Wafer Backgrinding Tape Market by Type (UV Curable and Non-UV) and Wafer Size (6 Inch, 8 Inch, 12 Inch, and Others): Global Opportunity Analysis and Industry Forecast, 2019-2026
- ALL3250663
- 199 Pages
- July 2019
- Semiconductor and Electronics
Wafer backgrinding tapes fully protect the wafer surface during backgrinding and also prevent wafer surface contamination from infiltration of grinding fluid. Usage of wafer backgrinding tapes in wafer fabrication ensures precision in wafer thickness after backgrinding. Wafer backgrinding tapes are mainly used in processing semiconductor wafers made from materials such as silicon or glass. Its powerful adhesive strength keeps wafers in place when grinding and cutting. Once the wafer has been processed, exposing the tape to ultraviolet light (UV) reduces its adhesive strength, making tape peeling or die pick up simple.
The factors such as increase in demand for ultra-thin wafers, rise in need for wafer fabrication, increase in focus toward wafer surface protection during grinding process, and growth in the semiconductor industry boost the growth of the wafer backgrinding tape market globally. However, increase in shift from non-UV to UV curable backgrinding tapes that increase the overall cost of wafer manufacturing is expected to hamper the market growth. Furthermore, increase in investment in wafer fabrication equipment and materials, especially in Korea and China, is expected to offer lucrative opportunities for the market expansion.
The global wafer backgrinding tape market is segmented on the basis of type, wafer size, and region. Based on type, the market is bifurcated into UV curable and non-UV tape types. Based on wafer size, the market is divided into 6-inch, 8-inch, 12-inch, and others. Based on region, it is analyzed across North America, Europe, Asia-Pacific, and LAMEA along with their prominent countries.
The key players profiled in the report include Furukawa Electric Co. Ltd., Mitsui Chemicals, Inc., Nitto Denko Corporation, Minitron Elektron GMBH, Denka Company Limited, Lintec of America Inc., AI Technology, Inc., Force-One Applied Materials Inc., AMC Co, Ltd, and Pantech Tape Co., Ltd.
These key players have adopted strategies such as product portfolio expansion, mergers & acquisitions, agreements, geographical expansion, and collaborations to enhance their market penetration.
KEY BENEFITS FOR STAKEHOLDERS
• This study includes the analytical depiction of the global wafer back grinding market along with the current trends and future estimations to determine the imminent investment pockets.
• The report presents information regarding the key drivers, restraints, and opportunities.
• The current market is quantitatively analyzed from 2018 to 2026 to highlight the financial competency of the industry.
• Porter’s five forces analysis illustrates the potency of the buyers and suppliers in the industry.
GLOBAL WAFER BACKGRINDING TAPE MARKET SEGMENTATION
BY TYPE:
• UV Curable
• Non-UV
BY WAFER SIZE:
• 6-Inch
• 8-Inch
• 12-Inch
• Others
BY REGION
• North America
o U.S.
o Canada
o Mexico
• Europe
o UK
o Germany
o France
o Russia
o Rest of Europe
• Asia-Pacific
o China
o Japan
o Taiwan
o South Korea
o Rest of Asia-Pacific
• LAMEA
o Latin America
o Middle East & Africa
1.1. Report description
1.2. Key benefits for stakeholders
1.3. Key market segments
1.4. Research methodology
1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models
CHAPTER 2: EXECUTIVE SUMMARY
2.1. CXO perspective
CHAPTER 3: MARKET OVERVIEW
3.1. Market definition and scope
3.2. Key findings
3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.2.3. Top winning strategies
3.3. Porter’s five forces analysis
3.4. Market share analysis (2018)
3.5. Market dynamics
3.5.1. Drivers
3.5.1.1. Increase in demand for ultra-thin wafers
3.5.1.2. Rise in need for wafer fabrication
3.5.1.3. Increase in focus toward wafer surface protection during grinding process
3.5.1.4. Growth in the semiconductor industry
3.5.2. Restraint
3.5.2.1. Increase in cost of wafer manufacturing
3.5.3. Opportunities
3.5.3.1. Increase in investment in wafer fabrication equipment and materials
3.6. Wafer manufacturing overview
3.7. Wafer fabrication
3.7.1. Types of wafer fabrication process
3.7.1.1. Front-end process
3.7.1.2. Back-end process
3.7.2. Processes involved during wafer fabrication
3.7.2.1. Oxidation
3.7.2.2. Lithography
3.7.2.3. Deposition
3.7.2.4. Etching
3.7.2.5. Chemical Mechanical Planarization
3.7.2.6. Ion implementation
3.7.2.7. Assembly and testing
3.7.2.8. Diffusion
3.7.3. Wafer grinding process (wafer thinning)
3.7.4. Type of wafer thinning
3.7.4.1. Conventional grinding
3.7.4.2. CMP
3.7.5. Machines and components required during wafer backgrinding
3.8. Backgrinding tapes customer applications and usage
3.8.1. Customer applications of backgrinding tape
3.8.2. Usage of backgrinding tape
3.9. Technology trends
3.9.1. Materials used in tapes
3.9.2. Technologies used to reduce the cycle time of backgrinding process
3.9.3. Upgrades in tape manufacturing machines
CHAPTER 4: WAFER BACKGRINDING TAPE MARKET, BY TYPE
4.1. Overview
4.2. UV Curable
4.2.1. Key market trends, growth factors, and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market analysis, by country
4.3. Non-UV
4.3.1. Key market trends, growth factors, and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market analysis, by country
CHAPTER 5: WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE
5.1. Overview
5.2. 6-Inch
5.2.1. Key market trends, growth factors, and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market analysis, by country
5.3. 8-Inch
5.3.1. Key market trends, growth factors, and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market analysis, by country
5.4. 12-Inch
5.4.1. Key market trends, growth factors, and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market analysis, by country
