Request for Covid-19 Impact Assessment of this Report

Semiconductor and Electronics

Global IC Packaging Market Professional Survey Report 2018

  • QYR2636599
  • 103 Pages
  • July 2018
  • Semiconductor and Electronics
Download Sample    Get Discount   
 
This report studies the global IC Packaging market status and forecast, categorizes the global IC Packaging market size (value & volume) by manufacturers, type, application, and region. This report focuses on the top manufacturers in North America, Europe, Japan, China, India, Southeast Asia and other regions (Central & South America, and Middle East & Africa).

IC packaging (a.k.a. IC assembly) is one of the essential processes and technologies in IC manufacture, connecting the bare die to the PCB. In electronics manufacturing, integrated circuit packaging is the final stage of semiconductor device fabrication, in which the tiny block of semiconducting material is encased in a supporting case that prevents physical damage and corrosion.

This industry is affected by the economy and policy, so it’s important to put an eye to economic indexes and leaders’ prefer. With the global economic recovery, more and more people pay attention to rising environment standards, especially in underdevelopment regions that have a large population and fast economic growth, the need will increase.

The industry is a high-technology and high-profit industry, the research team maintain a very optimistic attitude. It is suggested that the new enterprises to enter the field.

We tend to believe this industry now is close to mature, and the consumption increasing degree will show a smooth curve. On product prices, the slow downward trend in recent years will maintain in the future, as competition intensifies, prices gap between different brands will go narrowing. Similarly, there will be fluctuation in gross margin.

The global IC Packaging market is valued at xx million US$ in 2017 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2018-2025.

The major manufacturers covered in this report

ASE

Amkor

SPIL

STATS ChipPac

Powertech Technology

J-devices

UTAC

JECT

ChipMOS

Chipbond

Geographically, this report studies the top producers and consumers, focuses on product capacity, production, value, consumption, market share and growth opportunity in these key regions, covering

North America

Europe

China

Japan

India

Southeast Asia

Other regions (Central & South America, Middle East & Africa)

We can also provide the customized separate regional or country-level reports, for the following regions:

North America

United States

Canada

Mexico

Asia-Pacific

China

India

Japan

South Korea

Australia

Indonesia

Singapore

Rest of Asia-Pacific

Europe

Germany

France

UK

Italy

Spain

Russia

Rest of Europe

Central & South America

Brazil

Argentina

Rest of South America

Middle East & Africa

Saudi Arabia

Turkey

Rest of Middle East & Africa

On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into

DIP

SOP

QFP

QFN

BGA

CSP

LGA

WLP

FC

Others

By Application, the market can be split into

CIS

MEMS

Others

The study objectives of this report are:

To analyze and study the global IC Packaging capacity, production, value, consumption, status (2013-2017) and forecast (2018-2025);

Focuses on the key IC Packaging manufacturers, to study the capacity, production, value, market share and development plans in future.

Focuses on the global key manufacturers, to define, describe and analyze the market competition landscape, SWOT analysis.

To define, describe and forecast the market by type, application and region.

To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.

To identify significant trends and factors driving or inhibiting the market growth.

To analyze the opportunities in the market for stakeholders by identifying the high growth segments.

To strategically analyze each submarket with respect to individual growth trend and their contribution to the market.

To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.

To strategically profile the key players and comprehensively analyze their growth strategies.

In this study, the years considered to estimate the market size of IC Packaging are as follows:

History Year: 2013-2017

Base Year: 2017

Estimated Year: 2018

Forecast Year 2018 to 2025

For the data information by region, company, type and application, 2017 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.

Key Stakeholders

IC Packaging Manufacturers

IC Packaging Distributors/Traders/Wholesalers

IC Packaging Subcomponent Manufacturers

Industry Association

Downstream Vendors

Available Customizations

With the given market data, QYResearch offers customizations according to the company's specific needs. The following customization options are available for the report:

Regional and country-level analysis of the IC Packaging market, by end-use.

Detailed analysis and profiles of additional market players.

