Semiconductor and Electronics

Global IC Packaging Market Professional Survey Report 2018

  • QYR2636599
  • 103 Pages
  • July 2018
  • Semiconductor and Electronics
This report studies the global IC Packaging market status and forecast, categorizes the global IC Packaging market size (value & volume) by manufacturers, type, application, and region. This report focuses on the top manufacturers in North America, Europe, Japan, China, India, Southeast Asia and other regions (Central & South America, and Middle East & Africa).

IC packaging (a.k.a. IC assembly) is one of the essential processes and technologies in IC manufacture, connecting the bare die to the PCB. In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encased in a supporting case that prevents physical damage and corrosion.
This industry is affected by the economy and policy, so its important to put an eye to economic indexes and leaders prefer. With the global economic recovery, more and more people pay attention to rising environment standards, especially in underdevelopment regions that have a large population and fast economic growth, the need will increase.
The industry is a high-technology and high-profit industry, the research team maintain a very optimistic attitude. It is suggested that the new enterprises to enter the field.
We tend to believe this industry now is close to mature, and the consumption increasing degree will show a smooth curve. On product prices, the slow downward trend in recent years will maintain in the future, as competition intensifies, prices gap between different brands will go narrowing. Similarly, there will be fluctuation in gross margin.
The global IC Packaging market is valued at xx million US$ in 2017 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2018-2025.

The major manufacturers covered in this report
ASE
Amkor
SPIL
STATS ChipPac
Powertech Technology
J-devices
UTAC
JECT
ChipMOS
Chipbond

Geographically, this report studies the top producers and consumers, focuses on product capacity, production, value, consumption, market share and growth opportunity in these key regions, covering
North America
Europe
China
Japan
India
Southeast Asia
Other regions (Central & South America, Middle East & Africa)

We can also provide the customized separate regional or country-level reports, for the following regions:
North America
United States
Canada
Mexico
Asia-Pacific
China
India
Japan
South Korea
Australia
Indonesia
Singapore
Rest of Asia-Pacific
Europe
Germany
France
UK
Italy
Spain
Russia
Rest of Europe
Central & South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Saudi Arabia
Turkey
Rest of Middle East & Africa

On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into
DIP
SOP
QFP
QFN
BGA
CSP
LGA
WLP
FC
Others

By Application, the market can be split into
CIS
MEMS
Others

The study objectives of this report are:
To analyze and study the global IC Packaging capacity, production, value, consumption, status (2013-2017) and forecast (2018-2025);
Focuses on the key IC Packaging manufacturers, to study the capacity, production, value, market share and development plans in future.
Focuses on the global key manufacturers, to define, describe and analyze the market competition landscape, SWOT analysis.
To define, describe and forecast the market by type, application and region.
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends and factors driving or inhibiting the market growth.
To analyze the opportunities in the market for stakeholders by identifying the high growth segments.
To strategically analyze each submarket with respect to individual growth trend and their contribution to the market.
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
To strategically profile the key players and comprehensively analyze their growth strategies.

In this study, the years considered to estimate the market size of IC Packaging are as follows:
History Year: 2013-2017
Base Year: 2017
Estimated Year: 2018
Forecast Year 2018 to 2025

For the data information by region, company, type and application, 2017 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.

Key Stakeholders
IC Packaging Manufacturers
IC Packaging Distributors/Traders/Wholesalers
IC Packaging Subcomponent Manufacturers
Industry Association
Downstream Vendors

Available Customizations
With the given market data, QYResearch offers customizations according to the company's specific needs. The following customization options are available for the report:
Regional and country-level analysis of the IC Packaging market, by end-use.
Detailed analysis and profiles of additional market players.
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