Semiconductor and Electronics

Asia-Pacific Image Sensors Market by Technology (CMOS Image Sensor and CCD Image Sensor) and Application (Consumer Electronics, Defense & Aerospace, Medical, Industrial, Automotive, and Security & Surveillance) - Opportunity Analysis and Industry Forecasts, 2014-2022

  • ALL792278
  • 134 Pages
  • November 2016
  • Semiconductor and Electronics

Image sensor is used in devices such as digital cameras & varied camera modules that converts the optical image projected by the lens into electrical signals. CMOS is the latest technology that designs advanced image sensors. At first, photon flux is converted into charge, which is further converted to voltage, conversion then analog to digital conversion. This technology uses two types of mechanisms to design image sensors, namely, front-side illuminated (FSI) and back-side illuminated (BSI) techniques. As per FSI technique, in-chip lens is placed at the front and photodiode at back. Moreover, when light enters through lens, it reaches the metal wiring, which reflects a part of light and the remaining light reaches the photodiode. Hence, photodiode receive less incoming light and produces low-resolution image. In BSI technique, metal wire grid is placed below the photodiode, allowing the complete incoming light reach the photodiode without any obstruction, which results into the conversion of photons to electrons.

Increase in proliferation of smartphones, rise in investment in automotive sector by automotive companies and growth in demand for security & surveillance in public places drive the growth of Asia-Pacific image sensors market. The leading automotive companies are investing heavily to increase the comfort and safety levels of driver by implementing the advanced technology through association with technological companies. Japan-based car manufactures such as Toyota Motor Corporation and Nissan Motor Company Ltd are implementing the advanced driver assistance systems (ADAS), which offer parking assistance, collision avoidance systems, automatic headlight dimming, and lane departure warning. Decline in adoption of CCD image sensor and high manufacturing cost of image sensors are the factors that restrain the market growth. However, government rule on implementation of driver assistance system on vehicles is expected to provide opportunities for the key market players.

The market is segmented on the basis of technology, application, and country. Based on technology, the market is bifurcated into charge-coupled device (CCD) and complementary metal‐oxide‐semiconductor (CMOS). CMOS is the leading segment, which is further divided into front-side illuminated (FSI) and back-side illuminated (BSI). By application, the market is segmented into consumer electronics, defense & aerospace, medical, industrial, automotive, and security & surveillance. The countries analyzed in the report include China, Japan, India, Taiwan, South Korea, and rest of Asia-Pacific.


  • The report includes an extensive analysis of the factors that drive as well as restrain the Asia-Pacific image sensors market.
  • The market projections from 2014 to 2022 are included along with factors affecting the same.
  • The report also provides quantitative as well as qualitative trends to assist the stakeholders understand the situations prevailing in the market.
  • Competitive intelligence highlights the business practices followed by leading market players across various geographies.



  • CMOS Image Sensor
  • FSI
  • BSI
  • CCD Image Sensor


  • Consumer Electronics
  • Defense & Aerospace
  • Medical
  • Industrial
  • Automotive
  • Security & Surveillance


  • China
  • Japan
  • India
  • Taiwan
  • South Korea
  • Rest of Asia-Pacific


  • Sony Corporation
  • Samsung Electronics Co. Ltd.
  • Himax Technologies, Inc.
  • OmniVision Technologies, Inc.
  • GalaxyCore Shanghai Corporation Ltd.
  • ON Semiconductor Corporation
  • SK Hynix, Inc.
  • Toshiba Corporation
  • Panasonic Corporation
  • SuperPix Micro Technology Co., Ltd.

Other players in the value chain include (profiles not included in the report)

  • Canon Inc.
  • Nikon Corporation
  • Semiconductor Manufacturing International Corporation (SMIC)
  • Taiwan Semiconductor Manufacturing Company (TSMC)
  • Sharp Corporation
Please Select Format

Enquiry About Report

Need More Information

Contact us
+ 1-800-910-6452
+91 20 66346066
--- or ---



Optical Network Components Market Global Scenario, Market Size, Outlook, Trend and Forecast, 2015-2024

Optical network components referred to the devices which are used to communicate among different telecommunications network. These devices use light signal to transmit the information which is to be send ...

April 2018| $4995 | Pre Book Price:$4371

Nanophotonics Market Global Scenario, Market Size, Outlook, Trend and Forecast, 2015-2024

Nanophotonics are the combination of nanotechnology, photonics and optoelectronics which has impacted a wide range of fields such as health care, information technology and others. It has revolutionized the semiconductor ...

April 2018| $4995 | Pre Book Price:$4371

Portable Medical Electronic Equipment Market Global Scenario, Market Size, Outlook, Trend and Forecast, 2015-2024

Portable medical electronic equipment is designed to aid in the diagnosis, monitoring or treatment of medical conditions with display of data on mobile computing device such as a smart phone ...

April 2018| $4995 | Pre Book Price:$4371

Insulated Gate Bipolar Transistor (IGBT) Market Global Scenario, Market Size, Outlook, Trend and Forecast, 2015-2024

The Insulated Gate Bipolar Transistor (IGBT) is an electronic semiconductor device with large bipolar current-carrying competence and high input impedance. IGBT is useful in reducing the power supply congestion which ...

April 2018| $4995 | Pre Book Price:$4371

Head-Up-Display Market Global Scenario, Market Size, Outlook, Trend and Forecast, 2015-2024

A head-up display or HUD is any transparent display that shows data without need of users to look away from their usual angle. A HUD has the benefit that the ...

April 2018| $4995 | Pre Book Price:$4371

System in Package Market Global Scenario, Market Size, Outlook, Trend and Forecast, 2015- 2024

System in package (SiP) is a module where numbers of integrated circuits are enclosed. It is typically used inside a mobile phone, digital music player, etc. to perform several functions ...

April 2018| $4995 | Pre Book Price:$4371

2018 © Copyright Big Market Research

View Pricing >>