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Global Bonding Wire packaging material market 2016-2020

Category : Semiconductor and Electronics  | Published Date : Jun-2016 | Pages : 58
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About the Bonding Wire Packaging Material Market
 
Bonding wires can be made up of gold, copper, silver, and aluminum. The diameter of the wire ranges from 15 micrometer to several hundred micro-meters for high-powered applications. Bonding wires made of gold dominated the bonding wire packaging material market for decades. However, the industry is shifting toward the use of copper and other materials, which include silver as the inew addition since 2010. The market share of gold in terms of volume used for bonding wire was more than 95% in 2007 and dropped to 40% in 2015 due to rising prices of gold. The remaining volume was replaced by copper and silver in 2015.
 
Technavio’s analysts forecast the global bonding wire packaging material market will generate revenues of USD 2.9 billion in 2020. 
 
Covered in this report 
The report covers the present scenario and the growth prospects of the global bonding wire packaging material market for 2016-2020. To calculate the market size, the report considers revenue generated from the consumption of bonding wires for packaging materials.
 
The market is divided into the following segments based on geography: 
• APAC
• Europe
• North America
• ROW
 
Technavio's report, Global Bonding Wire Packaging Material Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the operating in this market. 
 
Key vendors 
• TANAKA Precious Metals
• Heraeus Deutschland
• California Fine Wire
• MK Electron 
 
Other prominent vendors
• AMETEK
• EMMTECH
• Inseto
• Palomar Technologies
• RED Micro Wire
• SHINKAWA
• Sumitomo Metal Mining
• Tatsuta Electric Wire & Cable
 
Market driver 
• Rising need for miniaturization
• For a full, detailed list, view our report 
 
Market challenge 
• Migration to flip chip packaging technology
• For a full, detailed list, view our report 
 
Market trend 
• Migration to smaller diameter wires
• For a full, detailed list, view our report 
 
Key questions answered in this report 
• What will the market size be in 2020 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors? 
 
You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.


PART 01: Executive summary
• Highlights
PART 02: Scope of the report
• Definition
• Source year and forecast period
• Market coverage
• Market size computation
• Market segmentation
• Geographical coverage
• Vendor segmentation
• Common currency conversion rates
• Top vendor offerings
PART 03: Market research methodology
• Research methodology
• Economic indicators
PART 04: Introduction
• Key market highlights
PART 05: Market landscape
• Global semiconductor market overview
• Wafer-level manufacturing equipment categories
• Market overview
• Market size and forecast
• Five forces analysis
PART 06: Market segmentation by material type
• Global bonding wire packaging material market by material type 2015
• Global bonding wire packaging material market by material type 2020
• Global bonding wire packaging material market by gold
• Global bonding wire packaging material market by PCC
• Global bonding wire packaging material market by copper
• Global bonding wire packaging material market by silver
PART 07: Geographical segmentation
• Global bonding wire packaging material market by geography 2015
• Global bonding wire packaging material market by geography 2020
• APAC
• North America
• Europe
• ROW
PART 08: Key leading countries
• Key leading countries in global bonding wire packaging material market
PART 09: Summary of key figures
PART 10: Market drivers
• Growing transition to copper wire
• Rising need for miniaturized semiconductor devices
PART 11: Impact of drivers
PART 12: Market challenges
• Limitations of copper wire
• Migration to flip chip packaging technology
PART 13: Impact of drivers and challenges
PART 14: Market trends
• Silver bonding wire as upcoming alternative
• Migration to smaller diameter wires
PART 15: Vendor landscape
• Competitive scenario
• Other prominent vendors
PART 16: Appendix
• List of abbreviations
PART 17: Explore Technavio
List of Exhbitis
Exhibit 01: Segmentation of global bonding wire packaging material market
Exhibit 02: Key regions
Exhibit 03: Common currency conversion rates
Exhibit 04: Product offerings
Exhibit 05: Chemical composition of semiconductor materials
Exhibit 06: Top ten semiconductor vendors 2015
Exhibit 07: Global semiconductor market structure 2015
Exhibit 08: Global semiconductor market structure 2015
Exhibit 09: Global semiconductor market trend 1990-2015 ($ billions)
Exhibit 10: Semiconductor IC manufacturing process
Exhibit 11: Front-end chip formation steps
Exhibit 12: Back-end chip formation steps
Exhibit 13: Wafer-level manufacturing equipment categories
Exhibit 14: Requirements of manufacturing equipment
Exhibit 15: Semiconductor industry value chain
Exhibit 16: Global bonding wire packaging material market 2015-2020 ($ billions)
Exhibit 17: Five forces analysis
Exhibit 18: Global bonding wire packaging material market by material type 2015
Exhibit 19: Global bonding wire packaging material market by material type in 2020
Exhibit 20: Global bonding wire packaging material market by gold ($ millions)
Exhibit 21: Global bonding wire packaging material market by PCC ($ billions)
Exhibit 22: Global bonding wire packaging material market by copper ($ millions)
Exhibit 23: Global bonding wire packaging material market by silver ($ millions)
Exhibit 24: Segmentation of silver wire application
Exhibit 25: Global bonding wire packaging material market by geography 2015
Exhibit 26: Global bonding wire packaging material market by geography 2020
Exhibit 27: Bonding wire packaging material market in APAC 2015-2020 ($ billions)
Exhibit 28: Bonding wire packaging material market in North America 2015-2020 ($ millions)
Exhibit 29: Bonding wire packaging material market in Europe 2015-2020 ($ millions)
Exhibit 30: Bonding wire packaging material market in ROW 2015-2020 ($ millions)
Exhibit 31: Key leading countries in global bonding wire packaging material market 2015
Exhibit 32: Key leading countries in global bonding wire packaging material market 2020
Exhibit 33: Material-type segments: Year-over-year revenue comparison ($ millions)
Exhibit 34: Geographical segments: Year-over-year revenue comparison ($ millions)
Exhibit 35: Impact of drivers
Exhibit 36: Impact of drivers and challenges
Exhibit 37: Other prominent vendors
...
Publisher Name : Technavio

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