China 3D IC and 2.5D IC Packaging Market Research Report 2017

China 3D IC and 2.5D IC Packaging Market Research Report 2017

1 3D IC and 2.5D IC Packaging Market Overview

1.1 Product Overview and Scope of 3D IC and 2.5D IC Packaging

1.2 3D IC and 2.5D IC Packaging Segment by Type

1.2.1 China Production Market Share of 3D IC and 2.5D IC Packaging Type in 2015

1.2.2 3D wafer-level chip-scale packaging

1.2.3 3D TSV

1.2.4 2.5D

1.3 Applications of 3D IC and 2.5D IC Packaging

1.3.1 3D IC and 2.5D IC Packaging Consumption Market Share by Application in 2015

1.3.2 Consumer electronics

1.3.3 Telecommunication

1.3.4 Industrial sector

1.3.5 Automotive

1.3.6 Military and aerospace

1.3.7 Smart technologies

1.3.8 Medical devices

1.4 China Market Size (Value) of 3D IC and 2.5D IC Packaging (2011-2021)

1.5 China 3D IC and 2.5D IC Packaging Status and Outlook

1.6 Government Policies

2 China 3D IC and 2.5D IC Packaging Market Competition by Manufacturers

2.1 China 3D IC and 2.5D IC Packaging Capacity, Production and Share by Manufacturers (2015 and 2016)

2.2 China 3D IC and 2.5D IC Packaging Revenue and Share by Manufacturers (2015 and 2016)

2.3 China 3D IC and 2.5D IC Packaging Average Price by Manufacturers (2015 and 2016)

2.4 Manufacturers 3D IC and 2.5D IC Packaging Manufacturing Base Distribution, Sales Area, Product Type

2.5 3D IC and 2.5D IC Packaging Market Competitive Situation and Trends

2.5.1 3D IC and 2.5D IC Packaging Market Concentration Rate

2.5.2 3D IC and 2.5D IC Packaging Market Share of Top 3 and Top 5 Manufacturers

3 China 3D IC and 2.5D IC Packaging Manufacturers Profiles/Analysis

3.1 Tezzaron

3.1.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors

3.1.2 3D IC and 2.5D IC Packaging Product Type, Application and Specification

3.1.2.1 3D wafer-level chip-scale packaging

3.1.2.2 3D TSV

3.1.3 Tezzaron 3D IC and 2.5D IC Packaging Capacity, Production, Revenue, Price and Gross Margin (2015 and 2016)

3.1.4 Main Business/Business Overview

3.2 ASE Group

3.2.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors

3.2.2 3D IC and 2.5D IC Packaging Product Type, Application and Specification

3.2.2.1 3D wafer-level chip-scale packaging

3.2.2.2 3D TSV

3.2.3 ASE Group 95 Capacity, Production, Revenue, Price and Gross Margin (2015 and 2016)

3.2.4 Main Business/Business Overview

3.3 Amkor Technology

3.3.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors

3.3.2 3D IC and 2.5D IC Packaging Product Type, Application and Specification

3.3.2.1 3D wafer-level chip-scale packaging

3.3.2.2 3D TSV

3.3.3 Amkor Technology 110 Capacity, Production, Revenue, Price and Gross Margin (2015 and 2016)

3.3.4 Main Business/Business Overview

3.4 STATS ChipPAC Ltd.

3.4.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors

3.4.2 3D IC and 2.5D IC Packaging Product Type, Application and Specification

3.4.2.1 3D wafer-level chip-scale packaging

3.4.2.2 3D TSV

3.4.3 STATS ChipPAC Ltd. Jan Capacity, Production, Revenue, Price and Gross Margin (2015 and 2016)

3.4.4 Main Business/Business Overview

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4 China 3D IC and 2.5D IC Packaging Capacity, Production, Revenue, Consumption, Export and Import (2011-2016)

