Materials & Chemicals

Global Thermal Interface Materials (TIM) Market 2014-2018

  • TEC150095
  • 86 Pages
  • November 2014
  • Materials & Chemicals
About TIM
TIM is used to support heat sinks in removing heat from heat sources in various equipment. It is generally used in the form of a secondary thermally conducting material to replace the thermally insulating air between the two surfaces. Along with helping in the efficient transfer of heat, TIM also acts as an adhesive and strengthens the mechanical link between the surfaces. Polymer-based TIM, metal-based TIM, and phase change TIM (PCTIM) are the basic types of TIM commercially available. Owing to its conductive and adhesive properties, TIM is used for thermal management applications in various industries, including Computers, Electrical and Electronics, Telecom, and Automotive.
TechNavio's analysts forecast the Global TIM market to grow at a CAGR of 10.30 percent over the period 2013-2018.
Covered in this Report
The report covers the present scenario and the growth prospects of the Global TIM market for the period 2014-2018. Some of the major end-users of the Global TIM market are the Computers, Electrical and Electronics, Telecom, and Automotive industries.
TechNavio's report, the Global TIM Market 2014-2018, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the America, the APAC and EMEA regions; it also covers the Global TIM market landscape and its growth prospects in the coming years. The report includes a discussion of the key vendors operating in this market.
Key Regions
Americas
APAC
EMEA
Key Vendors
Cookson Electronics Assembly Materials
Dow Corning
Henkel
Honeywell International
Laird
Zalman Tech
Other Prominent Vendors

3M
Aavid Thermalloy
Aegis Technology
AI Technology
Akasa Group
AMETEK Specialty Metal Products
AOS Thermal Compounds
Arctic Silver
Bergquist
Cast-Coat
Chomerics
Cool Polymers
Coolaboratory
Enerdyne Thermal Solutions
Epoxies
Indium
Innovation Cooling
LORD
Master Bond
Materion
MC-21
MG Chemicals
Momentive
NuSil Technology
ROGERS
Rubbercraft
Seal King Industrial
Shenzhen Western Hemisphere Technology
Shin-Etsu Chemical
Stockwell Elastomerics
T-Global Technology
Thermal Transfer Composites
Timtronics
Universal Science
Vanguard products
Wakefield-Vette





Key Market Driver
Increased Functionality of Telecommunication and Electronic Devices
For a full, detailed list, view our report
Key Market Challenge
Concentration of Demand
For a full, detailed list, view our report
Key Market Trend
Increased Usage of PCTIM
For a full, detailed list, view our report
Key Questions Answered in this Report
What will the market size be in 2018 and what will the growth rate be?
What are the key market trends?
What is driving this market?
What are the challenges to market growth?
Who are the key vendors in this market space?
What are the market opportunities and threats faced by the key vendors?
What are the strengths and weaknesses of the key vendors?
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