Packaging Market For Compound Semiconductor By Packaging Platform (Flip Chip, Embedded Die, Fan-In WLP, and Fan-Out WLP), Application (CS Power Electronics, CS RF/Microwave, CS Photonics, CS Sensing, and CS Quantum), and End User (Digital Economy, Industrial and Energy & Power, Defense/Security, Transport, Consumer Electronics, Healthcare, and Space): Global Opportunity Analysis and Industry Forecast, 2020–2027
- ALL4079376
- 205 Pages
- September 2020
- Semiconductor and Electronics
The wafer process differs according to material properties. Moreover, some CS devices contain fragile air bridges, gold bond pads, topographical cavities & trenches, and have a number of unique bulk material properties which are sensitive to the mechanical and chemical processes associated with standard packaging technique.
Thus, the standard electronics packaging and interconnection technologies have become the limiting factor determining the performance and efficiency of the new semiconductor components. Whereas, the advanced packaging technology provides several advantages such as prevention from physical damage, maximize operational efficiency, and reduces overall cost.
In addition, in consumer electronics and industrial products advance packaging relies on mechanical engineering principles such as dynamics, stress analysis, heat transfer, and fluid mechanics and protects components from mechanical damage, cooling, RF noise emission, and electrostatic discharge. Thus, in order to improve the performance, reliability, and cost-effectiveness of electronics systems, an advanced packaging technology is being used for packaging of compound semiconductors.
Factors such as increase in demand for miniaturization of devices, improved system performance and optimization of compound semiconductor packaging, and emerging trends toward compound semiconductor wafers in the automotive industry are major factors driving the market growth to a certain extent.
However, high cost of compound semiconductor packaging is hampering its adoption is expected to pose a major threat to the compound semiconductor packaging market globally. However, emerging usage of compound semiconductors in smart technologies and emerging trends of fan-out wafer level packaging is expected to provide lucrative opportunities to the market growth globally.
The global packaging market for compound semiconductor is segmented into packaging platform, application, end user, and region. Based on packaging platform, the market is divided into flip-chip, embedded die, fan-in WLP, and fan-out WLP. On the basis of application, the packaging market for compound semiconductor is analyzed across CS power electronics, CS RF/Microwave, CS Photonics, CS Sensing, and CS Quantum.
By end user, the market is studies across digital economy, industrial and energy & power, defense/security, transport, consumer electronics, healthcare, and space. By region, the packaging market for compound semiconductor trends are analyzed across the U.S., the UK, China, and rest of the world.
The key players operating in the market includes Amkor Technology, Taiwan Semiconductor Manufacturing Company, Texas Instruments, Jiangsu Changjiang Electronics Tech Co., ASE Technology, KLA Corporation, Qorvo, Tokyo Electron Limited, Deca Technologies Inc., and Fujitsu Limited. These key players have adopted various strategies, such as product portfolio expansion, mergers & acquisitions, agreements, geographical expansion, and collaborations, to increase their market penetration and strengthen their foothold in the industry.
Key Benefits For Stakeholders
• This study comprises analytical depiction of the global packaging market size for compound semiconductor along with the current trends and future estimations to depict the imminent investment pockets.
• The overall packaging market analysis for compound semiconductor is determined to understand the profitable trends to gain a stronger foothold.
• The report presents information related to key drivers, restraints, and opportunities with a detailed impact analysis.
• The current packaging market forecast for compound semiconductor is quantitatively analyzed from 2019 to 2027 to benchmark the financial competency.
• Porter’s five forces analysis illustrates the potency of the buyers and the packaging market share for compound semiconductor of key vendors.
Packaging Market For Compound Semiconductor Key Segments
By Packaging Platform
• Flip Chip
• Embedded Die
• Fan-In WLP
• Fan-Out WLP
By Application
• Compound Semiconductor Power Electronics
• Compound Semiconductor RF/Microwave
• Compound Semiconductor Photonics
• Compound Semiconductor Sensing
• Compound Semiconductor Quantum
By End User
• Digital Economy
• Industrial and Energy & Power
• Defense/Security
• Transport
• Consumer Electronics
• Healthcare
• Space
By Region
• U.S.
• UK
• China
• Rest of the World
Key Market Players
• Amkor Technology
• ASE Technology
• Deca Technologies Inc.
• Fujitsu Limited
• Jiangsu Changjiang Electronics Tech Co.
