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Global Interconnect Market 2015-2019

Category : Semiconductor and Electronics  | Published Date : Aug-2015 | Pages : 77
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About Interconnect Device
Interconnect is an electrical connection that connects two or more devices. It derives its applications in the process and discrete industries by facilitating effective interconnection and smooth operations. With the increase in integration of IT and electronics in process and discrete industries, there is a growing need of interconnects which can connect various devices in use and provide real-time information to the operators on shop-floor. 

Technavios analysts forecast the global interconnect market to grow at a CAGR of 8.68% over the period 2014-2019.

Covered in this Report
The report includes the present scenario and the growth prospects of the global interconnect market for the period 2015-2019. The market can be segmented into two divisions: connectors and cable assemblies.

Technavios report, Global Interconnect Market 2015-2019, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the APAC, Europe, and North America; it also covers the landscape of the global interconnect market and its growth prospects in the coming years. The report includes a discussion of the key vendors operating in this market.

Key Regions
• APAC
• Europe
• North America

Key Vendors
• Amphenol
• Foxconn
• Molex
• TE Connectivity
• Yazaki

Other Prominent Vendors
• 3M
• Alstom SA
• Belden Incorporated
• Delphi
• JST
• Phoenix Contact
• Rosenberger
• Sumitomo Wiring Systems

Key Market Driver
• Increasing Demand for Bandwidth
• For a full, detailed list, view our report

Key Market Challenge
• Absence of Uniform Standard
• For a full, detailed list, view our report

Key Market Trend
• Real-time Data for Industrial Applications
• For a full, detailed list, view our report

Key Questions Answered in this Report
• What will the market size be in 2019 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?
01. Executive Summary

