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Global Semiconductor Packaging and Assembly Equipment Market 2016-2020

Category : Semiconductor and Electronics  | Published Date : Jan-2016 | Pages : 67
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About Semiconductor Packaging and Assembly Equipment

For an integrated chip (IC) to function, it needs to be connected to the package or connected directly to the printed circuit. This involves dicing, wire bonding, and die bonding. This entire process is known as semiconductor packaging and assembly, which is the back-end process of chip formation. The increasing application of semiconductor ICs across many segments has increased the demand for semiconductor packaging and assembly equipment.

Technavios analysts forecast the global semiconductor packaging and assembly equipment market to grow at a CAGR of 4.68% during the period 2016-2020.

Covered in this report 
The report covers the present scenario and the growth prospects of the global semiconductor packaging and assembly equipment market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sale of die-level and wafer-level packaging and assembly equipment to semiconductor manufacturers.

The market is divided into the following segments based on type: 
Die- level packaging and assembly equipment
Wafer-level packaging and assembly equipment

Technavios report, Global Semiconductor Packaging and Assembly Equipment Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market. 

Key vendors 
Applied Materials
ASMPT
DISCO
EVG
Kulicke and Soffa Industries
TEL
Tokyo Seimitsu 

Other prominent vendors 
Rudolph Technologies
SEMES
Suss Microtec
Ultratech
Ulvac Technologies

Market driver 
Rising demand for polymer adhesive wafer bonding equipment
For a full, detailed list, view our report 

Market challenge 
Fluctuating foreign exchange rates
For a full, detailed list, view our report 

Market trend 
Higher number of mergers and acquisitions (M&A)
For a full, detailed list, view our report 

Key questions answered in this report 
What will the market size be in 2020 and what will the growth rate be?
What are the key market trends?
What is driving this market?
What are the challenges to market growth?
Who are the key vendors in this market space?
What are the market opportunities and threats faced by the key vendors?
What are the strengths and weaknesses of the key vendors? 

You can request one free hour of our analysts time when you purchase this market report. Details are provided within the report.
PART 01: Executive summary
Highlights
PART 02: Scope of the report
Market overview
Top-vendor offerings
PART 03: Market research methodology
Research methodology
Economic indicators
PEST analysis
PART 04: Introduction
Key market highlights
Market perspective
PART 05: Technology landscape
Back-end chip formation
Wafer-level versus die-level packaging and assembly
Roadmap of the semiconductor packaging industry
Ecosystem of semiconductor IC packaging industry
PART 06: Market landscape
Consumer perspective
Market size and forecast
Five forces analysis
PART 07: Market segmentation by type
Market overview
Market size and forecast
PART 08: Geographical segmentation
Market overview
Global semiconductor packaging and assembly equipment market in APAC
Global semiconductor packaging and assembly equipment market in North America
Global semiconductor packaging and assembly equipment market in Europe
PART 09: Market drivers and their impact
Rising demand for polymer adhesive wafer bonding equipment
Growing application of semiconductor ICs in the IoT
Growing demand for semiconductor ICs
Increasing complexity of semiconductor IC designs
Increasing miniaturization of electronic devices
PART 10: Market challenges
Fluctuating foreign exchange rates
Heavy investment required
Cyclical nature of the semiconductor industry
PART 11: Impact of drivers and challenges
PART 12: Market trends
Higher number of M&A
Rapid technological changes in the semiconductor industry
High adoption of semiconductor ICs in automobiles
PART 13: Vendor landscape
Competitive scenario
Key vendors
Other prominent vendors
PART 14: Key vendor analysis
Applied Materials
ASM Pacific Technology (ASMPT)
Disco
EV Group (EVG)
Kulicke and Soffa Industries
Tokyo Electron Ltd. (TEL)
Tokyo Seimitsu
PART 15: Key suggestions for investors/vendors
PART 16: Appendix
List of abbreviations
PART 17: Explore Technavio
List Of Exhibits
Exhibit 01: Global semiconductor packaging and assembly equipment market segmentation
Exhibit 02: Product offerings
Exhibit 03: Steps in back-end chip formation
Exhibit 04: 2.5D IC block diagram
Exhibit 05: 3D IC block diagram
Exhibit 06: Old supply chain of semiconductor IC packaging industry
Exhibit 07: New supply chain of semiconductor IC packaging industry
Exhibit 08: Global semiconductor packaging and assembly equipment market 2015-2020 ($ billions)
Exhibit 09: Five forces analysis
Exhibit 10: Global semiconductor packaging and assembly equipment market 2015
Exhibit 11: Global semiconductor packaging and assembly equipment market 2015-2020 (% share)
Exhibit 12: Global semiconductor packaging and assembly equipment market 2015-2020 ($ billions)
Exhibit 13: Global semiconductor packaging and assembly equipment market 2015
Exhibit 14: Global semiconductor packaging and assembly equipment market in APAC ($ billions)
Exhibit 15: Global semiconductor packaging and assembly equipment market in North America ($ billions)
Exhibit 16: Global semiconductor packaging and assembly equipment market in Europe ($ millions)
Exhibit 17: Impact of drivers on key customer segments
Exhibit 18: Global MEMS market 2015-2020 ($ billions)
Exhibit 19: Global semiconductor market trend 1992-2014 ($ billions)
Exhibit 20: Impact of drivers and challenges
Exhibit 21: Global NAND flash market 2015-2020 (% share)
Exhibit 22: Global car shipments 2015-2020 (shipment growth)
Exhibit 23: Applied Materials: Geographical segmentation by revenue 2014
Exhibit 24: ASMPT: Geographical segmentation by revenue 2014
Exhibit 25: Disco: Geographical segmentation by revenue 2014
Exhibit 26: Kulicke and Soffa Industries: Geographical segmentation by revenue 2014
Exhibit 27: TEL: Geographical segmentation by revenue 2015
Exhibit 28: TEL: Business performance by revenue 2012-2015
Exhibit 29: Tokyo Seimitsu: Geographical segmentation by revenue 2014
Exhibit 30: Tokyo Seimitsu: Business segmentation by revenue 2013-2015 ($ millions)
...
Publisher Name : Technavio

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