Table of Contents

Global IC Packaging Market Professional Survey Report 2018

1 Industry Overview of IC Packaging

1.1 Definition and Specifications of IC Packaging

1.1.1 Definition of IC Packaging

1.1.2 Specifications of IC Packaging

1.2 Classification of IC Packaging

1.2.1 DIP

1.2.2 SOP

1.2.3 QFP

1.2.4 QFN

1.2.5 BGA

1.2.6 CSP

1.2.7 LGA

1.2.8 WLP

1.2.9 FC

1.2.10 Others

1.3 Applications of IC Packaging

1.3.1 CIS

1.3.2 MEMS

1.3.3 Others

1.4 Market Segment by Regions

1.4.1 North America

1.4.2 Europe

1.4.3 China

1.4.4 Japan

1.4.5 Southeast Asia

1.4.6 India

2 Manufacturing Cost Structure Analysis of IC Packaging

2.1 Raw Material and Suppliers

2.2 Manufacturing Cost Structure Analysis of IC Packaging

2.3 Manufacturing Process Analysis of IC Packaging

2.4 Industry Chain Structure of IC Packaging

3 Technical Data and Manufacturing Plants Analysis of IC Packaging

3.1 Capacity and Commercial Production Date of Global IC Packaging Major Manufacturers in 2017

3.2 Manufacturing Plants Distribution of Global IC Packaging Major Manufacturers in 2017

3.3 R&D Status and Technology Source of Global IC Packaging Major Manufacturers in 2017

3.4 Raw Materials Sources Analysis of Global IC Packaging Major Manufacturers in 2017

4 Global IC Packaging Overall Market Overview

4.1 2013-2018E Overall Market Analysis

4.2 Capacity Analysis

4.2.1 2013-2018E Global IC Packaging Capacity and Growth Rate Analysis

4.2.2 2017 IC Packaging Capacity Analysis (Company Segment)

4.3 Sales Analysis

4.3.1 2013-2018E Global IC Packaging Sales and Growth Rate Analysis

4.3.2 2017 IC Packaging Sales Analysis (Company Segment)

4.4 Sales Price Analysis

4.4.1 2013-2018E Global IC Packaging Sales Price

4.4.2 2017 IC Packaging Sales Price Analysis (Company Segment)

