Semiconductor and Electronics

Global Semiconductor Packaging Materials Market 2016-2020

  • TEC528342
  • 112 Pages
  • April 2016
  • Semiconductor and Electronics
About Semiconductor Packaging Materials

Semiconductor packages are metal, plastic, and ceramic components which not only protect the fabricated IC on the semiconductor die but also acts as an interconnect between the die and the PCB (printed circuit board). They protect the die from external mechanical impact and corrosion, and also act as electrically conductive interconnects with excellent signal propagation properties. Excess heat in the circuit is not allowed to build up by dissipation through attached heat spreaders. Packaging components vary in dimensions and functionality and mainly are organic substrates, leadframes, bonding wires, encapsulation resins, die attach materials, solder balls, and thermal interface materials, among others. The key customers of these packaging material are fabless semiconductor companies, packaging material suppliers, packaging subcontractors, semiconductor manufacturers, the electronics industry, and the automotive sector.

Technavios analysts forecast the global semiconductor packaging materials market to grow at a CAGR of 4.79% during the period 2016-2020.

Covered in this report
The report covers the present scenario and the growth prospects of the global semiconductor packaging materials market for the period 2016-2020. To calculate the market size and geographical segmentation, the report considers the revenue generated from the sales of different types of packaging based on the type of material, which can be broadly classified as either leadframe based or laminate substrate based.

The market is divided into the following segments based on geography:
Americas
APAC
EMEA

Technavio's report, Global Semiconductor Packaging Materials Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Key vendors
Amkor Technology
DuPont
Henkel
Hitachi Chemical
Honeywell
KYOCERA
Toppan Printing

Other prominent vendors
Alpha Advanced Materials
Applied Materials
ASM Pacific Technology (ASMPT)
BASF
Beijing Doublink Solders
Beijing Kehua New Chemical Technology
Cheil Industries
Duksan Hi-metal
Diehl Metall
Dynacraft
Evergreen Semiconductor Materials
Guangdong Rongtai
Heesung Metal
Heraeus
Ibiden
Indium
IQE
KCC
LG Innotek
Lintec
Lord
Mitsui High-Tec
MK Electron
Nanya PCB
Ningbo Dongsheng IC
Nippon Micrometal
Nitto Denko
Poongsan
Samsung Techwin
Shinko
Shin-Etsu Chemical
Shanghai Sinyang Semiconductor Materials
Sumitomo Metal Mining
Tanaka Denshi Kogyo
Tatsuta Electronic Materials
Xiamen Yonghong Electronics

Market driver
Rising demand for polymer adhesive wafer bonding equipment
For a full, detailed list, view our report

Market challenge
Fluctuating foreign exchange rates
For a full, detailed list, view our report

Market trend
Rapid technological changes
For a full, detailed list, view our report

Key questions answered in this report
What will the market size be in 2020 and what will the growth rate be?
What are the key market trends?
What is driving this market?
What are the challenges to market growth?
Who are the key vendors in this market space?
What are the market opportunities and threats faced by the key vendors?
What are the strengths and weaknesses of the key vendors?

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