• KLA Corporation
• Qorvo
• Taiwan Semiconductor Manufacturing Company
• Texas Instruments
• Tokyo Electron Limited
1.1.Report description
1.2.Key benefits for stakeholders
1.3.Key market segments
1.4.Research methodology
1.4.1.Primary research
1.4.2.Secondary research
1.4.3.Analyst tools and models
Chapter 2:Executive summary
2.1.Key findings
2.1.1.Top impacting factors
2.1.2.Top investment pockets
2.2.CXO perspective
Chapter 3:MARKET OVERVIEW
3.1.Market definition and scope
3.2.Key forces shaping packaging market for compound semiconductor
3.3.Covid-19 impact analysis
3.3.1.COVID-19 Outbreak
3.3.2.Impact on market size
3.3.3.End user trends, preferences, and budget impact
3.3.4.Parent industry impact
3.3.5.Opportunity window
3.4.Top winning strategies
3.5.Market dynamics
3.5.1.Drivers
3.5.1.1.Increase in demand for miniaturization of devices
3.5.1.2.Improved system performances and optimization of compound semiconductor packaging
3.5.1.3.Emerging trends towards semiconductor wafers in automotive industry
3.5.2.Restraint
3.5.2.1.High cost of compound semiconductor packaging is hampering its adoption
3.5.3.Opportunity
3.5.3.1.Emerging usage of compound semiconductors in smart technologies
3.5.3.2.Emerging trends of fan-out wafer level packaging
Chapter 4:packaging market for Compound semiconductor, BY packaging platform
4.1.Overview
4.2.Flip Chip
4.2.1.Key market trends, growth factors, and opportunities
4.2.2.Market size and forecast, by region
4.2.3.Market analysis by country
4.3.Embedded Die
4.3.1.Key market trends, growth factors, and opportunities
4.3.2.Market size and forecast, by region
4.3.3.Market analysis by country
4.4.Fan-in WLP
4.4.1.Key market trends, growth factors, and opportunities
4.4.2.Market size and forecast, by region
4.4.3.Market analysis by country
4.5.Fan-out WLP
4.5.1.Key market trends, growth factors, and opportunities
4.5.2.Market size and forecast, by region
4.5.3.Market analysis by country
Chapter 5:packaging market for Compound semiconductor, BY Application
5.1.Overview
5.2.CS Power Electronics
5.2.1.Key market trends, growth factors, and opportunities
5.2.2.Market size and forecast, by region
5.2.3.Market size and forecast, by end user
5.2.4.Market analysis by country
5.3.CS RF/Microwave
5.3.1.Key market trends, growth factors, and opportunities
5.3.2.Market size and forecast, by region
5.3.3.Market size and forecast, by end user
5.3.4.Market analysis by country
5.4.CS Photonics
5.4.1.Key market trends, growth factors, and opportunities
5.4.2.Market size and forecast, by region
5.4.3.Market size and forecast, by end user
5.4.4.Market analysis by country
5.5.CS Sensing
5.5.1.Key market trends, growth factors, and opportunities
5.5.2.Market size and forecast, by region
5.5.3.Market size and forecast, by end user
5.5.4.Market analysis by country
5.6.CS Quantum
5.6.1.Key market trends, growth factors, and opportunities
5.6.2.Market size and forecast, by region
5.6.3.Market size and forecast, by end user
5.6.4.Market analysis by country
Chapter 6:PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY End Use
6.1.Overview
6.2.Digital Economy
6.2.1.Key market trends, growth factors, and opportunities
6.2.2.Market size and forecast, by region
6.2.3.Market analysis by country
6.3.Industrial and Energy & Power
6.3.1.Key market trends, growth factors, and opportunities
6.3.2.Market size and forecast, by region
6.3.3.Market analysis by country
6.4.Defense/Security
6.4.1.Key market trends, growth factors, and opportunities
6.4.2.Market size and forecast, by region
6.4.3.Market analysis by country
6.5.Transport
6.5.1.Key market trends, growth factors, and opportunities
6.5.2.Market size and forecast, by region
6.5.3.Market analysis by country
6.6.Consumer Electronics
6.6.1.Key market trends, growth factors, and opportunities
6.6.2.Market size and forecast, by region
6.6.3.Market analysis by country
6.7.Healthcare
6.7.1.Key market trends, growth factors, and opportunities
6.7.2.Market size and forecast, by region
6.7.3.Market analysis by country
6.8.Space
6.8.1.Key market trends, growth factors, and opportunities
6.8.2.Market size and forecast, by region
6.8.3.Market analysis by country
Chapter 7:PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY Region
7.1.Overview
7.1.1.1.U.S.