5 IC Packaging Regional Market Analysis

5.1 North America IC Packaging Market Analysis

5.1.1 North America IC Packaging Market Overview

5.1.2 North America 2013-2018E IC Packaging Local Supply, Import, Export, Local Consumption Analysis

5.1.3 North America 2013-2018E IC Packaging Sales Price Analysis

5.1.4 North America 2017 IC Packaging Market Share Analysis

5.2 Europe IC Packaging Market Analysis

5.2.1 Europe IC Packaging Market Overview

5.2.2 Europe 2013-2018E IC Packaging Local Supply, Import, Export, Local Consumption Analysis

5.2.3 Europe 2013-2018E IC Packaging Sales Price Analysis

5.2.4 Europe 2017 IC Packaging Market Share Analysis

5.3 China IC Packaging Market Analysis

5.3.1 China IC Packaging Market Overview

5.3.2 China 2013-2018E IC Packaging Local Supply, Import, Export, Local Consumption Analysis

5.3.3 China 2013-2018E IC Packaging Sales Price Analysis

5.3.4 China 2017 IC Packaging Market Share Analysis

5.4 Japan IC Packaging Market Analysis

5.4.1 Japan IC Packaging Market Overview

5.4.2 Japan 2013-2018E IC Packaging Local Supply, Import, Export, Local Consumption Analysis

5.4.3 Japan 2013-2018E IC Packaging Sales Price Analysis

5.4.4 Japan 2017 IC Packaging Market Share Analysis

5.5 Southeast Asia IC Packaging Market Analysis

5.5.1 Southeast Asia IC Packaging Market Overview

5.5.2 Southeast Asia 2013-2018E IC Packaging Local Supply, Import, Export, Local Consumption Analysis

5.5.3 Southeast Asia 2013-2018E IC Packaging Sales Price Analysis

5.5.4 Southeast Asia 2017 IC Packaging Market Share Analysis

5.6 India IC Packaging Market Analysis

5.6.1 India IC Packaging Market Overview

5.6.2 India 2013-2018E IC Packaging Local Supply, Import, Export, Local Consumption Analysis

5.6.3 India 2013-2018E IC Packaging Sales Price Analysis

5.6.4 India 2017 IC Packaging Market Share Analysis

6 Global 2013-2018E IC Packaging Segment Market Analysis (by Type)

6.1 Global 2013-2018E IC Packaging Sales by Type

6.2 Different Types of IC Packaging Product Interview Price Analysis

6.3 Different Types of IC Packaging Product Driving Factors Analysis

6.3.1 DIP Growth Driving Factor Analysis

6.3.2 SOP Growth Driving Factor Analysis

6.3.3 QFP Growth Driving Factor Analysis

6.3.4 QFN Growth Driving Factor Analysis

6.3.5 BGA Growth Driving Factor Analysis

6.3.6 CSP Growth Driving Factor Analysis

6.3.7 LGA Growth Driving Factor Analysis

6.3.8 WLP Growth Driving Factor Analysis

6.3.9 FC Growth Driving Factor Analysis

6.3.10 Others Growth Driving Factor Analysis

7 Global 2013-2018E IC Packaging Segment Market Analysis (by Application)

7.1 Global 2013-2018E IC Packaging Consumption by Application

7.2 Different Application of IC Packaging Product Interview Price Analysis

7.3 Different Application of IC Packaging Product Driving Factors Analysis

7.3.1 CIS of IC Packaging Growth Driving Factor Analysis

7.3.2 MEMS of IC Packaging Growth Driving Factor Analysis

7.3.3 Others of IC Packaging Growth Driving Factor Analysis

8 Major Manufacturers Analysis of IC Packaging

8.1 ASE

8.1.1 Company Profile

8.1.2 Product Picture and Specifications

8.1.2.1 Product A

8.1.2.2 Product B

8.1.3 ASE 2017 IC Packaging Sales, Ex-factory Price, Revenue, Gross Margin Analysis

8.1.4 ASE 2017 IC Packaging Business Region Distribution Analysis

8.2 Amkor

8.2.1 Company Profile

8.2.2 Product Picture and Specifications

8.2.2.1 Product A

8.2.2.2 Product B

8.2.3 Amkor 2017 IC Packaging Sales, Ex-factory Price, Revenue, Gross Margin Analysis

8.2.4 Amkor 2017 IC Packaging Business Region Distribution Analysis

8.3 SPIL

8.3.1 Company Profile

8.3.2 Product Picture and Specifications

8.3.2.1 Product A

8.3.2.2 Product B

8.3.3 SPIL 2017 IC Packaging Sales, Ex-factory Price, Revenue, Gross Margin Analysis

8.3.4 SPIL 2017 IC Packaging Business Region Distribution Analysis

8.4 STATS ChipPac

8.4.1 Company Profile

8.4.2 Product Picture and Specifications

8.4.2.1 Product A

8.4.2.2 Product B

8.4.3 STATS ChipPac 2017 IC Packaging Sales, Ex-factory Price, Revenue, Gross Margin Analysis

8.4.4 STATS ChipPac 2017 IC Packaging Business Region Distribution Analysis

8.5 Powertech Technology

8.5.1 Company Profile

8.5.2 Product Picture and Specifications

8.5.2.1 Product A

8.5.2.2 Product B

8.5.3 Powertech Technology 2017 IC Packaging Sales, Ex-factory Price, Revenue, Gross Margin Analysis

8.5.4 Powertech Technology 2017 IC Packaging Business Region Distribution Analysis

8.6 J-devices

8.6.1 Company Profile