5.5. Others
5.5.1. Key market trends, growth factors, and opportunities
5.5.2. Market size and forecast, by region
5.5.3. Market analysis, by country
CHAPTER 6: WAFER BACKGRINDING TAPE MARKET, BY REGION
6.1. Overview
6.2. North America
6.2.1. Key market trends, growth factors, and opportunities
6.2.2. Market size and forecast, by type
6.2.3. Market size and forecast, by wafer size
6.2.4. Market analysis, by country
6.2.4.1. U.S.
6.2.4.1.1. Market size and forecast, by type
6.2.4.1.2. Market size and forecast, by wafer size
6.2.4.2. Canada
6.2.4.2.1. Market size and forecast, by type
6.2.4.2.2. Market size and forecast, by wafer size
6.2.4.3. Mexico
6.2.4.3.1. Market size and forecast, by type
6.2.4.3.2. Market size and forecast, by wafer size
6.3. Europe
6.3.1. Key market trends, growth factors, and opportunities
6.3.2. Market size and forecast, by type
6.3.3. Market size and forecast, by wafer size
6.3.4. Market analysis, by country
6.3.4.1. U.K.
6.3.4.1.1. Market size and forecast, by type
6.3.4.1.2. Market size and forecast, by wafer size
6.3.4.2. Germany
6.3.4.2.1. Market size and forecast, by type
6.3.4.2.2. Market size and forecast, by wafer size
6.3.4.3. France
6.3.4.3.1. Market size and forecast, by type
6.3.4.3.2. Market size and forecast, by wafer size
6.3.4.4. Russia
6.3.4.4.1. Market size and forecast, by type
6.3.4.4.2. Market size and forecast, by wafer size
6.3.4.5. Rest of Europe
6.3.4.5.1. Market size and forecast, by type
6.3.4.5.2. Market size and forecast, by wafer size
6.4. Asia-Pacific
6.4.1. Key market trends, growth factors, and opportunities
6.4.2. Market size and forecast, by type
6.4.3. Market size and forecast, by wafer size
6.4.4. Market analysis, by country
6.4.4.1. China
6.4.4.1.1. Market size and forecast, by type
6.4.4.1.2. Market size and forecast, by wafer size
6.4.4.2. Japan
6.4.4.2.1. Market size and forecast, by type
6.4.4.2.2. Market size and forecast, by wafer size
6.4.4.3. Taiwan
6.4.4.3.1. Market size and forecast, by type
6.4.4.3.2. Market size and forecast, by wafer size
6.4.4.4. South Korea
6.4.4.4.1. Market size and forecast, by type
6.4.4.4.2. Market size and forecast, by wafer size
6.4.4.5. Rest of Asia-Pacific
6.4.4.5.1. Market size and forecast, by type
6.4.4.5.2. Market size and forecast, by wafer size
6.5. LAMEA
6.5.1. Key market trends, growth factors, and opportunities
6.5.2. Market size and forecast, by type
6.5.3. Market size and forecast, by wafer size
6.5.4. Market analysis, by country
6.5.4.1. Latin America
6.5.4.1.1. Market size and forecast, by type
6.5.4.1.2. Market size and forecast, by wafer size
6.5.4.2. Middle East & Africa
6.5.4.2.1. Market size and forecast, by type
6.5.4.2.2. Market size and forecast, by wafer size
CHAPTER 7: COMPANY PROFILES
7.1. AI TECHNOLOGY, INC.
7.1.1. Company overview
7.1.2. Company snapshot
7.1.3. Product portfolio
7.2. AMC CO., LTD
7.2.1. Company overview
7.2.2. Company snapshot
7.2.3. Product portfolio
7.3. DENKA COMPANY LIMITED
7.3.1. Company overview
7.3.2. Company snapshot
7.3.3. Operating business segments
7.3.4. Product portfolio
7.3.5. Business performance
7.4. FURUKAWA ELECTRIC CO., LTD.
7.4.1. Company overview