4.1 China 3D IC and 2.5D IC Packaging Capacity, Production and Growth (2011-2016)

4.2 China 3D IC and 2.5D IC Packaging Revenue and Growth (2011-2016)

4.3 China 3D IC and 2.5D IC Packaging Production, Consumption, Export and Import (2011-2016)

5 China 3D IC and 2.5D IC Packaging Production, Revenue (Value), Price Trend by Type

5.1 China 3D IC and 2.5D IC Packaging Production and Market Share by Type (2011-2016)

5.2 China 3D IC and 2.5D IC Packaging Revenue and Market Share by Type (2011-2016)

5.3 China 3D IC and 2.5D IC Packaging Price by Type (2011-2016)

5.4 China 3D IC and 2.5D IC Packaging Production Growth by Type (2011-2016)

6 China 3D IC and 2.5D IC Packaging Market Analysis by Application

6.1 China 3D IC and 2.5D IC Packaging Consumption and Market Share by Application (2011-2016)

6.2 China 3D IC and 2.5D IC Packaging Consumption Growth Rate by Application (2011-2016)

6.3 Market Drivers and Opportunities

6.3.1 Potential Application

6.3.2 Emerging Markets/Countries

7 China3D IC and 2.5D IC Packaging Market Analysis by Regions (Provinces)

7.1 China 3D IC and 2.5D IC Packaging Production, Production Value and Price by Regions (Provinces)(2011-2016)

7.1.1 China 3D IC and 2.5D IC Packaging Production and Market Share by Regions (Provinces)(2011-2016)

7.1.2 China 3D IC and 2.5D IC Packaging Production Value and Market Share by Regions (Provinces)(2011-2016)

7.1.3 China 3D IC and 2.5D IC Packaging Sales Price by Regions (Provinces)(2011-2016)

7.2 China 3D IC and 2.5D IC Packaging Consumption by Regions (Provinces)(2011-2016)

7.3 China 3D IC and 2.5D IC Packaging Production, Consumption, Export and Import (2011-2016)

8 3D IC and 2.5D IC Packaging Manufacturing Cost Analysis

8.1 3D IC and 2.5D IC Packaging Key Raw Materials Analysis

8.1.1 Key Raw Materials

8.1.2 Price Trend of Key Raw Materials

8.1.3 Key Suppliers of Raw Materials

8.1.4 Market Concentration Rate of Raw Materials

8.2 Proportion of Manufacturing Cost Structure

8.2.1 Raw Materials

8.2.2 Labor Cost

8.2.3 Manufacturing Expenses

8.3 Manufacturing Process Analysis of 3D IC and 2.5D IC Packaging

9 Industrial Chain, Sourcing Strategy and Downstream Buyers

9.1 3D IC and 2.5D IC Packaging Industrial Chain Analysis

9.2 Upstream Raw Materials Sourcing

9.3 Raw Materials Sources of 3D IC and 2.5D IC Packaging Major Manufacturers in 2015

9.4 Downstream Buyers

10 Marketing Strategy Analysis, Distributors/Traders

10.1 Marketing Channel

10.1.1 Direct Marketing

10.1.2 Indirect Marketing

10.1.3 Marketing Channel Development Trend

10.2 Market Positioning

10.2.1 Pricing Strategy

10.2.2 Brand Strategy

10.2.3 Target Client

10.3 Distributors/Traders List

11 Market Effect Factors Analysis

11.1 Technology Progress/Risk

11.1.1 Substitutes Threat

11.1.2 Technology Progress in Related Industry

11.2 Consumer Needs/Customer Preference Change

11.3 Economic/Political Environmental Change

12 China 3D IC and 2.5D IC Packaging Market Forecast (2016-2021)

12.1 China 3D IC and 2.5D IC Packaging Capacity, Production, Revenue Forecast (2016-2021)

12.2 China 3D IC and 2.5D IC Packaging Production, Import, Export and Consumption Forecast (2016-2021)

12.3 China 3D IC and 2.5D IC Packaging Production Forecast by Type (2016-2021)

12.4 China 3D IC and 2.5D IC Packaging Consumption Forecast by Application (2016-2021)

12.5 China 3D IC and 2.5D IC Packaging Production, Consumption, Import and Export Forecast by Regions (Provinces)(2016-2021)

12.5.1 China 3D IC and 2.5D IC Packaging Production Forecast by Regions (Provinces)(2016-2021)

12.5.2 China 3D IC and 2.5D IC Packaging Consumption Forecast by Regions (Provinces)(2016-2021)

12.5.3 China 3D IC and 2.5D IC Packaging Production, Consumption, Import and Export Forecast by Regions (Provinces)(2016-2021)