8.6.2 Product Picture and Specifications

8.6.2.1 Product A

8.6.2.2 Product B

8.6.3 J-devices 2017 IC Packaging Sales, Ex-factory Price, Revenue, Gross Margin Analysis

8.6.4 J-devices 2017 IC Packaging Business Region Distribution Analysis

8.7 UTAC

8.7.1 Company Profile

8.7.2 Product Picture and Specifications

8.7.2.1 Product A

8.7.2.2 Product B

8.7.3 UTAC 2017 IC Packaging Sales, Ex-factory Price, Revenue, Gross Margin Analysis

8.7.4 UTAC 2017 IC Packaging Business Region Distribution Analysis

8.8 JECT

8.8.1 Company Profile

8.8.2 Product Picture and Specifications

8.8.2.1 Product A

8.8.2.2 Product B

8.8.3 JECT 2017 IC Packaging Sales, Ex-factory Price, Revenue, Gross Margin Analysis

8.8.4 JECT 2017 IC Packaging Business Region Distribution Analysis

8.9 ChipMOS

8.9.1 Company Profile

8.9.2 Product Picture and Specifications

8.9.2.1 Product A

8.9.2.2 Product B

8.9.3 ChipMOS 2017 IC Packaging Sales, Ex-factory Price, Revenue, Gross Margin Analysis

8.9.4 ChipMOS 2017 IC Packaging Business Region Distribution Analysis

8.10 Chipbond

8.10.1 Company Profile

8.10.2 Product Picture and Specifications

8.10.2.1 Product A

8.10.2.2 Product B

8.10.3 Chipbond 2017 IC Packaging Sales, Ex-factory Price, Revenue, Gross Margin Analysis

8.10.4 Chipbond 2017 IC Packaging Business Region Distribution Analysis

9 Development Trend of Analysis of IC Packaging Market

9.1 Global IC Packaging Market Trend Analysis

9.1.1 Global 2018-2025 IC Packaging Market Size (Volume and Value) Forecast

9.1.2 Global 2018-2025 IC Packaging Sales Price Forecast

9.2 IC Packaging Regional Market Trend

9.2.1 North America 2018-2025 IC Packaging Consumption Forecast

9.2.2 Europe 2018-2025 IC Packaging Consumption Forecast

9.2.3 China 2018-2025 IC Packaging Consumption Forecast

9.2.4 Japan 2018-2025 IC Packaging Consumption Forecast

9.2.5 Southeast Asia 2018-2025 IC Packaging Consumption Forecast

9.2.6 India 2018-2025 IC Packaging Consumption Forecast

9.3 IC Packaging Market Trend (Product Type)

9.4 IC Packaging Market Trend (Application)

10 IC Packaging Marketing Type Analysis

10.1 IC Packaging Regional Marketing Type Analysis

10.2 IC Packaging International Trade Type Analysis

10.3 Traders or Distributors with Contact Information of IC Packaging by Region

10.4 IC Packaging Supply Chain Analysis

11 Consumers Analysis of IC Packaging

11.1 Consumer 1 Analysis

11.2 Consumer 2 Analysis

11.3 Consumer 3 Analysis

11.4 Consumer 4 Analysis

12 Conclusion of the Global IC Packaging Market Professional Survey Report 2017

Methodology

Analyst Introduction

Data Source

List of Tables and Figures

Figure Picture of IC Packaging

Table Product Specifications of IC Packaging

Table Classification of IC Packaging

Figure Global Production Market Share of IC Packaging by Type in 2017

Figure DIP Picture

Table Major Manufacturers of DIP

Figure SOP Picture

Table Major Manufacturers of SOP

Figure QFP Picture

Table Major Manufacturers of QFP

Figure QFN Picture

Table Major Manufacturers of QFN

Figure BGA Picture

Table Major Manufacturers of BGA

Figure CSP Picture

Table Major Manufacturers of CSP

Figure LGA Picture

Table Major Manufacturers of LGA

Figure WLP Picture

Table Major Manufacturers of WLP

Figure FC Picture

Table Major Manufacturers of FC

Figure Others Picture

Table Major Manufacturers of Others

Table Applications of IC Packaging

Figure Global Consumption Volume Market Share of IC Packaging by Application in 2017

Figure CIS Examples

Table Major Consumers in CIS

Figure MEMS Examples

Table Major Consumers in MEMS

Figure Others Examples

Table Major Consumers in Others

Figure Market Share of IC Packaging by Regions

Figure North America IC Packaging Market Size (Million USD) (2013-2025)

Figure Europe IC Packaging Market Size (Million USD) (2013-2025)

Figure China IC Packaging Market Size (Million USD) (2013-2025)

Figure Japan IC Packaging Market Size (Million USD) (2013-2025)

Figure Southeast Asia IC Packaging Market Size (Million USD) (2013-2025)

Figure India IC Packaging Market Size (Million USD) (2013-2025)

Table IC Packaging Raw Material and Suppliers

Table Manufacturing Cost Structure Analysis of IC Packaging in 2017

Figure Manufacturing Process Analysis of IC Packaging

Figure Industry Chain Structure of IC Packaging

Table Capacity and Commercial Production Date of Global IC Packaging Major Manufacturers in 2017

Table Manufacturing Plants Distribution of Global IC Packaging Major Manufacturers in 2017

