2 Business Description 77
10.3.3 Key Product/Services Offerings 78
10.3.4 SWOT Analysis 79
10.3.5 Key Financials 79
10.3.6 Revenue Split 80
10.3.7 Recent Developments 80
10.4 Qualcomm Incorporated 82
10.4.1 Key Facts 82
10.4.2 Business Description 82
10.4.3 Key Product/Services Offerings 83
10.4.4 SWOT Analysis 83
10.4.5 Key Financials 84
10.4.5.1 Revenue Split 84
10.4.6 Recent Developments 85
10.5 Renesas Electronics Corporation 86
10.5.1 Key Facts 86
10.5.2 Business Description 86
10.5.3 Key Product/Services Offerings 87
10.5.4 Growth Strategy 87
10.5.5 SWOT Analysis 88
10.5.6 Key Financials 88
10.5.6.1 Revenue Split 89
10.5.7 Recent Developments 89
10.6 Samsung Electronics Co. Ltd. 90
10.6.1 Key Facts 90
10.6.2 Business Description 90
10.6.3 Key Product/Services Offerings 91
10.6.4 SWOT Analysis 92
10.6.5 Key Financials 92
10.6.5.1 Revenue Split 93
10.6.6 Recent Developments 93
10.7 Jiangsu Changjiang Electronics Technology Co., Ltd. 94
10.7.1 Key Facts 94
10.7.2 Business Description 94
10.7.3 Key Product/Services Offerings 94
10.7.4 SWOT Analysis 95
10.7.5 Key Financials 95
10.7.5.1 Revenue Split 96
10.7.6 Recent developments 96
10.8 ChipMOS Technologies Inc. 97
10.8.1 Key Facts 97
10.8.2 Business Description 97
10.8.3 Key Product/Services Offerings 98
10.8.4 Growth Strategy 98
10.8.5 SWOT Analysis 98
10.8.6 Key Financials 99
10.8.6.1 Revenue Split 99
10.8.7 Recent developments 100
10.9 Powertech Technology Inc. 101
10.9.1 Key Facts 101
10.9.2 Business Description 101
10.9.3 Key Product/Services Offerings 102
10.9.4 Growth Strategy 102
10.9.5 SWOT Analysis 103
10.9.6 Key Financials 103
10.9.6.1 Revenue Split 104
10.9.7 Recent developments 104
10.10 ASE Group 105
10.10.1 Key Facts 105
10.10.2 Business Description 105
10.10.3 Key Product/Services Offerings 106
10.10.4 Growth Strategy 106
10.10.5 SWOT Analysis 107
10.10.6 Key Financials 107
10.10.6.1 Revenue Split 108
10.10.7 Recent developments 10
TABLE 2 APAC Inspection & Dicing Semiconductor Equipment Market by Country, (2018-25) (US$ million) 33
TABLE 3 APAC Wire Bonding Semiconductor Equipment Market by Country, (2018-25), (US$ million) 34
TABLE 4 APAC Die Bonding Semiconductor Equipment Market by Country, (2018-25), (US$ million) 35
TABLE 5 APAC Others Semiconductor Equipment Market by Country, (2018-25), (US$ million) 36
TABLE 6 APAC Consumer Electronics Semiconductor P&A Equipment Market by Country, (2018-25), (US$ million) 38
TABLE 7 APAC Communications Semiconductor P&A Equipment Market by Country, (2018-25), (US$ million) 39
TABLE 8 APAC Automotive Semiconductor P&A Equipment Market by Country, (2018-25), (US$ million) 40
TABLE 9 APAC Industrial Semiconductor P&A Equipment Market by Country, (2018-25), (US$ million) 41
TABLE 10 APAC Other Application Semiconductor P&A Equipment Market by Country, (2018-25), (US$ million) 42
TABLE 11 APAC Semiconductor P&A Equipment Market Size by Country 2018-25 (US$ million) 43
TABLE 12 China Semiconductor P&A Equipment Market Size by Process type (US$ million) 46
TABLE 13 China Semiconductor P&A Equipment Market Size by Application (US$ million) 46
TABLE 14 Japan Semiconductor P&A Equipment Market Size by Process type (US$ million) 49