02. List of Abbreviations

03. Scope of the Report

03.1 Market Overview

03.2 Product Offerings

04. Market Research Methodology

04.1 Market Research Process

04.2 Research Methodology

05. Introduction

06. Market Landscape

06.1 Market Overview

06.2 Market Size and Forecast

06.3 Five Forces Analysis

07. Geographical Segmentation

07.1 Global Interconnect Market by Geographical Segmentation 2014-2019

07.2 Interconnect Market in the APAC Region

07.2.1 Market Size and Forecast

07.3 Interconnect Market in the Europe

07.3.1 Market Size and Forecast

07.4 Interconnect Market in North America

07.4.1 Market Size and Forecast

07.5 Interconnect Market in RoW

07.5.1 Market Size and Forecast

08. Market Segmentation by Product

08.1 Global Interconnect Market by Product 2014-2019

08.2 Global Interconnect Market by Product: Cable Assembly

08.2.1 Market Size and Forecast

08.3 Global Interconnect Market by Product: Connector

08.3.1 Market Size and Forecast

09. Market Segmentation by End-users

09.1 Global Interconnect Market by End-users 2014-2019

09.2 Global Interconnect Market by End-user: Automotive

09.2.1 Market Size and Forecast

09.3 Global Interconnect Market by End-user: IT

09.3.1 Market Size and Forecast

09.4 Global Interconnect Market by End-user: Telecommunication

09.4.1 Market Size and Forecast

09.5 Global Interconnect Market by End-user: Industrial

09.5.1 Market Size and Forecast

09.6 Global Interconnect Market by End-user: Others

09.6.1 Market Size and Forecast

10. Buying Criteria

11. Market Growth Drivers

12. Drivers and their Impact

13. Market Challenges

14. Impact of Drivers and Challenges

15. Market Trends

16. Trends and their Impact

17. Vendor Landscape

17.1 Competitive Scenario

17.2 Other Prominent Vendors

18. Key Vendor Analysis

18.1 Amphenol

18.1.1 Key Facts

18.1.2 Business Overview

18.1.3 Business Segmentation by Revenue 2013

18.1.4 Products Segmentation by Revenue 2012 and 2013

18.1.5 Geographical Segmentation by Revenue 2013

18.1.6 Business Strategy

18.1.7 Recent Developments

18.1.8 SWOT Analysis

18.2 Hon Hai (Foxconn)

18.2.1 Key Facts

18.2.2 Business Overview

18.2.3 Geographical Segmentation by Revenue 2013

18.2.4 Recent Developments

18.2.5 SWOT Analysis

18.3 Molex

18.3.1 Key Facts

18.3.2 Business Overview

18.3.3 Market Segmentation by Revenue 2013

18.3.4 Product Segmentation by Revenue 2013

18.3.5 Product Segmentation by Revenue 2012 and 2013

18.3.6 Geographical Segmentation by Revenue 2013

18.3.7 Business Strategy

18.3.8 Recent Developments

18.3.9 SWOT Analysis

18.4 TE Connectivity

18.4.1 Key Facts

18.4.2 Business Overview

18.4.3 Business Segmentation by Revenue 2013

18.4.4 Business Segmentation by Revenue 2012 and 2013

18.4.5 Geographical Segmentation by Revenue 2013

18.4.6 Business Strategy

18.4.7 Recent Developments

18.4.8 SWOT Analysis

18.5 Yazaki

18.5.1 Key Facts

18.5.2 Business Overview

18.5.3 Key Offerings

18.5.4 Net Sales by 2012 and 2013

18.5.5 Geographical Segmentation by Revenue 2014

18.5.6 SWOT Analysis

19. Other Reports in this Series

List of Exhibits:
Exhibit 1: Market Research Methodology
Exhibit 2: Interconnect Components
Exhibit 3: Global Interconnect Market
Exhibit 4: Global Interconnect Market 2014-2019 ($ billions)
Exhibit 5: Interconnect Market by Geographical Segmentation 2014-2019
Exhibit 6: Interconnect Market in APAC Region 2014-2019 ($ billions)
Exhibit 7: Interconnect Market in Europe 2014-2019 ($ billions)
Exhibit 8: Interconnect Market in North America 2014-2019 ($ billions)
Exhibit 9: Interconnect Market in RoW 2014-2019 ($ billions)
Exhibit 10: Market Segmentation by Product 2014
Exhibit 11: Market Segmentation by Product 2014-2019
Exhibit 12: Market Segmentation by Product 2019
Exhibit 13: Market Segmentation by Product: Cable Assembly 2014-2019 ($ billions)
Exhibit 14: Market Segmentation by Product: Cable Assembly 2014-2019 ($ billions)
Exhibit 15: Market Segmentation by End-users 2014-2019
Exhibit 16: Market Segmentation by End-user: Automotive 2014-2019 ($ billions)
Exhibit 17: Market Segmentation by End-user: IT 2014-2019 ($ billions)
Exhibit 18: Market Segmentation by End-user: Telecommunication 2014-2019 ($ billions)
Exhibit 19: Market Segmentation by End-user: Industrial 2014-2019 ($ billions)
Exhibit 20: Market Segmentation by End-user: Others 2014-2019 ($ billions)
Exhibit 21: Smartphone Unit Sales (millions)
Exhibit 22: Mobile Data Traffic (exabytes)
Exhibit 23: Worldwide Electric and Hybrid Vehicle Production Units (millions)
Exhibit 24: Amphenol: Business Segmentation by Revenue 2013
Exhibit 25: Amphenol: Business Segmentation by Revenue 2012 and 2013 (US$ million)
Exhibit 26: Amphenol: Geographical Segmentation by Revenue 2013
Exhibit 27: Hon Hai : Geographical Segmentation by Revenue 2013
Exhibit 28: Molex: Market Segmentation by Revenue 2013
Exhibit 29: Molex: Product Segmentation by Revenue 2013
Exhibit 30: Molex: Product Segmentation by Revenue 2012 and 2013 (US$ million)
Exhibit 31: Molex: Geographical Segmentation by Revenue 2013
Exhibit 32: TE Connectivity: Business Segmentation by Revenue 2013
Exhibit 33: TE Connectivity: Business Segmentation by Revenue 2012 and 2013 (US$ billion)
Exhibit 34: TE Connectivity: Geographical Segmentation by Revenue 2013
Exhibit 35: Yazaki: Key Offerings
Exhibit 36: Yazaki: Net Sales 2012 and 2013 (US$ billion)
Exhibit 37: Yazaki: Geographical Segmentation by Revenue 2014
...
Publisher Name : Technavio

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