Table R&D Status and Technology Source of Global IC Packaging Major Manufacturers in 2017

Table Raw Materials Sources Analysis of Global IC Packaging Major Manufacturers in 2017

Table Global Capacity, Sales , Price, Cost, Sales Revenue (M USD) and Gross Margin of IC Packaging 2013-2018E

Figure Global 2013-2018E IC Packaging Market Size (Volume) and Growth Rate

Figure Global 2013-2018E IC Packaging Market Size (Value) and Growth Rate

Table 2013-2018E Global IC Packaging Capacity and Growth Rate

Table 2017 Global IC Packaging Capacity (K Pcs) List (Company Segment)

Table 2013-2018E Global IC Packaging Sales (K Pcs) and Growth Rate

Table 2017 Global IC Packaging Sales (K Pcs) List (Company Segment)

Table 2013-2018E Global IC Packaging Sales Price (USD/Pcs)

Table 2017 Global IC Packaging Sales Price (USD/Pcs) List (Company Segment)

Figure North America Capacity Overview

Table North America Supply, Import, Export and Consumption (K Pcs) of IC Packaging 2013-2018E

Figure North America 2013-2018E IC Packaging Sales Price (USD/Pcs)

Figure North America 2017 IC Packaging Sales Market Share

Figure Europe Capacity Overview

Table Europe Supply, Import, Export and Consumption (K Pcs) of IC Packaging 2013-2018E

Figure Europe 2013-2018E IC Packaging Sales Price (USD/Pcs)

Figure Europe 2017 IC Packaging Sales Market Share

Figure China Capacity Overview

Table China Supply, Import, Export and Consumption (K Pcs) of IC Packaging 2013-2018E

Figure China 2013-2018E IC Packaging Sales Price (USD/Pcs)

Figure China 2017 IC Packaging Sales Market Share

Figure Japan Capacity Overview

Table Japan Supply, Import, Export and Consumption (K Pcs) of IC Packaging 2013-2018E

Figure Japan 2013-2018E IC Packaging Sales Price (USD/Pcs)

Figure Japan 2017 IC Packaging Sales Market Share

Figure Southeast Asia Capacity Overview

Table Southeast Asia Supply, Import, Export and Consumption (K Pcs) of IC Packaging 2013-2018E

Figure Southeast Asia 2013-2018E IC Packaging Sales Price (USD/Pcs)

Figure Southeast Asia 2017 IC Packaging Sales Market Share

Figure India Capacity Overview

Table India Supply, Import, Export and Consumption (K Pcs) of IC Packaging 2013-2018E

Figure India 2013-2018E IC Packaging Sales Price (USD/Pcs)

Figure India 2017 IC Packaging Sales Market Share

Table Global 2013-2018E IC Packaging Sales (K Pcs) by Type

Table Different Types IC Packaging Product Interview Price

Table Global 2013-2018E IC Packaging Sales (K Pcs) by Application

Table Different Application IC Packaging Product Interview Price

Table ASE Information List

Table Product Overview

Table 2017 ASE IC Packaging Revenue (Million USD), Sales (K Pcs), Ex-factory Price (USD/Pcs)

Figure 2017 ASE IC Packaging Business Region Distribution

Table Amkor Information List

Table Product Overview

Table 2017 Amkor IC Packaging Revenue (Million USD), Sales (K Pcs), Ex-factory Price (USD/Pcs)

Figure 2017 Amkor IC Packaging Business Region Distribution

Table SPIL Information List

Table Product Overview

Table 2017 SPIL IC Packaging Revenue (Million USD), Sales (K Pcs), Ex-factory Price (USD/Pcs)

Figure 2017 SPIL IC Packaging Business Region Distribution

Table STATS ChipPac Information List

Table Product Overview

Table 2017 STATS ChipPac IC Packaging Revenue (Million USD), Sales (K Pcs), Ex-factory Price (USD/Pcs)

Figure 2017 STATS ChipPac IC Packaging Business Region Distribution

Table Powertech Technology Information List

Table Product Overview

Table 2017 Powertech Technology IC Packaging Revenue (Million USD), Sales (K Pcs), Ex-factory Price (USD/Pcs)

Figure 2017 Powertech Technology IC Packaging Business Region Distribution

Table J-devices Information List

Table Product Overview

Table 2017 J-devices IC Packaging Revenue (Million USD), Sales (K Pcs), Ex-factory Price (USD/Pcs)