TABLE 15 Japan Semiconductor P&A Equipment Market Size by Application (US$ million) 49
TABLE 16 India Semiconductor P&A Equipment Market Size by Process type (US$ million) 53
TABLE 17 India Semiconductor P&A Equipment Market Size by Application (US$ million) 53
TABLE 18 Singapore Semiconductor P&A Equipment Market Size by Process type (US$ million) 55
TABLE 19 Singapore Semiconductor P&A Equipment Market Size by Application (US$ million) 55
TABLE 20 South Korea Semiconductor P&A Equipment Market Size by Process type (US$ million) 57
TABLE 21 South Korea Semiconductor P&A Equipment Market Size by Application (US$ million) 57
TABLE 22 Taiwan Semiconductor P&A Equipment Market Size by Process type (US$ million) 59
TABLE 23 Taiwan Semiconductor P&A Equipment Market Size by Application (US$ million) 60
TABLE 24 Rest of APAC Semiconductor P&A Equipment Market Size by Process type (US$ million) 62
TABLE 25 Rest of APAC Semiconductor P&A Equipment Market Size by Application (US$ million) 62
TABLE 26 Amkor Technology Inc. Key Facts 68
TABLE 27 Product segmentation of Amkor Technology Inc. 69
TABLE 28 Amkor Technology Inc. Growth Strategy 70
TABLE 29 Amkor Technology Inc., Company Financials, (US$ million) 71
TABLE 30 Fujitsu Ltd. Key Facts 73
TABLE 31 Product segmentation of Fujitsu Ltd. 74
TABLE 32 Fujitsu Ltd. (US$ million) 75
TABLE 33 Toshiba Corporation Key Facts 77
TABLE 34 Product segmentation of Toshiba Corporation 78
TABLE 35 Toshiba Corporation Growth Strategy 78
TABLE 36 Toshiba Corporation, (US$ million) 79
TABLE 37 Qualcomm Incorporated Key Facts 82
TABLE 38 Product segmentation of Qualcomm Incorporated Key Facts 83
TABLE 39 Qualcomm Incorporated Growth Strategy 83
TABLE 40 Qualcomm Incorporated Company Financials, (US$ million) 84
TABLE 41 Renesas Electronics Corporation Key Facts 86
TABLE 42 Products segmentation of Renesas Electronics Corporation 87
TABLE 43 Renesas Electronics Corporation Growth Strategy 87
TABLE 44 Renesas Electronics Corporation Financials, (US$ million) 88
TABLE 45 Samsung Electronics Key Facts 90
TABLE 46 Product Segmentation of Samsung Electronics 91
TABLE 47 Samsung Electronics Growth Strategy 91
TABLE 48 Samsung Electronics Financials, (US$ million) 92
TABLE 49 Jiangsu Changjiang Electronics Technology Co. Ltd Key Facts 94
TABLE 50 Products segmentation of Jiangsu Changjiang Electronics Technology Co. Ltd 94
TABLE 51 Jiangsu Changjiang Electronics Technology Co. Ltd. Financials, (US$ million) 95
TABLE 52 ChipMOS Technologies Inc. key facts 97
TABLE 53 Products Segmentation of ChipMOS Technologies Inc. 98
TABLE 54 ChipMOS Technologies Inc. Growth Strategy 98
TABLE 55 ChipMOS Technologies Inc. financials, (US$ million) 99
TABLE 56 Powertech Technology Inc. key facts 101
TABLE 57 Products segmentation of Powertech Technology Inc. 102
TABLE 58 Powertech Technology Inc. Growth Strategy 102
TABLE 59 Powertech Technology Inc. Financials, (US$ million) 103
TABLE 60 ASE Group Key Facts 105
TABLE 61 Products segmentation of ASE Group 106
TABLE 62 ASE Group Growth Strategy 106
TABLE 63 ASE Group Financials, (US$ million) 107
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