7.1.1.1.1.Market size and forecast, by packaging platform
7.1.1.1.2.Market size and forecast, by Application
7.1.1.1.3.Market size and forecast, by end user
7.1.1.1.4.Market size and forecast, application by end user
7.1.1.2.UK
7.1.1.2.1.Market size and forecast, by packaging platform
7.1.1.2.2.Market size and forecast, by Application
7.1.1.2.3.Market size and forecast, by end user
7.1.1.2.4.Market size and forecast, application by end user
7.1.1.3.China
7.1.1.3.1.Market size and forecast, by packaging platform
7.1.1.3.2.Market size and forecast, by Application
7.1.1.3.3.Market size and forecast, by end user
7.1.1.3.4.Market size and forecast, application by end user
7.1.1.4.Rest of the World
7.1.1.4.1.Market size and forecast, by packaging platform
7.1.1.4.2.Market size and forecast, by Application
7.1.1.4.3.Market size and forecast, by end user
7.1.1.4.4.Market size and forecast, application by end user
Chapter 8:Company profiles
8.1.AMKOR TECHNOLOGY
8.1.1.Company overview
8.1.2.Key executive
8.1.3.Company snapshot
8.1.4.Product portfolio
8.1.5.R&D expenditure
8.1.6.Business performance
8.1.7.Key strategic moves and developments
8.2.Advanced Semiconductor Engineering, Inc.
8.2.1.Company overview
8.2.2.Key Executives
8.2.3.Company snapshot
8.2.4.Operating business segments
8.2.5.Product portfolio
8.2.6.R&D Expenditure
8.2.7.Business performance
8.2.8.Key strategic moves and developments
8.3.Deca Technologies Inc.
8.3.1.Company overview
8.3.2.Key Executives
8.3.3.Company snapshot
8.3.4.Operating business segments
8.3.5.Product portfolio
8.3.6.Key strategic moves and developments
8.4.FUJITSU LIMITED
8.4.1.Company overview
8.4.2.Key executive
8.4.3.Company snapshot
8.4.4.Operating business segments
8.4.5.Product portfolio
8.4.6.R&D expenditure
8.4.7.Business performance
8.4.8.Key strategic moves and developments
8.5.Jiangsu Changjiang Electronics Tech Co.
8.5.1.Company overview
8.5.2.Key Executives
8.5.3.Company snapshot
8.5.4.Product portfolio
8.5.5.Business performance
8.6.KLA Corporation
8.6.1.Company overview
8.6.2.Key Executives
8.6.3.Company snapshot
8.6.4.Product portfolio
8.6.5.R&D Expenditure
8.6.6.Business performance
8.6.7.Key strategic moves and developments
8.7.Qorvo
8.7.1.Company overview
8.7.2.Key Executives
8.7.3.Company snapshot
8.7.4.Operating business segments
8.7.5.Product portfolio
8.7.6.Business performance
8.8.TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
8.8.1.Company overview
8.8.2.Key executive
8.8.3.Company snapshot
8.8.4.Product portfolio
8.8.5.R&D expenditure
8.8.6.Business performance
8.8.7.Key strategic moves and developments
8.9.TEXAS INSTRUMENTS INCORPORATED
8.9.1.Company overview
8.9.2.Key executive
8.9.3.Company snapshot
8.9.4.Operating business segments
8.9.5.Product portfolio
8.9.6.R&D expenditure
8.9.7.Business performance
8.10.Tokyo Electron Limited
8.10.1.Company overview
8.10.2.Company snapshot
8.10.3.Product portfolio
8.10.4.R&D expenditure
8.10.5.Business performance
TABLE 01.GLOBAL PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY PACKAGING PLATFORM, 2019–2027($MILLION)
TABLE 02.FLIP CHIP PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY REGION, 2019–2027($MILLION)
TABLE 03.EMBEDDED DIE PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY REGION, 2019–2027($MILLION)
TABLE 04.FAN-IN WLP PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY REGION, 2019–2027($MILLION)
TABLE 05.FAN-IN WLP PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY REGION, 2019–2027($MILLION)
TABLE 06.GLOBAL PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY APPLICATION, 2019–2027($MILLION)
TABLE 07.PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN POWER ELECTRONICS, BY REGION, 2019–2027($MILLION)
TABLE 08.PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN POWER ELECTRONICS, BY END USER, 2019–2027($MILLION)
TABLE 09.PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN RF/MICROWAVE, BY REGION, 2019–2027($MILLION)
TABLE 10.PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN RF/MICROWAVE, BY END USER, 2019–2027($MILLION)