12.6 3D IC and 2.5D IC Packaging Price Forecast (2016-2021)

13 Research Findings and Conclusion

14 Appendix

Methodology

Analyst Introduction

Data Source

Figure Picture of 3D IC and 2.5D IC Packaging

Figure China Production Market Share of 3D IC and 2.5D IC Packaging by Type in 2015

Figure Product Picture of 3D wafer-level chip-scale packaging

Table Major Manufacturers of 3D wafer-level chip-scale packaging

Figure Product Picture of 3D TSV

Table Major Manufacturers of 3D TSV

Figure Product Picture of 2.5D

Table Major Manufacturers of 2.5D

Table 3D IC and 2.5D IC Packaging Consumption Market Share by Application in 2015

Figure Consumer electronics Examples

Figure Telecommunication Examples

Figure Industrial sector Examples

Figure Automotive Examples

Figure Military and aerospace Examples

Figure Smart technologies Examples

Figure Medical devices Examples

Figure China 3D IC and 2.5D IC Packaging Revenue (Million USD) and Growth Rate (2011-2021)

Table China 3D IC and 2.5D IC Packaging Capacity of Key Manufacturers (2015 and 2016)

Table China 3D IC and 2.5D IC Packaging Capacity Market Share of Key Manufacturers (2015 and 2016)

Figure China 3D IC and 2.5D IC Packaging Capacity of Key Manufacturers in 2015

Figure China 3D IC and 2.5D IC Packaging Capacity of Key Manufacturers in 2016

Table China 3D IC and 2.5D IC Packaging Production of Key Manufacturers (2015 and 2016)

Table China 3D IC and 2.5D IC Packaging Production Share by Manufacturers (2015 and 2016)

Figure 2015 3D IC and 2.5D IC Packaging Production Share by Manufacturers

Figure 2016 3D IC and 2.5D IC Packaging Production Share by Manufacturers

Table China 3D IC and 2.5D IC Packaging Revenue (Million USD) by Manufacturers (2015 and 2016)

Table China 3D IC and 2.5D IC Packaging Revenue Share by Manufacturers (2015 and 2016)

Table 2015 China 3D IC and 2.5D IC Packaging Revenue Share by Manufacturers

Table 2016 China 3D IC and 2.5D IC Packaging Revenue Share by Manufacturers

Table China Market 3D IC and 2.5D IC Packaging Average Price of Key Manufacturers (2015 and 2016)

Figure China Market 3D IC and 2.5D IC Packaging Average Price of Key Manufacturers in 2015

Table Manufacturers 3D IC and 2.5D IC Packaging Manufacturing Base Distribution and Sales Area

Table Manufacturers 3D IC and 2.5D IC Packaging Product Type

Figure 3D IC and 2.5D IC Packaging Market Share of Top 3 Manufacturers

Figure 3D IC and 2.5D IC Packaging Market Share of Top 5 Manufacturers

Table Tezzaron Basic Information, Manufacturing Base, Sales Area and Its Competitors

Table Tezzaron 3D IC and 2.5D IC Packaging Capacity, Production, Revenue, Price and Gross Margin (2011-2016)

Figure Tezzaron 3D IC and 2.5D IC Packaging Market Share (2011-2016)

Table ASE Group Basic Information, Manufacturing Base, Sales Area and Its Competitors

Table ASE Group 3D IC and 2.5D IC Packaging Capacity, Production, Revenue, Price and Gross Margin (2011-2016)

Figure ASE Group 3D IC and 2.5D IC Packaging Market Share (2011-2016)

Table Amkor Technology Basic Information, Manufacturing Base, Sales Area and Its Competitors

Table Amkor Technology 3D IC and 2.5D IC Packaging Capacity, Production, Revenue, Price and Gross Margin (2011-2016)

Figure Amkor Technology 3D IC and 2.5D IC Packaging Market Share (2011-2016)

Table STATS ChipPAC Ltd. Basic Information, Manufacturing Base, Sales Area and Its Competitors

Table STATS ChipPAC Ltd. 3D IC and 2.5D IC Packaging Capacity, Production, Revenue, Price and Gross Margin (2011-2016)

