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Semiconductor Packaging and Test Market in China 2015-2019

Category : Semiconductor and Electronics  | Published Date : Nov-2015 | Pages : 57
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About semiconductor packaging and testing
Semiconductor packaging involves casing of materials such as metal, plastic, glass, or ceramic on the silicon wafer. These casings usually contain one or more semiconductor electronic components. A casing protects the silicon wafer against corrosion and impact, clamps the contact pins or leads used to connect the external circuits to the device, and dissipates heat produced in the device. Though packages are usually made in accordance to industry standards, they meet the specifics of an individual manufacturer.
Wafer testing is executed during the semiconductor device fabrication. This involves the testing of all individual integrated circuits present on the wafer. The individual circuits are tested for functional defects using special test patterns. The testing is carried out using an equipment called a wafer prober or handler. Testing is also carried out using testing methods such as system level tests and burn-in method.

Technavio's analysts forecast the semiconductor packaging and test market in China to grow at a CAGR of 7.05% by revenue over the period 2014-2019.

Covered in this report
The report covers the present scenario and the growth prospects of the semiconductor packaging and test market in China for 2015-2019 along with a market overview. The market has been segmented and sub-segmented on the following basis:
 By business type :
 IDM (integrated devices manufacturers)
 Outsourced semiconductor assembly and test (OSAT)

Technavio's report, Semiconductor Packaging and Test Market in China in 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report focuses on the landscape of semiconductor packaging and test market in China market and its opportunities in the coming years. The report includes a discussion of the key vendors operating in this market. 

Key vendors
 Amkor
 ASE
 PowerTech
 SPIL
 STATS ChipsPAC
 UTAC

Other prominent vendors
 ChipMos
 Greatek
 Huanhong
 JCET
 KYEC
 Lingsen Precision
 Nepes Corporation 
 SMIC
 Tianshui Huatian 
 Unisem

Key market driver
 Growth of semiconductor chip application market 
 For a full, detailed list, view our report

Key market challenge
 Short lifecycle of semiconductor devices
 For a full, detailed list, view our report

Key market trend
 Emergence of 3D packaging 
 For a full, detailed list, view our report

Key questions answered in this report
 What will the market size be in 2019 in terms of both revenue and unit shipments and what will the growth rate be
 What are the key market trends
 What is driving this market
 What are the challenges to market growth
 Who are the key vendors in this market space
 What are the market opportunities and threats faced by the key vendors
PART 01: Executive summary
Highlights
PART 02: Scope of the report
Market overview
Product offerings
PART 03: Market research methodology
Research methodology
Economic indicators
PART 04: Introduction
Key market highlights
PART 05: Market landscape
Country profile
Market size and forecast
Five forces analysis
PART 06: Market segmentation by business type
Market size and forecast
Market size and forecast
PART 07: Market drivers
PART 08: Impact of drivers
PART 09: Market challenges
PART 10: Impact of drivers and challenges
PART 11: Market trends
PART 12: Vendor landscape
Competitive scenario
Other prominent vendors
ChipMOS TECHNOLOGIES (Bermuda)
Greatek Electronic
Huahong
JCET
KYEC
Lingsen Precision
Nepes
SMIC
Tianshui Huatian
Unisem
PART 13: Key vendor analysis
Amkor Technology
ASE
Powertech Technology
Siliconware Precision Industries (SPIL)
STATS ChipPAC
UTAC
PART 14: Appendix
List of abbreviations
PART 15: Explore Technavio
List of Exhibits
Exhibit 01: Evolution of semiconductor packaging techniques
Exhibit 02: Types of packaging and testing
Exhibit 03: Semiconductor packaging and test market
Exhibit 04: Semiconductor packaging and test market size in China ($ billions)
Exhibit 05: Five forces analysis
Exhibit 06: Semiconductor packaging and test market by IDM in China 2014-2019 ($ billions)
Exhibit 07: Semiconductor packaging and test market in China by outsourcing 2014-2019 ($ billions)
Exhibit 08: Impact of drivers
Exhibit 09: Impact of drivers and challenges
Exhibit 10: Market share in semiconductor packaging and test market in China 2014
Exhibit 11: Amkor Technology: Product segmentation by revenue 2014
Exhibit 12: Amkor Technology: Product segment comparison by revenue 2013 and 2014 ($ billions)
Exhibit 13: Amkor Technology: Geographical segmentation by revenue 2014
Exhibit 14: ASE: Business segmentation by revenue 2014
Exhibit 15: ASE: Business segmentation by revenue 2013 and 2014 ($ billions)
Exhibit 16: Company Name: Geographical segmentation by revenue 2013
Exhibit 17: Powertech Technology: Business segmentation
Exhibit 18: Powertech Technology: Geographical segmentation by revenue 2014
Exhibit 19: SPIL: Business segmentation by revenue 2014
Exhibit 20: SPIL: Business segmentation by revenue 2013 and 2014 ($ billions)
Exhibit 21: SPIL: Geographical segmentation by revenue 2014
Exhibit 22: STATS ChipPAC: Product segmentation by revenue 2014
Exhibit 23: STATS ChipPAC: Geographical segmentation by revenue 2013
Exhibit 24: UTAC: Business segmentation

...
Publisher Name : Technavio

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