TABLE 11.PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN PHOTONICS, BY REGION, 2019–2027($MILLION)
TABLE 12.PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN PHOTONICS, BY END USER, 2019–2027($MILLION)
TABLE 13.PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN SENSING, BY REGION, 2019–2027($MILLION)
TABLE 14.PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN SENSING, BY END USER, 2019–2027($MILLION)
TABLE 15.PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN QUANTUM, BY REGION, 2019–2027($MILLION)
TABLE 16.PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN QUANTUM, BY END USER, 2019–2027($MILLION)
TABLE 17.GLOBAL PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY END USER, 2019–2027($MILLION)
TABLE 18.PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN DIGITAL ECONOMY, BY REGION, 2019–2027($MILLION)
TABLE 19.PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN INDUSTRIAL AND ENERGY & POWER, BY REGION, 2019–2027($MILLION)
TABLE 20.PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN DEFENSE/SECURITY, BY REGION, 2019–2027($MILLION)
TABLE 21.PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN TRANSPORT, BY REGION, 2019–2027($MILLION)
TABLE 22.PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN CONSUMER ELECTRONICS, BY REGION, 2019–2027($MILLION)
TABLE 23.PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN HEALTHCARE, BY REGION, 2019–2027($MILLION)
TABLE 24.PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN SPACE, BY REGION, 2019–2027($MILLION)
TABLE 25.U.S. PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY PACKAGING PLATFORM, 2019–2027($MILLION)
TABLE 26.U.S. PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY APPLICATION, 2019–2027($MILLION)
TABLE 27.U.S. PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY END USER, 2019–2027($MILLION)
TABLE 28.U.S. PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN POWER ELECTRONICS, BY END USER, 2019–2027($MILLION)
TABLE 29.U.S. PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN RF/MICROWAVE, BY END USER, 2019–2027($MILLION)
TABLE 30.U.S. PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN PHOTONICS, BY END USER, 2019–2027($MILLION)
TABLE 31.U.S. PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN SENSING, BY END USER, 2019–2027($MILLION)
TABLE 32.U.S. PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN QUANTUM, BY END USER, 2019–2027($MILLION)
TABLE 33.UK PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY PACKAGING PLATFORM, 2019–2027($MILLION)
TABLE 34.UK PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY APPLICATION, 2019–2027($MILLION)
TABLE 35.UK PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY END USER, 2019–2027($MILLION)
TABLE 36.UK PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN POWER ELECTRONICS, BY END USER, 2019–2027($MILLION)
TABLE 37.UK PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN RF/MICROWAVE, BY END USER, 2019–2027($MILLION)
TABLE 38.UK PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN PHOTONICS, BY END USER, 2019–2027($MILLION)
TABLE 39.UK PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN SENSING, BY END USER, 2019–2027($MILLION)
TABLE 40.UK PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN QUANTUM, BY END USER, 2019–2027($MILLION)
TABLE 41.CHINA PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY PACKAGING PLATFORM, 2019–2027($MILLION)
TABLE 42.CHINA PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY APPLICATION, 2019–2027($MILLION)
TABLE 43.CHINA PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY END USER, 2019–2027($MILLION)
TABLE 44.CHINA PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN POWER ELECTRONICS, BY END USER, 2019–2027($MILLION)
TABLE 45.CHINA PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN RF/MICROWAVE, BY END USER, 2019–2027($MILLION)
TABLE 46.CHINA PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN PHOTONICS, BY END USER, 2019–2027($MILLION)
TABLE 47.CHINA PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN SENSING, BY END USER, 2019–2027($MILLION)
TABLE 48.CHINA PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN QUANTUM, BY END USER, 2019–2027($MILLION)