7.4.2. Company snapshot
7.4.3. Operating business segments
7.4.4. Product portfolio
7.4.5. Business performance
7.4.6. Key strategic moves and developments
7.5. FORCE-ONE APPLIED MATERIALS
7.5.1. Company overview
7.5.2. Company snapshot
7.5.3. Product portfolio
7.6. LINTEC OF AMERICA, INC (LINTEC CORPORATION)
7.6.1. Company overview
7.6.2. Company snapshot
7.6.3. Operating business segments
7.6.4. Product portfolio
7.6.5. Business performance
7.6.6. Key strategic moves and developments
7.7. MITSUI CHEMICALS, INC.
7.7.1. Company overview
7.7.2. Company snapshot
7.7.3. Operating business segments
7.7.4. Product portfolio
7.7.5. Business performance
7.8. NITTO DENKO CORPORATION
7.8.1. Company overview
7.8.2. Company snapshot
7.8.3. Operating business segments
7.8.4. Product portfolio
7.8.5. Business performance
7.9. PANTECH TAPE CO., LTD.
7.9.1. Company overview
7.9.2. Company snapshot
7.9.3. Product portfolio
7.10. MINITRON ELEKTRONIK GMBH
7.10.1. Company overview
7.10.2. Company snapshot
7.10.3. Product portfolio
TABLE 01. COMPARISON BETWEEN UV CURABLE AND NON-UV WAFER BACKGRING TAPES
TABLE 02. GLOBAL WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018-2026($MILLION)
TABLE 03. GLOBAL WAFER BACKGRINDING TAPE MARKET VOLUME, BY TYPE, 2018-2026(THOUSAND KG)
TABLE 04. WAFER BACKGRINDING TAPE MARKET REVENUE FOR UV CURABLE, BY REGION 2018-2026 ($MILLION)
TABLE 05. WAFER BACKGRINDING TAPE MARKET REVENUE FOR NON-UV, BY REGION 2018-2026 ($MILLION)
TABLE 06. GLOBAL WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018-2026($MILLION)
TABLE 07. GLOBAL WAFER BACKGRINDING TAPE MARKET VOLUME, BY WAFER SIZE, 2018-2026(THOUSAND KG)
TABLE 08. WAFER BACKGRINDING TAPE MARKET REVENUE FOR 6-INCH, BY REGION 2018-2026 ($MILLION)
TABLE 09. WAFER BACKGRINDING TAPE MARKET REVENUE FOR 8-INCH, BY REGION 2018-2026 ($MILLION)
TABLE 10. WAFER BACKGRINDING TAPE MARKET REVENUE FOR 12-INCH, BY REGION 2018–2026 ($MILLION)
TABLE 11. WAFER BACKGRINDING TAPE MARKET REVENUE FOR OTHERS, BY REGION 2018–2026 ($MILLION)
TABLE 12. WAFER BACKGRINDING TAPE MARKET REVENUE, BY REGION 2018–2026 ($MILLION)
TABLE 13. WAFER BACKGRINDING TAPE MARKET VOLUME, BY REGION 2018–2026 (THOUSAND KG)
TABLE 14. NORTH AMERICAN WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 15. NORTH AMERICAN WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 16. U. S. WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 17. U. S. WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 18. CANADA WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 19. CANADA WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 20. MEXICO WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 21. MEXICO WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 22. EUROPEAN WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 23. EUROPEAN WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 24. U.K. WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 25. U.K. WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 26. GERMANY WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 27. GERMANY WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 28. FRANCE WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 