Figure 2017 J-devices IC Packaging Business Region Distribution

Table UTAC Information List

Table Product Overview

Table 2017 UTAC IC Packaging Revenue (Million USD), Sales (K Pcs), Ex-factory Price (USD/Pcs)

Figure 2017 UTAC IC Packaging Business Region Distribution

Table JECT Information List

Table Product Overview

Table 2017 JECT IC Packaging Revenue (Million USD), Sales (K Pcs), Ex-factory Price (USD/Pcs)

Figure 2017 JECT IC Packaging Business Region Distribution

Table ChipMOS Information List

Table Product Overview

Table 2017 ChipMOS IC Packaging Revenue (Million USD), Sales (K Pcs), Ex-factory Price (USD/Pcs)

Figure 2017 ChipMOS IC Packaging Business Region Distribution

Table Chipbond Information List

Table Product Overview

Table 2017 Chipbond IC Packaging Revenue (Million USD), Sales (K Pcs), Ex-factory Price (USD/Pcs)

Figure 2017 Chipbond IC Packaging Business Region Distribution

Figure Global 2018-2025 IC Packaging Market Size (K Pcs) and Growth Rate Forecast

Figure Global 2018-2025 IC Packaging Market Size (Million USD) and Growth Rate Forecast

Figure Global 2018-2025 IC Packaging Sales Price (USD/Pcs) Forecast

Figure North America 2018-2025 IC Packaging Consumption Volume (K Pcs) and Growth Rate Forecast

Figure China 2018-2025 IC Packaging Consumption Volume (K Pcs) and Growth Rate Forecast

Figure Europe 2018-2025 IC Packaging Consumption Volume (K Pcs) and Growth Rate Forecast

Figure Southeast Asia 2018-2025 IC Packaging Consumption Volume (K Pcs) and Growth Rate Forecast

Figure Japan 2018-2025 IC Packaging Consumption Volume (K Pcs) and Growth Rate Forecast

Figure India 2018-2025 IC Packaging Consumption Volume (K Pcs) and Growth Rate Forecast

Table Global Sales Volume (K Pcs) of IC Packaging by Type 2018-2025

Table Global Consumption Volume (K Pcs) of IC Packaging by Application 2018-2025

Table Traders or Distributors with Contact Information of IC Packaging by Region

 
Purchase Options

* Taxes/Fees, If applicable will be
added during checkout. All prices in USD.

Need More Information

Contact Us

+ 1-888-961-4454

Drop Us an email at

help@bigmarketresearch.com

Similar Reports

Insulated-gate Bipolar Transistors (IGBTs) Market: by Type (Discrete IGBT and IGBT Module), Power rating (High Power, Medium Power, and Low Power) and Application (Energy & Power, Consumer Electronics, Inverter & UPS, Electric Vehicle, Industrial System, and Others) - Global Opportunity Analysis and Industry Forecast, 2014-2022

Insulated-Gate Bipolar Transistor (IGBT) is a three-terminal electronic switching device, which is a combination of Metal–Oxide–Semiconductor Field-Effect Transistor (MOSFET) and Bipolar Junction Transistor (BJT) in monolithic form. It allows the f...

  • Publish Date: October 1, 2016
  • $5370
Power Transformer Market by Rating (Low, Medium and High) - Global Opportunity Analysis and Industry Forecast, 2014-2022

Global power transformer market is expected to grow at a CAGR of 7.07% from 2016 to 2022 to reach $37,353 million by 2022 from $23,019 million in 2015. Power transformers are static transmission machine, which wrap a coil around an electromagnet to transfer el...

  • Publish Date: December 15, 2016
  • $5370
3D Printing Materials Market by Type (Polymers, Metals, Ceramic, and Others), by Form (Powder, Filament, and Liquid), and by End user (Consumer products, Industrial, Aerospace & Defense, Automotive, Healthcare, Education & Research, Personal/prosumer, and Others) - World Opportunity Analysis and Industry Forecast, 2014 - 2022

3D printing is a machine-based process in which three-dimensional solid objects are made via a computer containing blueprints or digital files of the object. This is a revolutionary method that utilizes inkjet technology to save time and money by eliminating t...

  • Publish Date: October 1, 2016
  • $5370