TABLE 49.REST OF THE WORLD PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY PACKAGING PLATFORM, 2019–2027($MILLION)
TABLE 50.REST OF THE WORLD PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY APPLICATION, 2019–2027($MILLION)
TABLE 51.REST OF THE WORLD PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR, BY END USER, 2019–2027($MILLION)
TABLE 52.REST OF THE WORLD PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN POWER ELECTRONICS, BY END USER, 2019–2027($MILLION)
TABLE 53.REST OF THE WORLD PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN RF/MICROWAVE, BY END USER, 2019–2027($MILLION)
TABLE 54.REST OF THE WORLD PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN PHOTONICS, BY END USER, 2019–2027($MILLION)
TABLE 55.REST OF THE WORLD PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN SENSING, BY END USER, 2019–2027($MILLION)
TABLE 56.REST OF THE WORLD PACKAGING MARKET FOR COMPOUND SEMICONDUCTOR IN QUANTUM, BY END USER, 2019–2027($MILLION)
TABLE 57.AMKOR TECHNOLOGY.: COMPANY SNAPSHOT
TABLE 58.AMKOR TECHNOLOGY: VIDEO ANALYTICS PRODUCT PORTFOLIO
TABLE 59.ADVANCED SEMICONDUCTOR ENGINEERING, INC.: KEY EXECUTIVES
TABLE 60.ADVANCED SEMICONDUCTOR ENGINEERING, INC.: COMPANY SNAPSHOT
TABLE 61.ADVANCED SEMICONDUCTOR ENGINEERING, INC.: OPERATING SEGMENTS
TABLE 62.ADVANCED SEMICONDUCTOR ENGINEERING, INC.: PRODUCT PORTFOLIO
TABLE 63.ADVANCED SEMICONDUCTOR ENGINEERING, INC.: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 64.DECA TECHNOLOGIES INC.: KEY EXECUTIVES
TABLE 65.DECA TECHNOLOGIES INC.: COMPANY SNAPSHOT
TABLE 66.DECA TECHNOLOGIES INC.: PRODUCT PORTFOLIO
TABLE 67.FUJITSU LIMITED: KEY EXECUTIVE
TABLE 68.FUJITSU LIMITED: COMPANY SNAPSHOT
TABLE 69.FUJITSU LIMITED: OPERATING SEGMENTS
TABLE 70.FUJITSU LIMITED: PRODUCT PORTFOLIO
TABLE 71.JIANGSU CHANGJIANG ELECTRONICS TECH CO: KEY EXECUTIVES
TABLE 72.JIANGSU CHANGJIANG ELECTRONICS TECH CO: COMPANY SNAPSHOT
TABLE 73.JIANGSU CHANGJIANG ELECTRONICS TECH CO: PRODUCT PORTFOLIO
TABLE 74.KLA CORPORATION: KEY EXECUTIVES
TABLE 75.KLA CORPORATION: COMPANY SNAPSHOT
TABLE 76.KLA CORPORATION: PRODUCT PORTFOLIO
TABLE 77.KLA CORPORATION: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 78.QORVO: KEY EXECUTIVES
TABLE 79.QORVO: COMPANY SNAPSHOT
TABLE 80.QORVO: OPERATING SEGMENTS
TABLE 81.QORVO: PRODUCT PORTFOLIO
TABLE 85.TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 86.TEXAS INSTRUMENTS INCORPORATED: KEY EXECUTIVE
TABLE 87.TEXAS INSTRUMENTS INCORPORATED: COMPANY SNAPSHOT
TABLE 88.TEXAS INSTRUMENTS INCORPORATED: OPERATING SEGMENTS
TABLE 89.TEXAS INSTRUMENTS INCORPORATED: PRODUCT PORTFOLIO
TABLE 90.TOKYO ELECTRON LIMITED: COMPANY SNAPSHOT
TABLE 91.TOKYO ELECTRON LIMITED: PRODUCT PORTFOLIO
Similar Reports
Energy meters are a typical instrument to measure the amount of electricity or energy consumed by a user. It has been traditionally present in the market with the dominant types being the electromagnetic and static ones. However the market is steadily moving towards a newer generation meters which include smart and digital meters. Players in the market are rapidly involving research and developmen...
- Publish Date: January 5, 2011
- $950
High growth and development of the power sector in India is stimulating the demand for transformers. The initiatives undertaken by the Government of India is providing ample opportunities to the players in the industry to grow. The report begins with an introduction to the transformers market with an overview of the structure of the transmission segment. The market overview section discusses the ...
- Publish Date: January 5, 2011
- $950
Power capacitors form a small part of the electrical equipment industry in India. Their use is indispensable in the energy efficient systems as it is helps to reduce the overall power factor (PF) of the system. It is a cheaper product as compared to the other electrical equipments and with growing energy efficiency needs, its use and demand is rising rapidly. A cumulative growth in the Indian powe...
- Publish Date: January 12, 2011
- $950