Figure STATS ChipPAC Ltd. 3D IC and 2.5D IC Packaging Market Share (2011-2016)

Figure China 3D IC and 2.5D IC Packaging Capacity, Production and Growth (2011-2016)

Figure China 3D IC and 2.5D IC Packaging Revenue (Million USD) and Growth (2011-2016)

Table China 3D IC and 2.5D IC Packaging Production, Consumption, Export and Import (2011-2016)

Table China 3D IC and 2.5D IC Packaging Production by Type (2011-2016)

Table China 3D IC and 2.5D IC Packaging Production Share by Type (2011-2016)

Figure Production Market Share of 3D IC and 2.5D IC Packaging by Type (2011-2016)

Figure 2015 Production Market Share of 3D IC and 2.5D IC Packaging by Type

Table China 3D IC and 2.5D IC Packaging Revenue by Type (2011-2016)

Table China 3D IC and 2.5D IC Packaging Revenue Share by Type (2011-2016)

Figure Production Revenue Share of 3D IC and 2.5D IC Packaging by Type (2011-2016)

Figure 2015 Revenue Market Share of 3D IC and 2.5D IC Packaging by Type

Table China 3D IC and 2.5D IC Packaging Price by Type (2011-2016)

Figure China 3D IC and 2.5D IC Packaging Production Growth by Type (2011-2016)

Table China 3D IC and 2.5D IC Packaging Consumption by Application (2011-2016)

Table China 3D IC and 2.5D IC Packaging Consumption Market Share by Application (2011-2016)

Figure China 3D IC and 2.5D IC Packaging Consumption Market Share by Application in 2015

Table China 3D IC and 2.5D IC Packaging Consumption Growth Rate by Application (2011-2016)

Figure China 3D IC and 2.5D IC Packaging Consumption Growth Rate by Application (2011-2016)

Table China 3D IC and 2.5D IC Packaging Production by Regions (Provinces)(2011-2016)

Table China 3D IC and 2.5D IC Packaging Production Market Share by Regions (Provinces)(2011-2016)

Table China 3D IC and 2.5D IC Packaging Production Value by Regions (Provinces)(2011-2016)

Table China 3D IC and 2.5D IC Packaging Production Value Market Share by Regions (Provinces)(2011-2016)

Table China 3D IC and 2.5D IC Packaging Sales Price by Regions (Provinces)(2011-2016)

Table China 3D IC and 2.5D IC Packaging Consumption by Regions (Provinces)(2011-2016)

Table China 3D IC and 2.5D IC Packaging Consumption Market Share by Regions (Provinces)(2011-2016)

Table China 3D IC and 2.5D IC Packaging Production, Consumption, Export and Import (2011-2016)

Table Production Base and Market Concentration Rate of Raw Material

Figure Price Trend of Key Raw Materials

Table Key Suppliers of Raw Materials

Figure Manufacturing Cost Structure of 3D IC and 2.5D IC Packaging

Figure Manufacturing Process Analysis of 3D IC and 2.5D IC Packaging

Figure 3D IC and 2.5D IC Packaging Industrial Chain Analysis

Table Raw Materials Sources of 3D IC and 2.5D IC Packaging Major Manufacturers in 2015

Table Major Buyers of 3D IC and 2.5D IC Packaging

Table Distributors/Traders List

Figure China 3D IC and 2.5D IC Packaging Capacity, Production and Growth Rate Forecast (2016-2021)

Figure China 3D IC and 2.5D IC Packaging Revenue and Growth Rate Forecast (2016-2021)

Table China 3D IC and 2.5D IC Packaging Production, Import, Export and Consumption Forecast (2016-2021)

Table China 3D IC and 2.5D IC Packaging Production Forecast by Type (2016-2021)

Table China 3D IC and 2.5D IC Packaging Consumption Forecast by Application (2016-2021)

Table China 3D IC and 2.5D IC Packaging Production Forecast by Regions (Provinces)(2016-2021)

Table China 3D IC and 2.5D IC Packaging Consumption Forecast by Regions (Provinces)(2016-2021)

Table China 3D IC and 2.5D IC Packaging Production, Consumption, Import and Export Forecast by Regions (Provinces)(2016-2021)