29. FRANCE WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 30. RUSSIA WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 31. RUSSIA WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 32. REST OF EUROPE WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 33. REST OF EUROPE WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 34. ASIA-PACIFIC WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 35. ASIA-PACIFIC WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 36. CHINA WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 37. CHINA WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 38. JAPAN WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 39. JAPAN WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 40. TAIWAN WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 41. TAIWAN WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 42. SOUTH KOREA WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 43. SOUTH KOREA WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 44. REST OF ASIA-PACIFIC WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 45. REST OF ASIA-PACIFIC WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 46. LAMEA WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 47. LAMEA WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 48. LATIN AMERICA WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 49. LATIN AMERICA WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 50. MIDDLE EAST & AFRICA WAFER BACKGRINDING TAPE MARKET, BY TYPE, 2018–2026 ($MILLION)
TABLE 51. MIDDLE EAST & AFRICA WAFER BACKGRINDING TAPE MARKET, BY WAFER SIZE, 2018–2026 ($MILLION)
TABLE 52. AI TECHNOLOGY, INC.: COMPANY SNAPSHOT
TABLE 53. AI TECHNOLOGY, INC.: PRODUCT PORTFOLIO
TABLE 54. AMC CO., LTD: COMPANY SNAPSHOT
TABLE 55. AMC CO., LTD: PRODUCT PORTFOLIO
TABLE 56. DENKA COMPANY LIMITED: COMPANY SNAPSHOT
TABLE 57. DENKA COMPANY LIMITED: OPERATING SEGMENTS
TABLE 58. DENKA COMPANY LIMITED: PRODUCT PORTFOLIO
TABLE 59. FURUKAWA ELECTRIC CO., LTD.: COMPANY SNAPSHOT
TABLE 60. FURUKAWA ELECTRIC CO., LTD.: OPERATING SEGMENTS
TABLE 61. FURUKAWA ELECTRIC CO., LTD.: PRODUCT PORTFOLIO
TABLE 62. FURUKAWA ELECTRIC CO., LTD.: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 63. FORCE-ONE APPLIED MATERIALS: COMPANY SNAPSHOT
TABLE 64. FORCE-ONE APPLIED MATERIALS: PRODUCT PORTFOLIO
TABLE 65. LINTEC OF AMERICA, INC: COMPANY SNAPSHOT
TABLE 66. LINTEC OF AMERICA, INC: OPERATING SEGMENTS
TABLE 67. LINTEC OF AMERICA, INC: PRODUCT PORTFOLIO
TABLE 68. LINTEC OF AMERICA, INC: KEY STRATEGIC MOVES AND DEVELOPMENTS
TABLE 69. MITSUI CHEMICALS, INC.: COMPANY SNAPSHOT
TABLE 70. MITSUI CHEMICALS, INC.: OPERATING SEGMENTS
TABLE 71. MITSUI CHEMICALS, INC.: PRODUCT PORTFOLIO
TABLE 72. NITTO DENKO CORPORATION: COMPANY SNAPSHOT
TABLE 73. NITTO DENKO CORPORATION: OPERATING SEGMENTS
TABLE 74. NITTO DENKO CORPORATION: PRODUCT PORTFOLIO
TABLE 75. PANTECH TAPE CO., LTD.: COMPANY SNAPSHOT
TABLE 76. PANTECH TAPE CO., LTD.: PRODUCT PORTFOLIO
TABLE 77. MINITRON ELEKTRONIK GMBH: COMPANY SNAPSHOT
TABLE 78. MINITRON ELEKTRONIK GMBH: PRODUCT PORTFOLIO
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